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SEMI S23-0705 © SEMI 2005 9 RELATED INFORMATION 1 ADDITIONAL USE RATE MEAS UREMENT AND CONVERSI ON FACTOR INFORMATION NOTICE : This relat ed inform ation is not an official part of SEMI S23 and was deri ved from the Japa…

SEMI S23-0705 © SEMI 2005 8
The use rate data that is measured at various times.
The one or several sets of conversion factors used to estimate equivalent energy consumption.
The target date by which the improvement (by specific utility/material or overall) will be achieved.
Information describing why a target seems achievable and, generally speaking, how it will be achieved.
A cost/benefit analysis on the equipment upgrade.
12 Monitoring and Reporting
12.1 Monitoring
12.1.1 The equipment supplier should review the improvement status periodically and update the roadmap to
monitor the conservation progress. A period of once every two years is recommended.
12.1.2 If the review indicates that targets have not (or will not) be achieved, it is useful to document the reasons as
part of the roadmap data and to re-adjust the target dates and achievement strategy based on the most recent
information.
12.2 Reporting
12.2.1 The equipment supplier should report to the users energy data, utilities and material use rate data and related
improvement roadmaps for the equipment.
12.2.2 The reports should contain the roadmap data addressed in ¶11.9 at a minimum.
12.2.3 The equipment suppliers should also consider including data that the users would like to have included in the
report.
NOTE 16: The equipment supplier should be careful not to include in the reports any information that is identified as
confidential to any party involved unless appropriate non-disclosure agreements are in place. Specific recipes, desired effects to
the substrate, methods of achieving energy conservation and forecasted results are examples of information that may be, or may
contain parts that are, confidential.
13 Related Documents
13.1 ISMT Documents
2
ISMT Utilities Consumption Characterization Protocols for Semiconductor Tools, TT #00043939A-ENG
ISMT Environmental, Safety and Health (ESH) Metrics for Semiconductor Manufacturing Equipment (SME),
TT #02034261A-TR
13.2 SEAJ Documents
3
SEAJ-E-002E Guideline for Energy Quantification on Semiconductor Manufacturing Equipment and Utilities
SEAJ-EP-003E Guideline for conducting an LCA of Semiconductor Manufacturing Equipment – Energy Saving
Perspective
SEAJ-E-001E Power Measurement Protocol for Semiconductor Equipment
2 International SEMATECH, 2706 Montopolis Drive, Austin, TX, website http://www.sematech.org
3 Semiconductor Equipment Association of Japan, 7-10 Shinjuku 1-chome Shinjuku-ku, Tokyo, 160-0022, Japan, Phone 81.3.3353.7589, Fax
81.3.3353.7970, website http://www.seaj.or.jp

SEMI S23-0705 © SEMI 2005 9
RELATED INFORMATION 1
ADDITIONAL USE RATE MEASUREMENT AND CONVERSION
FACTOR INFORMATION
NOTICE: This related information is not an official part of SEMI S23 and was derived from the Japanese
Environmental, Health, & Safety committee. This related information was approved for publication by full letter
ballot on May 20, 2005.
NOTE: This RI is a summary of SEAJ document “SEAJ-E-002E Guideline for Energy Quantification on
Semiconductor Manufacturing Equipment and Utilities” and was approved to be published as related information of
this document as written.
R1-1 Other Use rate Measurements and Data
R1-1.1 Equipment recipes describe how the various controls of the equipment should be set in order to achieve a
desired effect on the substrate or other material being treated by the equipment. Because equipment control elements
are different from equipment to equipment, the parameters of a recipe will also be different even if the desired effect
on the substrate or other material is the same.
R1-1.2 Within this guide, “baseline recipe” should be understood as the collection of recipe parameters intended to
produce a specific desired effect. Therefore, the desired effect can be the same from equipment to equipment even
though the parameters of the recipes may be different.
R1-1.3 For processing measurements, the average value of each parameter over the course of the processing cycle
should be noted. If the equipment processes substrates, a 10 substrate average should be recorded. If the equipment
processes a material other than substrates (e.g. a vacuum pump), the average over a 30 minute processing period
should be recorded.
R1-1.4 For idle measurements, the average value of each parameter over a period of 30 minutes should be recorded
R1-1.5 A supplier may need to measure additional metrics for other purposes (e.g. to support other metrics-
gathering requirements and criteria relevant to supplier-user agreements). Adding those metrics to the energy
conservation utility and material use rate measurement effort may be beneficial.
R1-1.6 Semiconductor manufacturing equipment typically processes wafers or other substrates. It is useful to
characterize utility and material use rate during processing in terms of per-wafer amounts needed to achieve the
desired effect of the recipe.
R1-1.7 By providing an equipment throughput metric (i.e., substrates per hour) with supporting throughput
calculation information, the per hour processing metrics can be converted, approximately, into “per wafer” metrics.
With further calculations based on the useful area of the wafers processed, the utilities and materials used per cm
2
during processing can be estimated.
R1-1.8 The data described in Table R1-1 should be recorded in addition to the use rate data of Table 1 in the main
body of this guide. The goal is to record enough information to document the measurement event thoroughly so that
it can be reproduced at a later time, perhaps, for example, to analyze the effect of equipment changes.
R1-1.9 Some of the data (e.g. wafer size) in Table R1-1 may not be applicable to the equipment under
consideration.
Table R1-1 Recommended Additional Data to Record for the Measurement Event
Data Title Description
Date When the measurements were taken.
Equipment Under Test (EUT) The equipment from which the measurements taken. Provide
information such as general description, model number, and serial
number.
EUT Configuration The configuration of the equipment during the measurements, such as
sub-systems that were or were not used and optional hardware that was
installed.

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Data Title Description
Test Location Where the measurement testing was done such as the particular test
laboratory or manufacturing location.
Principal Test Personnel The principal personnel involved in developing the test plan and
conducting the testing.
Test Recipe The recipe used when conducting the test
Test Throughput (per hour) How many substrates or other material quantity was processed per hour
during the test.
Throughput Calculation Method How is throughput determined?
Wafer Size What size wafer is processed by the equipment.
Test Duration How long the equipment was operating for gathering the test data.
Test Setup How the several pieces of test equipment were connected to the EUT.
Test Equipment and relevant Calibration Information
for measuring;
Exhaust
Vacuum
Dry Air
Nitrogen
Process Gas (at or above atmospheric pressure)
Process Gas (below atmospheric pressure)
Process Solids
Process Liquids
Cooling Water
Ultra Pure Water
Electricity
Heat Load
The test equipment that was used to measure the use rate of each utility
or material and its relevant calibration information such as when the
test equipment was last calibrated and when it should be calibrated
again.
R1-2 Equivalent Energy Conversion Factors
R1-2.1 General
R1-2.1.1 The conversion factors given in Table 2 of this guide are based on the following factory model;
Clean room area: 4,400 m
2
,
Class 1: 20%,
Class 1000: 80%,
Wafer Size: 200 mm, and
Wafer Start per month: 10,000.
R1-2.1.1.1 While the conversion factors derived from this model will not be exactly correct for other facilities, they
can at least be used as a starting point for identifying the relative differences in energy impact among the utilities
and materials listed in Table 1 of the guide.
R1-2.1.2 The conversion calculations of this guide can be used to express the estimated total equivalent energy that
the equipment will consume in one year of use. The use rate measurements (units per hour) can be multiplied by the
number of hours per year the equipment is estimated to be in the processing or idle state. This yields a total volume
or mass of a utility or material consumed per year which is then multiplied by the energy conversion factor.
R1-2.1.3 Table R1-2 contains a calculation model and an example calculation.
R1-2.1.4 The heat load calculation follows a model that is different than the other items. It is shown in Table R1-3.