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SEMI S14-0704 © SEMI 2000, 2004 1 SEMI S14-0704 SAFETY GUIDELINES FOR FI RE RISK ASSESSMENT AND MITIGATION FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT These safety guidelin es were technically approve d by the Global Envir…

SEMI S13-0305 © SEMI 1998, 2005 20

NOTE 2: Byproducts vary with conditions such as exhaust duct diameter/length/volume, temperature, exhaust gas velocity,

chamber volume/pressure/configuration, maintenance method/cycle, and purge frequency.

R8-2.2.5 The decommissioning procedure should address any hazards of ionizing radiation sources, if they are

present, and address safe removal and storage procedures for these sources.

R8-2.2.6 Specific hazards known to be the result of failures during operation (e.g., mercury vapor lamps create

mercury deposits when a lamp bursts) should be described.

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant

literature, respecting any materials or equipment mentioned herein. These standards are subject to change without

notice.

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respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights are entirely their own responsibility.

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SEMI S14-0704 © SEMI 2000, 2004 1

SEMI S14-0704

SAFETY GUIDELINES FOR FIRE RISK ASSESSMENT AND

MITIGATION FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT

These safety guidelines were technically approved by the Global Environmental Health and Safety

Committee and are the direct responsibility of the North American Environmental Health and Safety

Committee. Current edition approved by the North American Regional Standards Committee on April 22,

2004. Initially available at www.semi.org June 2004; to be published July 2004. Originally published

February 2000; previously published November 2003.

NOTICE: Paragraphs entitled “NOTE” are not an

official part of this document and are not intended to

modify or supersede the official Safety Guideline.

These have been supplied by the Task Force to enhance

usage of the Safety Guideline.

NOTICE: The intent of the task force that produced

this document is that conformance to the “should”

provisions of this guideline comprises conformance

with this guideline.

1 Purpose

1.1 This document provides considerations to the

manufacturers of semiconductor manufacturing

equipment that will assist them in assessing and

mitigating the risk to equipment and product associated

with fire and combustion by-products.

1.2 Although these guidelines are written in the form

of an assessment tool, they are intended for use

throughout the design and development of

semiconductor manufacturing equipment.

1.3 These guidelines may also be used by the users of

such equipment and by other interested parties to assess

and compare the described risks of various equipment

designs or in the design and evaluation of ancillary

equipment or modifications.

1.4 These guidelines are not intended to specify which

techniques (e.g., selection of materials or detection

systems) are to be used to mitigate fire risk. These

guidelines do, however, recommend that the traditional

risk management hierarchy of elimination, engineering

controls, administrative controls, warning and work

practices be followed.

1.5 The appropriate application of these guidelines will

result in a report which identifies, analyzes and assesses

residual fire risks.

2 Scope

2.1 These guidelines apply to equipment used to

manufacture, measure, assemble, and test semiconduc-

tor products which is intended to be located in clean-

rooms used for semiconductor manufacturing processes

or areas within their recirculation airstream. They

apply to all of the components of the equipment, as

described herein.

NOTE 1: This document is not limited to the structural or

large-area components of equipment.

2.2 This document applies to fire risks originating

within the subject equipment that may result in damage

to it, other equipment, products, or the facility.

2.3 This document identifies considerations for

assessing the fire risk of semiconductor manufacturing

equipment, means of categorizing the risks, and means

of mitigating the risks.

NOTICE: This safety guideline does not purport to

address all of the safety issues associated with its use.

It is the responsibility of the users of this safety

guideline to establish appropriate safety and health

practices and determine the applicability of regulatory

or other limitations prior to use.

3 Limitations

3.1 These guidelines do not establish acceptance

criteria for residual risk.

3.2 This document recommends a hierarchy of

approaches (e.g., elimination of a hazard is preferable

to an engineering control) but neither prescribes which

specific risk mitigation methods (e.g., change of

material or elimination of an ignition source) are to be

used nor ranks their relative merit.

3.3 These guidelines apply to the protection of

property; they do not apply to the protection of

personnel.

NOTE 2: Protection of personnel from fire risk is within the

scope of SEMI S2.

SEMI S14-0704 © SEMI 2000, 2004 2

3.4 This document applies to equipment in its scope

when the equipment is used in the environment

specified by the equipment supplier. Specifically, it

does not apply to the behavior of equipment when it is

subject to an external fire.

3.5 This document is not intended to be used to assess

compliance with regulatory requirements, nor is it

intended to be adopted as regulation.

3.6 Because of these limitations, it may be appropriate

for purchasers of equipment to specify the applicable

codes and standards and the acceptable level of residual

risk.

NOTE 3: Applicable regional, and national codes, inter-

national regulations, and the equipment manufacturer’s and

user’s requirements must also be considered. When a conflict

exists, the regional and national codes take precedence.

4 Referenced Standards

4.1 SEMI Standards

SEMI E10 — Specification for Definition and

Measurement of Equipment Reliability, Availability,

and Maintainability (RAM)

SEMI E70 — Guide for Tool Accommodation Process

SEMI S2 — Environmental, Health, and Safety

Guideline for Semiconductor Manufacturing Equipment

SEMI S7 — Safety Guidelines for Environmental,

Safety, and Health (ESH) Evaluation of Semiconductor

Manufacturing Equipment

SEMI S10 — Safety Guideline for Risk Assessment

and Risk Evaluation Process

4.2 NFPA Documents

National Fire Protection Association: NFPA 12 —

Standard on Carbon Dioxide Fire Extinguishing

Systems

National Fire Protection Association: NFPA 13 —

Standard for the Installation of Sprinkler Systems

National Fire Protection Association: NFPA 72 —

National Fire Alarm Code

National Fire Protection Association: NFPA 2001 —

Standard on Clean Agent Fire Extinguishing Systems

4.3 Factory Mutual Document

Factory Mutual Research Corp.

Standard 4910 — Clean

Room Materials Flammability Test Protocol

1 National Fire Protection Association, 1 Batterymarch Park, Quincy,

MA 02269, Website: www.nfpa.org

2 Factory Mutual Research Corp., 1151 Boston-Providence Turnpike,

Norwood, MA 02062, phone: 781-762-4300, fax: 781-762-9375,

website: http//www.factorymutual.com

4.4 Underwriters Laboratory Documents

Underwriters Laboratory Standard 94 — Tests for

Flammability of Plastic Materials for Parts in Devices

and Appliances

Underwriters Laboratories Standard 746A — Polymeric

Materials - Short Term Property Evaluations

Underwriters Laboratories Standard 746B — Polymeric

Materials - Long Term Property Evaluations

Underwriters Laboratories Standard 746C — Polymeric

Materials - Use in Electrical Equipment Evaluations

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

5 Terminology

5.1 Definitions

5.1.1 accredited testing laboratory — an independent

organization dedicated to the testing of components,

devices, or systems; competent to perform evaluations

based on established safety standards and recognized by

a governmental or regulatory body. [SEMI S2]

5.1.2 cleanroom — a confined area in which the

humidity, temperature, particulate matter, and

contamination are precisely controlled within specified

parameters. [SEMI E70]

5.1.3 combustible liquid — a liquid that will burn and

has a flash point at or above 37.8° C (100° F).

5.1.3.1 For the purpose of this guideline, a combustible

liquid, when used by a system capable (under normal or

single-fault conditions) of heating it above its flash

point, is considered a flammable liquid.

5.1.4 combustible material — for the purpose of this

document, a combustible material is any material which

does not meet the definitions in this section for

noncombustible materials.

NOTE 4: A list of criteria, guidelines and standards that may

be used to evaluate the fire properties of materials is included

in Appendix 2.

5.1.5 downtime — the time when the equipment is not

in a condition, or is not available, to perform its

intended funtion. It does not include any portion of non-

scheduled time. [SEMI E10]

NOTE 5: Downtime may be considered according to the

definition of SEMI E10, assuming commited availability of

the parts in question.

5.1.6 flammable liquid — a liquid having a flash point

below 37.8° C (100° F).

3 Underwriters Laboratory, 333 Pfingsten Rd, Northbrook, IL 60062