semi合集-English.pdf - 第6870页
SEMI S2-0703a E © SEMI 1991, 2004 99 D. Collecting optics type: ________ E. Focal length in millimeters (mm): _ _______ Laser Control Measures 1. Identify protective m easures required during ma intenance. _______ ______…

SEMI S2-0703a
E
© SEMI 1991, 2004 98
C. Other types of PPE (e.g., skin protection) if needed _______, _______, _______
Note 2: Suppliers may alternately provide a reference to PPE information located in a document available to users.
D1-5 Revisions to Related Information 9 (Laser Checklist) — OPTIONAL Before Effective Date
D1-5.1 Revision of the existing Related Information 9 (Laser Checklist) as shown below:
RELATED INFORMATION 9
LASER CHECKLIST
LASER EQUIPMENT SAFETY FEATURES
NOTICE: This related information is not an official part of SEMI S2 and was derived from practical application by
task force members. This related information was approved for publication by vote of the responsible committee on
Oct
ober 21, 1999 April 22, 2004 with an effective date of July 1, 2006.
Laser Manufacturer:
__________________________________
Model #:
__________________________________
Serial #:
__________________________________
Laser Hazard Classification: (During Op
eration)
1. Classification Number (e.g. 1, 2, 3a, 3b, 4):
________
2. Classification Standard(s) (e.g. FDA/CDRH, IEC, JIS, etc.):
________
NOTE R9
-1: If any laser contained in the equipment is Class 2, 3a, 3b or 4 laser system or product, the vendor should
make available upon request a hazard evaluation to include the following information for each laser in the equipment
(where applicable):
Laser Parameters
1. Laser medium type (HeNe, Nd:YAG, CO
2
, Argon, Excimer, GaAs, etc.): __________
Note: For Excimer lasers, specify gases: _______________
2. Wavelength(s) in nanometers (nm):
_______________
3. Continuous Wave
A. Peak Power in Watts (W): ________
B. Available Power in Watts (W): ________
C. Irradiance in Watts/square centimeter (W/cm
2
): _ ________
4.
Pulse Characteristics
A. Duration of Pulse in Seconds (s): ________
B. Energy per Pulse in Joules (J): ________
C. Frequency of Pulses (Pulse Repetition Frequency) in Hertz (Hz): ________
D. Average Power in Watts (W): ________
E. Radiant Exposure in Joules/square centimeter (J/cm
2
): ________
F. Q-Switch controlled pulses ( ) Yes ( ) No
5.
Beam Parameters
A. Emerging beam diameter in millimeters (mm): ________
B. Expanded beam diameter in millimeters (mm): ________
C. Beam divergence in milliradians (mr): ________

SEMI S2-0703a
E
© SEMI 1991, 2004 99
D. Collecting optics type: ________
E. Focal length in millimeters (mm): ________
Laser Control Measures
1.
Identify protective measures required during maintenance. __________________
____________________________________________________________________
2.
Laser Controlled Area required for Maintenance procedures? ( ) Yes ( ) No
3.
Laser Controlled Area required for Service procedures. ( ) Yes ( ) No
4.
If a Nominal Ocular Hazard Distance (NOHD) is used as a control measure, then provide the NOHD
calculations. See IEC 60825-1 for NOHD calculations.
NOTE R9-2: Attach a diagram of the laser beam path and the irradiance/radiant exposure at each significant point.
Personnel Protective Equipment (PPE) (for laser radiation hazards in excess of the MPE)
1.
Optical Density (OD) of PPE required during maintenance activities: ___________
2.
OD of PPE required during service activities: ___________
3.
Recommended PPE manufacturer and model #: ______________________________
Table R9-1 Equipment Safety Features Reference Table
Reference
Number
Equipment
Safety Features
(not an inclusive
list)
D
USA
21 CFR
1040.10
A
Europe
ENIEC
60825-1
B
Japan
JIS
C 6802
C
Examples
Paragrap
h
P
aragrap
h
Paragrap
h
Examples
1. Protective
Housing
( ) Yes (
) No
(f)(1) 4.2 4.2.1 Aluminum or steel enclosures,
windows that provide adequate
attenuation, optical fibers or
beam tubes.
2. Safety
Interlocks
( ) Yes
( ) No
(f)(2) 4.3 4.2.2 See Interlock
Section 11 of
SEMI S2.
3. Remote
Interlock
Connector
( ) Yes
( ) No
(f)(3) 4.4 4.2.3 Usually a 12 to 24 volt set of
contacts available to the user to
integrate additional room control
measures.
4. Key Control ( ) Yes
( ) No
(f)(4) 4.5 4.2.4 A key that is not removable in
the operations mode.
5. Laser Radiation
Emission
Warning
( ) Yes
( ) No
(f)(5) 4.6 4.2.5 A light or indicator that warns
the user of the emission through
the aperture.
6. Beam
Attenuator
( ) Yes
( ) No
(f)(6) 4.7 4.2.6 Shutters, beam blocks or water-
cooled beam dumps
7. Location of
Controls
( ) Yes
( ) No
(f)(7) 4.8 4.2.7
8. Viewing Optics ( ) Yes
( ) No
(f)(8) 4.9 4.2.8 Must block all hazardous
wavelengths to acceptable
levels.
9. Scanning
Safeguard
( ) Yes
( ) No
(f)(9) 4.10 4.2.9 Shuts down if the scanning
mechanism (such as a rotating
mirror or galvanometer) fails.
10. Manual Reset
Mechanism
( ) Yes
( ) No
(f)(10) 4.3.1 4.2.2(c) A button or circuit that must be
energized before the equipment
resumes its functions.

SEMI S2-0703a
E
© SEMI 1991, 2004 100
Reference
Number
Equipment
Safety Features
(not an inclusive
list)
D
USA
21 CFR
1040.10
A
Europe
ENIEC
60825-1
B
Japan
JIS
C 6802
C
Examples
11. Class
Designation &
Warning Labels
( ) Yes
( ) No
(g)(1)-
(g)(4)
5.1-5.6,
5.8-5.11
4.3 Identify which standard was
used for each hazard
classification.
12. Aperture Label ( ) Yes
( ) No
(g)(5) 5.7 4.3.7 Identify the aperture.
13. Positioning of
Labels
( ) Yes
( ) No
(g)(9) 5.1 4.3.1 Conspicuous, but size is not
specified.
14. User
Information
( ) Yes
( ) No
(h)(1) 6.1 4.4.1 SOPs, instruction manuals
15. Service
Information
( ) Yes
( ) No
(h)(2) 6.2 4.4.2 Accessible laser radiation levels
during Service
16. Measurements ( ) Yes
( ) No
(e) 8
9 3.4
17. Classification ( ) Yes
( ) No
(c) 9
8 3.3.3
18. Certification
Information
21 CFR TBD by
Europe
TBD by
Japan
19. Certification
Label
( ) Yes
( ) No
1010.2
20. Identification
Label
( ) Yes
( ) No
1010.3
A. The US FDA/CDRH makes 21 CFR 1040.10 available, so the latest version should be used. The version used to update this table was dated
April 1, 2003.
B. The IEC laser products standard used to update this table was 60825-1 © IEC:1993+A1:1997+A2:2001(E)
C. The Japanese Standards Association does not offer the current version of JIS C 6802 in English.
However, the current version should be used and the Japanese version is the official version
The sections referenced in the table above are from the 1991 English version of C 6802.
D. This requirement applies only to certain classes of lasers.
NOTE 4: Both the IEC and the US FDA/CDRH have published guides to assist manufacturers with laser product conformance.
NOTE 5: The FDA/CDRH has published Laser Notice 50. This laser notice provides guidance to manufacturers relating to the
FDA/CDRH acceptance of laser products conforming to the IEC 60825-1 standard. There are conditions and additional
requirements, so manufacturers should obtain this laser notice for the details.
R9-2 Referenced Documents
R9-2.1 IEC Standards
26
IEC 60825-1 — Safety of Laser Products, Part 1: Equipment Classification, Requirements, and User’s Guide
R9-2.2 US Code of Federal Regulations
27
21CFR Parts 1000-1050 — Food and Drug Administration / Center for Devices and Radiological Health
(FDA/CDRH), Performance Standards for Electronic Products, Title 21 Code of Federal Regulations, Parts 1000-
1050
26 International Electrotechnical Commission, No. 3, rue de Varembé, Case Postale 131, CH-1211 Geneva 20, Switzerland. Telephone:
41.22.919.02.11; Fax: 41.22.919.03.00. Website: www.iec.ch
27 United States Food and Drug Administration/ Center for Devices and Radiological Health (FDA/CDRH). Available from FDA/CDRH
Website: http://www.accessdata.fda.gov/scripts/cdrh/cfdocs/cfcfr/cfrsearch.cfm