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SEMI T2-0298 (Reapproved 1104) SPECIFICATION FOR MARKING OF WAFERS WITH A TWO- DIMENSIONAL MATRIX CODE SYMBOL This specificati on was technically approved by the Global Trac eability Committee and is the direct responsib…

SEMI T1-95 © SEMI 1993, 2003 10

Figure R1-1

Code Field Locations for Flatted Wafers (See Tables R1-1 and 5.)

Figure R1-2

Code Field Locations for Notched Wafers (See Tables R1-2 and 5.)

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SEMI T2-0298

(Reapproved 1104)

SPECIFICATION FOR MARKING OF WAFERS WITH A TWO-

DIMENSIONAL MATRIX CODE SYMBOL

This specification was technically approved by the Global Traceability Committee and is the direct

responsibility of the North American Traceability Committee. Current edition approved by the North

American Traceability Committee on July 11, 2004. Initially available at www.semi.org September 2004; to

be published November 2004. Originally published in 1993; last published February 1998.

1 Purpose

1.1 This specification is intended to provide a marking

symbology that can be used to mark silicon wafers with

minimum intrusion into the fixed quality area of the

wafer.

2 Scope

2.1 This specification defines the geometric and spa-

tial relationships and content (including the error check-

ing and correcting code) of a two-dimensional (2-D),

machine-readable, binary matrix code symbol for front

surface marking of wafers of silicon which comply with

SEMI M1, SEMI M2, or SEMI M11, and other mater-

ials with diameters of 125 to 200 mm. This specifica-

tion allows for consistency of all wafer marking per-

formed by wafer manufacturers. It may be used in con-

junction with, or as an alternative to, the alphanumeric

marking codes specified in SEMI M12 and SEMI M13

or a front surface bar code like that specified in SEMI

T1.

2.2 Although this specification does not specify the

marking techniques that may be employed when com-

plying with its requirements, it is assumed that the sym-

bol will be obtained by laser scribing individual dots.

2.3 The 2-D matrix code is applicable to a broad range

of wafer products, including epitaxial wafers, SOI wa-

fers, and unpatterned or patterned polished wafers. The

format and algorithms of this code are based on the Da-

ta Matrix two-dimensional symbology specified in AIM

International Symbology Specification - Data Matrix.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Referenced Standards

3.1 SEMI Standards

SEMI AUX001 — List of Vendor Identification Codes

SEMI M1 — Specifications for Polished Monocrys-

talline Silicon Wafers

SEMI M2 — Specification for Silicon Epitaxial Wafers

for Discrete Device Applications

SEMI M11 — Specifications for Silicon Epitaxial

Wafers for Integrated Circuit (IC) Applications

SEMI M12 — Specification for Serial Alphanumeric

Marking of the Front Surface of Wafers

SEMI M13 — Specification for Alphanumeric Marking

of Silicon Wafers

SEMI T1 — Specification for Back Surface Bar Code

Marking of Silicon Wafers

3.2 AIM International Technical Specification

AIM International Symbology Specification - Data

Matrix

3.3 ANSI Standard

ANSI X3.4 — American Standard Code for

Information Interchange (ASCII)

NOTE 1: This standard is equivalent to ISO 646, Information

Processing - ISO 7-bit Coded Character Set for Information

Processing.

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

1 AIM International Inc., 125 Warrendale-Bayne Road, Warrendale,

PA 15086, +1 724 934 4470, Fax: +1 724 934 4495,

http://www.aimglobal.org/

2 American National Standards Institute, Headquarters: 1819 L

Street, NW, Washington, DC 20036, USA. Telephone: 202.293.8020;

Fax: 202.293.9287, New York Office: 11 West 42nd Street, New

York, NY 10036, USA. Telephone: 212.642.4900; Fax: 212.398.002,

Website: www.ansi.org

SEMI T2-0298 © SEMI 1993, 2004 1

4 Terminology

4.1 Definitions

4.1.1 binary values — a dot in the wafer surface

indicates the binary value 1. The absence of a dot, or a

smooth surface surrounding a cell center point,

indicates the binary value 0.

4.1.2 border column — the outermost column of a data

matrix code symbol.

4.1.3 border row — the outermost row of a data matrix

code symbol.

4.1.4 cell center point, of an array — the point at

which the centerline of a row intersects the centerline of

a column.

4.1.5 cell spacing, of an array — the (equal) vertical or

horizontal distance between the cell center points of

contiguous cells.

4.1.6 cell, of a data matrix code symbol — the area

within which a dot may be placed to indicate a binary

value.

4.1.7 center line, of a row or column — the line

positioned parallel to, and spaced equally between, the

boundary lines of the row or column.

4.1.8 central area, of a cell — the area enclosed by a

circle centered at the cell center point; used by code

readers to sense the binary value of the cell.

4.1.9 data matrix code symbol — a two-dimensional

array of square cells arranged in contiguous rows and

columns.

4.1.10 dot — a localized region with a reflectance

which differs from that of the surrounding surface.

NOTE 2: To assure reading efficiency, a minimum contrast

of 30% is required between the reflectance value of a dot and

the surrounding wafer surface. Various densitometers can

provide such measurements nondestructively.

4.1.11 dot misalignment, within a cell — the distance

between the physical center point of a dot and the cell

center point.

4.1.12 reference point, of a data matrix code symbol —

the physical center point of a corner cell common to a

border row and border column, used to identify the

physical location of the symbol on the object being

marked with the symbol.

NOTE 3: The reference point is at a fixed location on the

object. Different cells may be chosen as the reference point,

depending on the desired orientation of the symbol on the

object and the size variability of the symbol. The particular

cell to be used as the reference point must be specified for

each application.

5 Ordering Information

5.1 Purchase orders for wafers furnished to this

specification shall include the following items:

5.1.1 Message Characters

5.1.1.1 Quantity (10 to nn, where nn is 11–31 and de-

pends on the character set to be encoded (see Table 1).

5.1.1.2 Content of Message Characters 11 and up, if

present.

5.1.2 Cell Spacing (125 or 150 µm).

6 Requirements

6.1 Shape and Size of the Matrix Code Symbol

6.1.1 Each square matrix code symbol shall be

composed of an equal even number (from 16 to 20) of

rows and columns of equally spaced square cells. Cell

spacing shall be either 125 or 150 µm (see Table 2, and

Figures 1 and 2).

6.1.2 Dot Size — The nominal shape of the dot

produced in the matrix may be circular or square. Its

dia-meter or edge length (after polishing) shall be 100 ±

10 µm.

6.2 Border Rows and Columns (see Figure 3)

6.2.1 One border row and one border column shall

contain a dot in each cell. These are identified as the

primary border row and the primary border column.

These are used by the code reader to determine the

reference point and orientation of the matrix.

6.2.2 The opposing (secondary) border row and

column shall contain dots in alternating cells.

6.2.3 The reference point of the symbol shall be the

physical centerpoint of the cell common to the primary

border row and the secondary border column.

6.2.4 The maximum dot misalignment within a cell is

20 µm. This ensures that a minimum size dot covers a

cell central area of radius 25 µm (see Figure 4).