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SEMI G72.1-099 7 © SEMI 1997 8 Des ign No. PBD0001 SEMI Standar d BGA Design Li brary Revision Initi al Date 6/20/96 Page 2 of 8 PBGA Wire Bond P ad (*1) Solder Ball Location Die W ire Bond Pad I/O Name (& Comments) …

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SEMI G72.1-0997 © SEMI 19977
Design No.
PBD0001 SEMI Standard BGA Design Library Revision Initial
Date
6/20/96
Page
2 of 8
PBGA Wire
Bond Pad (*1)
Solder Ball
Location
Die Wire Bond
Pad I/O Name (& Comments) (*4)
Pkg.
Side (*1) Notes
37 N2 1
38 N3 1
w/b ring 1 N4 3
w/b ring 1 N8 3,5
w/b ring 1 N9 3,5
w/b ring 1 N10 3,5
w/b ring 1 N11 3,5
w/b ring 1 N12 3,5
w/b ring 1 N13 3,5
w/b ring 1 N17 3
134 N18 3
135 N19 3
136 N20 3
39 P1 1
40 P2 1
42 P3 1
45 P4 1
128 P17 3
131 P18 3
132 P19 3
133 P20 3
41 R1 1
43 R2 1
46 R3 1
w/b ring 2 R4 2
w/b ring 2 R17 2
127 R18 3
129 R19 3
130 R20 3
44 T1 1
47 T2 1
49 T3 1
52 T4 1
121 T17 3
124 T18 3
125 T19 3
126 T20 3
48 U1 1
50 U2 1
53 U3 1
w/b ring 1 U4 3
63 U5 2
w/b ring 2 U6 2
70 U7 2
SEMI G72.1-0997 © SEMI 1997 8
Design No.
PBD0001 SEMI Standard BGA Design Library Revision Initial
Date
6/20/96
Page
2 of 8
PBGA Wire
Bond Pad (*1)
Solder Ball
Location
Die Wire Bond
Pad I/O Name (& Comments) (*4)
Pkg.
Side (*1) Notes
w/b ring 1 U8 3
79 U9 2
w/b ring 2 U10 2
89 U11 2
93 U12 2
w/b ring 1 U13 3
103 U14 2
w/b ring 2 U15 2
110 U16 2
w/b ring 1 U17 3
120 U18 3
119 U19 3
123 U20 3
51 V1 1
54 V2 1
56 V3 1
62 V4 2
66 V5 2
69 V6 2
73 V7 2
76 V8 2
80 V9 2
84 V10 2
88 V11 2
92 V12 2
96 V13 2
100 V14 2
104 V15 2
107 V16 2
111 V17 2
114 V18 2
118 V19 3
122 V20 3
55 W1 1
57 W2 1
59 W3 2
61 W4 2
67 W5 2
71 W6 2
74 W7 2
77 W8 2
81 W9 2
83 W10 2
87 W11 2
SEMI G72.1-0997 © SEMI 19979
Design No.
PBD0001 SEMI Standard BGA Design Library Revision Initial
Date
6/20/96
Page
2 of 8
PBGA Wire
Bond Pad (*1)
Solder Ball
Location
Die Wire Bond
Pad I/O Name (& Comments) (*4)
Pkg.
Side (*1) Notes
91 W12 2
95 W13 2
98 W14 2
101 W15 2
105 W16 2
108 W17 2
112 W18 2
115 W19 2
117 W20 3
58 Y1 1
60 Y2 2
64 Y3 2
65 Y4 2
68 Y5 2
72 Y6 2
75 Y7 2
78 Y8 2
82 Y9 2
85 Y10 2
86 Y11 2
90 Y12 2
94 Y13 2
97 Y14 2
99 Y15 2
102 Y16 2
106 Y17 2
109 Y18 2
113 Y19 2
116 Y20 2
NOTES:
*1. Please refer to Notes column for explanations of wirebond (w/b) rings. PBGA Wirebond Pads are numbered counter
clockwise, starting with Pad #1 in the upper left hand corner. Please refer to Top View of package for package side #1, 2, 3, or 4
(Figure 1).
*2. Metallized wirebond (w/b) ring 2 surrounds die attach area for wirebonding to electrically common die pads and electrical
connection with solder balls designated by 2nd Electrical Group symbol on BGA Design Library Drawing (Figure 1).
*3. Metallized wirebond (w/b) ring 1 surrounds die attach area for wirebonding to electrically common die pads and electrical
connection with both die attach pad and solder balls designated by 1st Electrical Group symbol on BGA Design Library Drawing
(Figure 1).
*4. If the number of signal Die Wirebond Pads (not including Electrical Groups) total less than 231, the total number may be
divided by 4 and wirebond placement centered on each package side.
*5. Thermal enhancement of 6 x 6 solder balls.