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SEMI E106-1104 © SEMI 2000, 2004 6 interbay load ports), by SEMI E15.1 (for its manual/AGV/ RGV load ports), by SEMI E8 5 (for its interbay load ports), b y SEMI E84 (for its carrier handoff parall el I/O at either kind …

SEMI E106-1104 © SEMI 2000, 2004 5

6.3 Wafer Carriers — SEMI E1.9 and SEMI E47.1

specify the carriers used to transport and store 300 mm

wafers in an IC manufacturing facility. SEMI E47.1

specifies the outside features of the front-opening

unified pod (FOUP). The inside features of the FOUP

are specified in SEMI E1.9, which also specifies the

open cassette. Both standards specify carriers that hold

either 13 or 25 wafers. SEMI M31 specifies the front-

opening shipping box (FOSB) used to transport and

ship 300 mm wafers. SEMI E103 specifies a system

that includes a box that holds only one wafer and that

fits onto an adapter mechanism called a single-wafer

interface (SWIF). This system appears to the

equipment to be a 300 mm FOUP (except that only the

volume around the middle wafer may be accessible).

6.4 Equipment Load Ports — SEMI E15.1 specifies

the carrier load ports at the front of 300 mm process or

metrology equipment (or stockers). In addition, the

substrate port that opens a FOUP door is specified in

SEMI E62 (FIMS). At the floor below each load port is

a cart docking interface exclusion volume specified in

SEMI E64; this volume can contain a PGV docking

flange as specified in SEMI E83. SEMI E63 (BOLTS-

M) or SEMI E92 (BOLTS-Light) or both standards

specify the mechanical interface between the main part

of a process or metrology tool and the box

opener/loader unit that opens FOUPs and presents them

to the tool wafer handler for unloading and loading 300

mm wafers. Also associated with each load port is a

wire or optical link (from the equipment to the AMHS

carrier delivery system) specified in SEMI E84 which

is the 300 mm version of SEMI E23. SEMI E99 and

SEMI E99.1 specify the electronics and communication

interface between a carrier ID reader/writer and the

equipment controller. SEMI E101 specifies the

functional structure model and component behavior for

the entire equipment front-end module (EFEM). SEMI

E110 specifies the placement of indicators and switch.

6.5 Cluster-Tools — SEMI standards for 300 mm

cluster tools include SEMI E22.1, SEMI E21.1, SEMI

E26.1, and SEMI E25.

6.6 AMHS — SEMI standards for automated material

handling systems (AMHS) include SEMI E85.

6.7 Equipment Volume and Weight — SEMI E72

specifies limits on the footprint, height, and weight of

equipment for 300 mm fabs. Separate limits are given

for the parts of the equipment in the main fab and in the

sub-fab. Separate limits are also given for the

equipment after it is installed and for the components of

the equipment as it is moved into the fab.

6.8 Back-End Standards — SEMI G74 specifies the

tape frames used for 300 mm wafers between the dicing

process and the die-bonding process. SEMI G77

specifies the mechanical features of a metal or plastic

frame cassette used for framed 300 mm wafers between

the wafer mounting process and the die-bonding

process. Future standards may also specify the carrier

for thinned 300 mm wafers and the load port for back-

end process or metrology equipment.

6.9 Standards of Uncertain Use — Some SEMI 300

mm standards that passed balloting have a scope of

application or extent of use that is yet to be fully

determined. Such standards include SEMI M29 which

specifies a manually-opening shipping box for 300 mm

wafers. In the other SEMI 300 mm standards are also

some options of uncertain use such as bottom-opening

pods and pods with removable cassettes.

7 Application of Standards to Products

7.1 One-Sided Interface Specifications — The SEMI

standards for 300 mm physical interfaces and carriers

are intended to set an appropriate level of specification

that places minimal limits on innovation while ensuring

modularity and inter-changeability between different

types of products. To accomplish this, only one side of

each mechanical interface (between different types of

products) is specified, leaving the supplier of the

product on the other side of the interface more freedom

to improve their product. For example, only the bottom

half of the kinematic coupling (the pin) is specified by

SEMI E57 so that suppliers can be flexible in designing

wafer carrier grooves that can mate with it. Table 1

shows which standards apply to each type of product

and shows which side of the interface is specified:

 “D” indicates if the standard directly specifies that

type of product (by specifying that product’s side

of the relevant interface).

 “I” indicates if the standard indirectly specifies that

type of product (by specifying the other side of the

relevant interface).

7.2 Carriers — A FOUP is directly specified by SEMI

E47.1 (for its outside features not including the door)

and by SEMI E1.9 (for its inside features). The FOUP

is indirectly specified by SEMI E57 (for its kinematic

coupling grooves) and by SEMI E62 (for its FIMS door

interface). Thus, if a FOUP door fails to open or close

correctly on any load port that complies with SEMI E57

and SEMI E62, that FOUP is in violation of the

standards. The wafer support function of all of the 300

mm carriers is specified directly (by specifying where

the wafers must be located rather than specifying the

shape and location of the supports), so the 300 mm

wafer standards indirectly specify the carriers.

7.3 Stockers — A carrier stocker is directly specified

by SEMI E57 (for the kinematic coupling pins on its

shelves, if any, and on its manual/AGV/RGV and

SEMI E106-1104 © SEMI 2000, 2004 6

interbay load ports), by SEMI E15.1 (for its

manual/AGV/RGV load ports), by SEMI E85 (for its

interbay load ports), by SEMI E84 (for its carrier

handoff parallel I/O at either kind of load port) and by

SEMI E64 (for the cart docking interface exclusion

volume below each manual/AGV/RGV load port). The

carrier stocker is indirectly specified by the carrier

standards (for the volume required to store and transfer

the carriers).

7.4 Carrier ID — A carrier ID reader/writer unit is

directly specified by a future standard that specifies the

electronics and communication interface between a

carrier ID reader/writer and the equipment controller.

The carrier ID reader/writer unit is indirectly specified

by the carrier standards (which specify reserved areas

for carrier ID tags) and by SEMI E15.1 (for its

exclusion volume in each load port).

7.5 Load Port and Carrier Handler Modules — A box

opener/loader (the module on a piece of equipment that

includes load ports and carrier handling) is directly

specified by SEMI E57 (for the kinematic coupling pins

on the load port and on its shelves if it includes an

internal buffer in addition to its fixed buffer), by SEMI

E15.1 (for its load ports), by SEMI E62 (for its FIMS

door interface), by SEMI E84 (for its carrier handoff

parallel I/O), by SEMI E64 (for the cart docking

interface exclusion volume below each load port), by

SEMI E72 (for its limits on footprint, height, and

weight), and by SEMI E110 (for indicator/switch

placement). The module is indirectly specified by the

carrier standards (for the volume required to store and

transfer the carriers) and by SEMI E63 and/or SEMI

E92 (for the mechanical interface to the main part of the

process or metrology equipment that contains the

substrate handler).

7.6 Main Part of Process or Metrology Equipment —

The main part of process or metrology equipment

(including the substrate handler) is directly specified by

SEMI E63 and/or SEMI E92 (for the mechanical

interface to the module that includes load ports and

carrier handling) and by SEMI E72 (for its limits on

footprint, height, and weight). The substrate handler is

indirectly specified by SEMI E1.9 (for the features

inside most carriers) and it is recommended to follow

the direct specifications in SEMI E22.1 (which

specifies cluster-tool end effectors).

7.7 Material Handling Systems — A carrier transport

vehicle is directly specified by SEMI E57 (for the

kinematic coupling pins on the carrier nest, if any) and

by SEMI E84 (for its carrier handoff parallel I/O, if

any). The AMHS system is indirectly specified by the

carrier standards (for the volume required to hold and

transfer the carriers), by SEMI E15.1 (for equipment

load ports), by SEMI E85 (for stocker load ports, if it is

an OHT), by SEMI E72 (to allow for equipment height,

if it is an OHT), and by SEMI E64 and SEMI E83 (for

the cart docking interface exclusion volume and the

PGV docking flange, respectively, below each

equipment load port, if it is a floor based vehicle).

Table 1 Standards Specifying Each Type of Product (D = Direct Specification, I = Indirect Specification)

Type of Product and its

Components

SEMI M1.15, M8, or M28 (Wafer)

SEMI E57 (Kinematic Coupling)

SEMI E1.9 (Cassette)

SEMI E47.1 (FOUP)

SEMI M31 (FOSB)

SEMI E103 (Single-Wafer Box System)

SEMI E62 (FIMS)

SEMI E63 (BOLTS-M) and/or E92 (BOLTS-Light)

SEMI E15.1 (Load Port)

SEMI E64 (Cart Docking Interface)

SEMI E83 (PGV Docking Flange)

SEMI E84 (Carrier Handoff Parallel I/O)

SEMI E99 & E99.1 (Carrier ID Reader/Writer Comm.)

SEMI E85 (Stocker to Interbay Transport System)

SEMI E22.1 (Cluster- Tool End Effector)

SEMI E21.1 (Cluster-Tool Module Interface)

SEMI E25 & E26.1 (Cluster-Tool Access & Footprint)

SEMI E72 (Equipment Footprint, Height, and Weight)

SEMI G74 (Tape Frame)

SEMI G77 (Frame Cassette)

SEMI E110 (Indicator/Switch Placement)

FOUP:

wafer supports I

coupling grooves I

inside features D D

outside features D

door D I

open cassette:

wafer supports I

coupling grooves I

other features D

shipping box:

wafer supports I

coupling grooves I

other features D

single-wafer box and

SWIF system:

wafer supports I

coupling grooves I

inside features D D D

outside features D D

door D D I

interbay transport

vehicle:

carrier supports D

carrier envelope I I

hand-off I/O I D

stocker load ports I

roller conveyor:

carrier rails I I

carrier envelope I I

equipment load ports I

hand-off I/O D

PGV:

carrier supports D

carrier envelope I I

carrier handler I I I

tool load port access I I

docking features I I