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SEMI F78-0304 © SEMI 2003, 2004 14 Figure 8 All Welds Must Use Positive and Repeatable Form of ID Purge
SEMI F78-0304 © SEMI 2003, 2004 13
Figure 6
Maximum Open Gap Not to Exced 0.006 in. (0.15 mm)
Figure 7
OD or ID Chamfering
SEMI F78-0304 © SEMI 2003, 2004 14
Figure 8
All Welds Must Use Positive and Repeatable Form of ID Purge
SEMI F78-0304 © SEMI 2003, 2004 15
Figure 9
If a Cut-Out or Cut-In is Required, Purge Shall be Applied to Both Ends or the Downstream End Must be
Discarded or Cleaned