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SEMI G81-0703 © SEMI 2000, 2003 1 SEMI G81-0703 SPECIFICATION FOR MAP DATA I TEMS This specification was technically approved by the Gl obal Auto mated Test Equipm ent Committee and is the direct responsibility of the No…

SEMI G80-0200 © SEMI 200033

A4.4 Use of a Loop-Through Sampling Head

A4-4.1 This is an alternate approach to measured RMS

signal jitter. The input signal is routed through the loop-

through sampling head where it is sampled and sent to

the output of the sampling head. The head output is

connected to the oscilloscope trigger. (See Figure A4-

3.)

A4-4.2 What is Observed When Making MS And MI

Measurements — This dialog is meant to provide

further clarification for making jitter measurements.

This is an example that applies to a jitter measurement

using an oscilloscope with an inherent oscilloscope

delay of 20ns. The signal frequency is 100MHz (period

of 10ns ). The semi-rigid coax delay is set to the

inherent oscilloscope delay of 20ns.

A4-4.3 Measured RMS Signal Jitter, MS — For the

MS measurement the observed edge occurs subsequent

to the edge that triggered the oscilloscope:

This pulse triggers the oscilloscope.

Observed Edge –– The pulse that is

displayed on the oscilloscope is not the

same pulse that triggered the oscilloscope.

Trigger:

Signal:

Figure A4-4

Measured RMS Signal Jitter, MS

A4-4.4 The observed edge depends upon the signal

frequency; thus what is displayed is subsequent to the

trigger pulse permitting signal jitter to be observed.

A4-4.5 Measured RMS Instrumentation Jitter, MI —

For the MI measurement the observed edge is the same

edge that triggered the oscilloscope.

–1

This pulse triggers the oscilloscope.

Observed Edge –– The pulse that is

displayed on the oscilloscope is the same

pulse that triggered the oscilloscope.

–2

Trigger:

Signal:

Figure A4-5

Measured RMS Instrumentation Jitter, MI

A4-4.6 There is no repetitive aspect of the signal, thus

whatever jitter you observe is strictly instrumentation

jitter.

A4-4.7 Summary –– Jitter is only observable for a

periodic signal or repetitive edge. Thus when MS

measurements are made signal jitter is observed

because a subsequent or repetitive signal is displayed

(in addition to instrumentation jitter). When MI

measurements are made the input signal is delayed such

that you see the same edge that trigger the oscilloscope.

That creates a non-repetitive or non-periodic occurrence

of the observed signal, thus the jitter observed is strictly

due to the instrumentation.

NOTICE: SEMI makes no warranties or

representations as to the suitability of the standards set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer’s instructions, product labels,

product data sheets, and other relevant literature

respecting any materials mentioned herein. These

standards are subject to change without notice.

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takes no position respecting the validity of any patent

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SEMI G81-0703 © SEMI 2000, 2003 1

SEMI G81-0703

SPECIFICATION FOR MAP DATA ITEMS

This specification was technically approved by the Global Automated Test Equipment Committee and is the

direct responsibility of the North American Automated Test Equipment Committee. Current edition approved

by the North American Regional Standards Committee on March 12, 2003. Initially available at

www.semi.org May 2003; to be published July 2003. Originally published October 2000; previously

published March 2003.

1 Purpose

1.1 This document describes the data items that relate

to electronic substrate mapping.

2 Scope

2.1 This document applies only to substrate map data

items.

2.2 This document does not address the transmission,

file naming conventions, storage or archiving of

substrate maps.

2.3 The specification of which data items are optional

and which are required is not specified in this

document.

2.4 The size of each data item described in this

document is maximum size. The actual size may be

further restricted by an application document.

2.5 The order of the data items is not restricted in this

document. The order of the data items may be restricted

by an application document.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Limitations

3.1 There are no known limitations within the defined

scope.

4 Referenced Standards

4.1 SEMI Standards

SEMI E5 — SEMI Equipment Communications

Standard 2 Message Content (SECS-II)

SEMI T9 — Specification for Marking of Metal Lead-

Frame Strips with a Two-Dimensional Data Matrix

Code Symbol

4.2 IEEE Standards

IEEE 754-1985 — IEEE Standard for Binary Floating–

Point Arithmetic

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

5 Terminology

5.1 Definitions

5.1.1 bottom side — the bottom side of the substrate as

defined in the corresponding Appendix (Appendix 1, 2,

or 3).

5.1.2 device — the unit to which the device status code

in the map is assigned including, but not limited to: die,

multi-chip modules and packages.

5.1.3 map — a two-dimensional array of bin codes

derived from electrical test data of a substrate

including, but not limited to: wafer, tray, strip, or tape.

5.1.4 substrate — any carrier of a two-dimensional

array of devices including, but not limited to: wafers,

trays, strips, tape, panels, or boards.

5.1.5 top side — the top side of the substrate as defined

in the corresponding Appendix for that substrate

(Appendix 1, 2, or 3).

6 Requirements

6.1 This document does not define format of each data

item specified in the following chapter. In order to

implement this specification, it requires standardized

and/or specific format definition documents.

Standardized format definition documents are those

generic, application specific or equipment specific

specification, supplied by SEMI. They may be format

specification, static file specification or communication

specification, e.g. SEMI E5. Specific format definition

documents may de defined by supplier and user.

1 Institute of Electrical and Electronics Engineers, IEEE Operations

Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, New Jersey

08855-1331, USA. Telephone: 732.981.0060; Fax: 732.981.1721.

Website www.ieee.org.

6.2 Also this document does not define communication protocol at all. If an implementation requires transfer data

items defined in the following chapter, it is necessary to prepare a custom communication protocol document or to

comply with the appropriate SEMI communication standards.

6.3 This document places no special requirements on the transmission, file naming conventions, storage, or

archiving of substrate maps.

7 Description

7.1 The substrate map data item specifications defined in this document are shown in Table 2. The columns in this

table are described in the following sections.

7.1.1 Item Name Column — the name by which the data item is referenced.

7.1.2 Data Type Column — the type of the data as defined in Table 1.

Table 1 Data Types and Sizes

Type Size Definition

String 0–32767 A string of ASCII characters from zero to “Size” characters in length.

Integer 1,2,4 An integer value that may be represented by “Size” bytes. E.g., if Size = 2 then the value may

be –32768 to 32767.

Float 4 IEEE single-precision 32-bit floating point type [IEEE 754-1985]

7.1.2.1 Generic data type definitions are used so that the data item definitions may be shared by several other

standards, which may have their own distinct data type representations.

7.1.3 Size Column — the maximum number of characters that may be used to represent the data.

7.1.4 Description Column — describes what the data item is and what value restrictions it has.

7.2 Coordinate System Conventions

7.2.1 Whenever reference is made to rows, columns, X or Y they are defined as follows.

7.2.2 The X axis is the horizontal axis from left to right when the substrate is rotated according to [Orientation] in

Table 2. Columns increase along the X axis. Column zero is the column just before the left (or right, depending on

OriginLocation) column containing measured devices.

7.2.3 The Y axis is the vertical axis from bottom to top when the substrate is rotated according to [Orientation] in

Table 2. Rows increase along the Y axis. Row zero is the row just before the extreme top (or bottom depending on

OriginLocation) row containing measured devices.

7.2.4 Columns increase along the X-axis. Rows increase along the Y-axis.

Table 2 Substrate Map Data Items

Item Name Data Type Size Description

FormatRevision String 256 Specifies the exact name and revision of the format used to represent substrate map

data. This field can be used by a parser to automatically determine the format of the

remaining substrate map data.

ProductId String 256 Product identifier

LotId String 32 Production lot identifier for this data.

Orientation Integer 2 The orientation of the substrate in relation to the map data.

This variable will increase in the right (clockwise) direction from 0° .

This item may be used to specify that the map data be rotated. Since the map data is

rectangular, only the values 0, 90, 180, and 270 are allowed in that case.

WaferSize Integer 2 Diameter of Wafer in millimeters.

DeviceSizeX Float 4 Device size on X axis in microns

DeviceSizeY Float 4 Device size on Y axis in microns