semi合集-English.pdf - 第7294页
SEMI MF951-0305 © SEMI 2003, 2005 5 8.4.3 Position spacing shall b e in 10 cm steps, center-to-center, continuing to within 5 mm of the sample center. 8.4.4 Position numbering b egins at the edge (1 ) an d is sequenced t…
SEMI MF951-0305 © SEMI 2003, 2005 4
Figure 2
Test Plan B
8.3 Test Plan C
8.3.1 This test plan consists of measurements at each of the five measurement positions defined in Plan B of both
SEMI MF81 and DIN 50435 and in both SEMI MF533 and DIN 50441/1.
8.3.2 Edge position tolerances are ±1 mm; center position shall be within 3 mm of the intersection of any two
diameters which are at least 45° apart (see Figure 3).
Figure 3
Test Plan C
8.4 Test Plan D
8.4.1 This test plan consists of measurements at a series of points between the edge and center of the wafer along
the diameter parallel with the major flat (or perpendicular to the notch axis) (see Figure 4).
8.4.2 The first position, nearest sample periphery, shall be located in the same manner as Position A2 of Plan A (see
Figure 1).
SEMI MF951-0305 © SEMI 2003, 2005 5
8.4.3 Position spacing shall be in 10 cm steps, center-to-center, continuing to within 5 mm of the sample center.
8.4.4 Position numbering begins at the edge (1) and is sequenced toward the center position.
8.4.5 If a minor flat is located near Position 1, begin sequencing at the opposite edge.
Figure 4
Test Plan D
9 Procedure
9.1 Select one of the test plans defined in §8.
9.2 For referee tests, mark the side of the test slice facing the spectrophotometer infrared source in a noninterfering
manner.
9.3 Place test slice in the fixture apparatus and position in accordance with the selected test plan.
9.4 If the slice thickness is not known for each test site of the selected test plan to ± 0.5% of the nominal slice
thickness, measure the slice thickness at each test site in accordance with SEMI MF533 or DIN 504441/1. Record
the measured or known thicknesses.
9.5 Direct the spectrophotometer infrared beam through the 7 mm aperture located adjacent to the test slice. Move
the test slice, relative to the stationary beam and aperture, to the first test site of the selected plan. Measure and
record the oxygen content at this test site.
9.6 After making the first measurement, move the test slice, relative to the stationary beam and aperture, to the
remaining test sites of the selected plan. Measure and record oxygen content at each test site.
9.6.1 Keep all controllable instrument parameters constant during a test sequence (number of scans, temperature,
reference slice, resolution, etc.).
9.7 For referee tests, repeat the test plan sequence four additional times.
10 Calculations
10.1 Calculate the radial oxygen variation (ROV), in percent, for the sample plan selected:
10.1.1 Test Plan A — Two Positions (Figure 1):
100
ValueCenter
ValueCenter Value Edge
ROV (1)
SEMI MF951-0305 © SEMI 2003, 2005 6
10.1.2 Test Plan B — Three Positions (Center and Two Edges, Figure 2):
100
ValueCenter
ValueCenter Values) Edge of (Avg
ROV (2)
10.1.3 Test Plan B1 — Five Positions (Figure 2):
10.1.3.1 ROV is the larger of the values found from Equation 2 and from the following:
100
ValueCenter
ValueCenter Values) R/2 of (Avg
ROV
(3)
10.1.4 Test Plan C — Five Positions (Figure 3):
100
ValueCenter
ValueCenter Values) Edge of (Avg
ROV
(4)
10.1.5 Test Plan D — Multiple Positions (Figure A1-4):
100
ValueCenter
Value Low IndividualValue)High Individual
ROV
(5)
NOTE 2: All edge positions are located from the center of the IR beam to the slice edge. All other non-center positions are
located such that the center of the IR beam is located as given by the dimensions in Figures 1–4.
10.2 For referee tests, calculate the ROV for each of the five determinations and calculate the average ROV as
follows:
5
54321
ROVROVROVROVROV
ROV
(6)
where ROV
i
is the ROV calculated from the i
th
measurement.
11 Report
11.1 Report the following information:
11.1.1 Date, operator, and affiliation,
11.1.2 Description of test method used,
11.1.3 Number of slices and their identification,
11.1.4 Sample descriptions including nominal resistivity, thickness, diameter, and surface finishes,
11.1.5 Sample plan used,
11.1.6 Instrument factors,
11.1.6.1 Manufacturer/model,
11.1.6.2 Resolution,
11.1.6.3 Apertured beam size,
11.1.6.4 Differential or air reference method,
11.1.6.5 Measurement wavelength region,
11.1.7 ROV results, and
11.1.8 Any unusual relevant conditions.