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SEMI M45-0703 © SEMI 2001, 2003 1 SEMI M45-0703 PROVISIONAL SPECIFICATION FOR 300 mm WAFER SHIPPING SYSTEM This provisional specification was technically approve d by the Global Silicon Wafer Committee and is the direct …

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SEMI M44-0305 © SEMI 2001, 2005 3
6.3 Irrespective of the calibration factor, to convert oxygen density (atoms/cm
3
) to oxygen concentration (ppma),
within the same calibration factor, divide the oxygen density value by the factor 5 10
16
(atoms·cm
–3
·ppma
–1
), and
to convert oxygen concentration (ppma) to oxygen density (atoms/cm
3
), within the same calibration factor, multiply
the concentration value by the same factor.
Table 1 Calibration Factors
Calibration Factor Cited in Standard(s) or
Publication
Value to Obtain Oxygen
Content in ppma
Value to Obtain Oxygen
Content in atoms/cm
3
New ASTM ASTM F 121, 1980-1983;
DIN 50438/1, 1978
4.90
2.45 10
17
“JEIDA Coefficient (Original)” Cited in Iizuka et al., see
Footnote 6
6.06
3.03 10
17
Guo Biao (Old Edition) Cited in Baghdadi et al., see
Footnotes 1 and 2.
6.20 3.10 × 10
17
IOC-88
SEMI MF1188;
DIN 50438, 1994 and 1995;
JEITA EM3504;
Guo Biao GB/T 1557-1989
6.28
3.14 10
17
Old ASTM ASTM F 121, 1970-1979 9.63
4.815 10
17
Table 2 Conversion Factors
To: →
Convert From: ↓
New ASTM
#1
“JEIDA
Coefficient
(Original)”
#2
Guo Biao
(Original)
#3
IOC-88
#4
Old ASTM
#5
New ASTM
#1
1 1.237 1.265 1.282 1.965
“JEIDA Coefficient (Original)”
#2
0.809 1 1.023 1.036 1.589
Guo Biao (Old Edition)
#3
0.790 0.977 1 1.013 1.553
IOC-88
#4
0.780 0.965 0.987 1 1.533
Old ASTM
#5
0.509 0.629 0.644 0.652 1
#1
Cited in all editions of ASTM F 121 from 1980 through 1983 (replaced by ASTM F 1188, now SEMI MF1188, in 1988) and in the 1978
edition of DIN 50438, Part 1.
#2
Reported in T. Iizuka et al., Reference 6.
#3
Old edition; cited in Baghdadi et al., see footnotes 1 and 2. Since revised to cite IOC-88.
#4
See footnotes 1 and 2. Cited in all editions of SEMI MF1188, the 1994 and 1995 editions of DIN 50438, Part 1, all editions of JEITA EM-
3504 (and its predecessor JEIDA 16), and the 1989 edition of GB/T 1557.
#5
Cited in all editions of ASTM F 121 from 1970 to 1979.
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SEMI M45-0703 © SEMI 2001, 2003 1
SEMI M45-0703
PROVISIONAL SPECIFICATION FOR 300 mm WAFER SHIPPING
SYSTEM
This provisional specification was technically approved by the Global Silicon Wafer Committee and is the
direct responsibility of the European Silicon Wafer Committee. Current edition approved by the European
Regional Standards Committee on April 3, 2003. Initially available at www.semi.org June 2003; to be
published July 2003. Originally published March 2001.
1 Purpose
1.1 This standard stipulates transport related materials
and systems to minimize the total cost relating to
transport of 300 mm wafers from the wafer supplier to
the customer.
2 Scope
2.1 This standard stipulates materials relating to
transport of 300 mm wafers using Shipping Boxes
(FOSB) regulated by SEMI M31, and includes wafer
shipping boxes, bags, labels, cushions, secondary
containers, pallets, and shipping documentation.
NOTE 1: This standard is provisional because some technical
issues are not implemented. Once these issues are addressed,
this standard should be modified and upgraded from
provisional status.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI M31 — Provisional Mechanical Specifications
for Front-Opening Shipping Box Used to Transport and
Ship 300 mm Wafers
SEMI T3 — Specification for Wafer Box Labels
3.2 ANSI Standards
ASNI/EAI-556-B — Outer Shipping Container Label
Standard
1
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
1 American National Standards Institute, Headquarters: 1819 L
Street, NW, Washington, DC 20036, USA. Telephone: 202.293.8020;
Fax: 202.293.9287, New York Office: 11 West 42nd Street, New
York, NY 10036, USA. Telephone: 212.642.4900; Fax:
212.398.0023, Website: www.ansi.org
4 Terminology
4.1 Definitions
4.1.1 bag — a package used for sealing the outside of
the wafer shipping box. Typically two or three types of
different plastic film and aluminum film are laminated,
and these are usually heat-sealed.
4.1.2 cushions — materials placed between the wafer
shipping box and secondary container in order to absorb
shock during shipping and to stabilize the wafer
shipping box within the secondary container.
4.1.3 label — the label on the wafer shipping box or
items such as bags identifying the product and its
manufacturer.
4.1.4 pallet — a flat container used for collecting and
holding a suitable amount of secondary containers that
hold wafers, to make handling with forklifts easier.
4.1.5 recycle — to use an already used item for some
other useful purpose.
4.1.6 reuse — to repeat use of an item in its original
shape for the same purpose as initially intended.
4.1.7 secondary container — the outermost box of the
smallest transport unit. Typically cardboard boxes or
similar boxes are used.
4.1.8 shipping document — documents required when
shipping.
4.1.9 wafer shipping box — a box that directly holds
the wafers. In this standard, this box is specified by
SEMI M31.
5 Requirements
5.1 Wafer Shipping Box
5.1.1 Wafer shipping boxes that comply with SEMI
M31 must be used.
5.1.2 There are no grounding or ESD requirements for
wafer shipping box.
5.1.3 To make sure raw materials are traceable, the
product number, revision number, and manufacturing
period (year, week) must be displayed on the wafer
SEMI M45-0703 © SEMI 2001, 2003 2
shipping box main device and door by molding or by a
method that cannot be easily erased.
5.1.4 The wafer shipping box door must be designed so
that it can be automatically as well as manually opened
and closed.
5.1.5 Optional top robotic handling flange or side
mounted human handles will not be attached during
transport of the wafer shipping box. If required, these
items will be applied at the receiving site. The design of
these features will allow for quick, lockable attachment
to the wafer shipping box.
5.1.6 Wafers must be visible inside when the wafer
shipping box is closed.
5.1.7 No tape may be used to seal the wafer shipping
box.
5.1.8 The only environment in which wafers can be
placed into or taken out of a wafer shipping box bag, as
well as the surrounding environment thereafter, is clean
room air.
5.1.9 The body and door of the wafer shipping box
must be designed to allow for multiple reuse cycles
without compromising wafer quality.
5.1.10 After a customer has transferred an accepted
wafer to a fab carrier, the wafer shipping box must be
returned to the supplier without having used it for any
other purpose. The wafer shipping box will be inserted
into a bag sealed prior to return to the wafer supplier
using the same type bag (agreed upon by supplier and
customer).
5.1.11 Each wafer shipping box must be returned only
to the supplier that delivered the wafers for which the
wafer shipping box was used. A display for the supplier
showing the number of times a wafer shipping box was
used is optional.
5.1.12 The property rights of wafer shipping box used
to deliver wafers and to be returned after unloading
belong to the wafer manufacturers.
5.1.13 The wafer shipping box will maintain its
dimensional stability throughout its lifetime.
5.1.14 Wafer shipping box materials must be
recyclable after useful life.
5.2 Wafer Shipping Box Bagging System
5.2.1 It is preferable that the bag material is recyclable,
but until a technical solution is found, bags should be
easily disposable.
5.2.2 The bagging system must consist of two or more
layers of bags. At least one layer must be a moisture
barrier.
5.2.3 The use of desiccant between the bag layers is
currently optional. Its use must not negatively impact
the cleanliness of the bagging system.
5.2.4 Bags may be evacuated optionally. The initial
bag ambient, prior to evacuation and sealing, may be
temperature/humidity controlled clean room air, clean
dry air (CDA), or nitrogen (N2).
5.3 Wafer Shipping Box and Bag Labeling
5.3.1 Prepare and apply two identical labels that are in
accordance with SEMI T3, with additional
requirements as noted below.
5.3.1.1 Label size may be as large as 120 mm x 120
mm.
5.3.1.2 Label data content shall include all the data
specified in SEMI T3, including wafer ID and FOSB
slot #. Additional data may be added optionally, as
agreed to between supplier and user.
5.3.1.3 Apply one label to the center of the rear surface
of the FOSB. The long axis of the label shall be
parallel to the FOSB base.
5.3.1.4 Apply the other label to the shipping bag, on
the door side of the FOSB.
5.3.2 The wafer shipping box and outer bag labels
should use the same peelable, cleanroom compatible
label stock. The labels must not leave residual adhesive
or backing material on the wafer shipping box when
removed.
5.4 Secondary Container Labeling
5.4.1 Labels shall be placed in accordance with EIA-
556-B.
5.4.2 Prepare labels in accordance with EIA-556-B.
Information shall include at least the following [Items
below marked by an asterisk (*) are mandatory EIA-
556-B data fields]:
5.4.2.1 Bar Code Data Fields
• Transport unit License Plate number*
• Transaction identification (Purchase Order
number)*
• Total Quantity of Wafers*
• Total Quantity of Cartons
• Customer Part number*
5.4.2.2 Non-Bar Code Data Fields
• Ship-to address (including Customer name)*
• Ship-from address (including Supplier name)*