semi合集-English.pdf - 第4120页

SEMI F61-0301 © SEMI 2001 5 Feed Water ≤ ≤ ≤ ≤ 5 µ µ µ µ ≤ ≤ ≤ ≤ 1 µ µ µ µ ≤ ≤ ≤ ≤ 1 µ µ µ µ ≤ ≤ ≤ ≤ 0.02 µ µ µ µ Figure 1 Schematic of a Typical Ultrapure Water System NOTICE: SEMI makes no warranties or representations…

SEMI F61-0301 © SEMI 2001 4

be configured in a double-pass arrangement consisting

of two RO membrane units in series. Permeate

(filtered water) from the first RO unit is sent to the

second RO unit to be filtered again. It is not

uncommon for the permeate from a double-pass RO

unit to have a resistivity reading up to 0.5–4 Megohm-

cm, with less than one milligram per liter of organic

and silica contaminants. The more contaminants

removed in the membrane treatment step, the lower the

loading on the Polishing steps.

7.3 Volatiles Removal  The removal of dissolved

oxygen, carbon dioxide, other gases, and volatile

organic compounds is a necessary treatment step. The

removal of these volatile contaminants is accomplished

to acceptable levels in vacuum degasifiers and in

membrane degasification units. The removal of

volatiles that can form ions and the removal of volatile

organic compounds reduce the loading on downstream

Polishing equipment.

7.4 Polishing  The relatively low level of

contaminants that were not removed in the Membrane

Treatment and Volatiles Removal steps are polished

down to acceptable levels in the Polishing steps. Ionic,

organic, and silica contaminants are removed in

typically two stages of Ion Exchange in series (primary

beds and polishing beds). Organic compounds,

measured as TOC (Total Organic Carbon, or Total

Oxidizable Carbon), that are found downstream of the

RO membrane units may be subjected to TOC

Reduction ultraviolet (UV) irradiation (185 nanometer

low pressure units or medium pressure units) to convert

most of them into ionic compounds that can be

effectively removed by Primary Ion Exchange Units

(usually consisting of Separate Beds, Mixed Beds or

EDI/CDI/E-Cell). TOC compounds that exit the

primary ion exchange units are typically subjected to

TOC reducing UV irradiation to break them into

ionized compounds to be removed by the Polishing Ion

Exchange Units. The vast majority of all living

suspended particles (mainly bacteria) that enter any 254

nm UV unit are inactivated. Downstream filters with a

pore size of less than or equal to 0.45 micron remove

the inactivated bacterial bodies. The final filter prior to

Distribution typically has a pore size of less than 0.2

micron.

8 Distribution

8.1 Distribution is frequently comp osed of one or

more Loops. Each loop consists of UPW that

continuously recirculates through appropriate piping

from the final filters, to the manufacturing areas

requiring UPW (end users), and back to a tank located

within the Polishing section to be polished again. The

UPW to the end-user area is commonly called the

Supply. The UPW that travels from the end-user area

back to the water treatment area is commonly called the

Return. Ozone may be injected into the Supply and/or

Return line to control microbiological contaminants and

also to enhance the action of TOC breakdown in

downstream TOC reducing UV units. Sometimes ozone

is injected into the Supply line for similar reasons

(requires de-ozonation at the end-use points).

Sometimes the UPW in the distribution loop is heated

(hot loop) for particular processes.

8.2 Basic System Components

8.3 General  Each UPW system contains certain

basic components and a variety of design options to

meet particular customer and facility needs. An

example of a UPW system is shown in Figure 1

attached.

9 Related Documents

9.1 SEMI Standards

SEMI F4 — Guide for Standard Performance,

Practices, and Sub-Assembly for High Purity Piping

Systems and Final Assembly for Semiconductor

Manufacturing Equipment

SEMI F31 — Guide for Bulk Chemical Distribution

Systems

SEMI S2 — Environmental, Health, and Safety

Guideline for Semiconductor Manufacturing Equipment

9.2 SIA

National Technology Roadmap For Process Chemicals

1 Semiconductor Industry Association, 181 Metro Drive, Ste 150, San

Jose, CA 95110, USA

SEMI F61-0301 © SEMI 20015

Feed

Water

≤

≤ 5

µµ

≤

≤≤

≤ 1

µµ

≤

≤ 1

µµ

≤

≤ 0.02

µµ

Figure 1

Schematic of a Typical Ultrapure Water System

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant

literature respecting any materials or equipment mentioned herein. These standards are subject to change without

notice.

The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted

material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI F62-0701 © SEMI 20011

SEMI F62-0701

TEST METHOD FOR DETERMINING MASS FLOW CONTROLLER

PERFORMANCE CHARACTERISITICS FROM AMBIENT AND GAS

TEMPERATURE EFFECTS

This specification was technically approved by the Global Facilities Committee and is the direct

responsibility of the North American Facilities Committee. Current edition approved by the North American

Facilities Committee on March 22, 2001. Initially available at www.semi.org May 2001; to be published July

2001.

1 Purpose

1.1 The purpose of this document is to define a

method for testing MFCs being considered for

installation into a gas distribution system and to

quantify ambient and gas temperature effects on the

MFC's indicated and actual flow.

2 Scope

2.1 This test method applies to metal and polymer

sealed MFCs with flow rates up to 30 slpm. The tests

include those listed below and are to be performed in

the following order:

1. Ambient Temperature Effects (Steady State and

Transient)

2. Gas Temperature Effects (Steady State and

Transient)

2.2 This standard does not purport to address safety

issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety health practices and determine the

applicability or regulatory limitations prior to use.

3 Limitations

3.1 This method evaluates mass flow controllers in

typically encountered, realistic operating conditions.

3.2 This test method does not address operational

influences outside of the manufacturer's published

limitations.

4 Referenced Standards

4.1 None.

5 Terminology

5.1 Acronyms and Abbreviations

5.1.1 DUT — device under test

5.1.2 g — gravity

5.1.3 kPa — kiloPascal

5.1.4 MFC — mass flow controller

5.1.5 NIST — National Institute of Standard Tech-

nologies

5.1.6 sccm — standard cubic centimeters per minute

5.1.7 slpm — standard liters per minute

5.2 Definitions

5.2.1 stability, long term — reading ± 2% for over one

hour.

5.2.2 stability, short term — reading ± 2% within five

minutes.

5.2.3 zero setpoint — manufacturer's setpoint for no

flow from the MFC.

5.3 Descriptions of Terms

5.3.1 MFC

— inlet mass flow controller.

5.3.2 T

— the temperature in the environmental

control chamber.

5.3.3 T

— gas temperature at the inlet to the DUT.

5.3.4 T

max

— maximum manufacturer-rated temper-

ature for an MFC.

5.3.5 T

min

— 20°C or manufacturer rated minimum

temperature, whichever is greater.

5.3.6 TC

— temperature coefficient due to changing

gas temperature of DUT.

5.3.7 TC

— temperature coefficient due to changing

environmental temperature of DUT.

5.3.8 Q

— for the purpose of this method, the output

value of the flow standard in units of mass flow.

5.3.9 Q

ind

— for the purpose of this method, the output

value of the device under test in units of mass flow.

5.3.10 Q

— for the purpose of this method, the

intended output in mass flow units for a particular

setpoint.

5.3.11 V

— valve A

5.3.12 V

— valve B

5.3.13 V

I i

— inlet isolation valve