semi合集-English.pdf - 第15页
SEMI E1.3-0697 © SEMI 1983, 2002 3 NOTICE: SEMI makes no warranties or represen tations as to the suitability o f the standards set forth herein for any particular application. The determination of the suitability of the…
SEMI E1.3-0697 © SEMI 1983, 2002 2
Figure 4
Reference
Metal
Carrier
with
Type I
Crossbar
Plastic
Carrier
with
Type II
Crossbar
C5 130.66 mm ± 0.38 mm
(5.144 inch ± 0.015 inch)
C6 134.52 mm ± 0.25 mm
(5.296 inch ± 0.010 inch)
Usage Note: Because of the range of wafer carrier designs and wafer
carrier feature tolerances allowed by this standard, and because of the
range of wafer shapes and tolerances allowed by the wafer
dimensional standards, not every possible SEMI Standards wafer
carrier is compatible with every possible SEMI Standard wafer.
Please verify the compatibility of your specific wafer and carrier with
the respective vendors.
Figure 4
125 mm Plastic & Metal Wafer Carrier — General Usage
SEMI E1.3-0697 © SEMI 1983, 2002 3
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E1.4-0697 © SEMI 1984, 2002 1
SEMI E1.4-0697 (Reapproved 1102)
STANDARD FOR 125 mm PLASTIC AND METAL WAFER CARRIERS,
AUTO TRANSPORT USAGE
This standard was technically approved by the Global Physical Interfaces and Carriers Committee and is the
direct responsibility of the North American Physical Interfaces and Carriers Committee. Current edition
approved by the North American Physical Interfaces and Carriers Committee on July 21, 2002. Initially
available at www.semi.org October 2002; to be published November 2002. Orignally published in 1984;
previously published June 1997.
This standard is intended to meet the in use
requirements necessary for the interface of wafer
carriers with automated wafer processing equipment.
Specifications for carriers intended for general use are
outlined in SEMI E1.3. The complete specification for
this product includes all general requirements of SEMI
E1.
Figure 5
Reference
Overall Dimensions
A1 143.38 mm ± 0.25 mm (5.645 inch ± 0.010 inch)
A2a 152.4 mm ± 1.0 mm (6.00 inch ± 0.04 inch)
A2b 135.9 mm ± 1.0 mm (5.350 inch ± 0.04 inch)
A3 146.05 mm ± 0.76 mm (5.75 inch ± 0.03 inch)
Capacity
B1 25 capacity
B2 4.76 mm ± 0.08 mm (0.1875 inch ± 0.003 inch)
B3 114.3 mm ± 0.25 mm (4.500 inch ± 0.010 inch)
Detail Dimensions
C1 10° ± 2°
C2 11.18 mm ± 0.38 mm (0.440 inch ± 0.015 inch)
C3 1.52 mm ± 0.08 mm (0.060 inch ± 0.003 inch)
C4 128.52 mm ± 1.0 mm (5.060 inch ± 0.04 inch)
C5 130.66 mm ± 0.38 mm (5.144 inch ± 0.015 inch)
C6 134.52 mm ± 0.25 mm (5.296 inch ± 0.010 inch)
C7 3.56 mm – 0.38 mm (0.140 + 0.000 inch/– 0.015
inch) by 4.32 mm ± 0.5 mm (0.170 inch ± 0.020
inch) high
C8 3.96 mm + 0.5 mm/– 0.0 mm(0.156 inch + 0.020
inch/– 0.000 inch)
C9 10.11 mm ± 0.25 mm (0.398 inch ± 0.010 inch)
Machine Fit Specifications
D1a 14.53 mm ± 0.13 mm (0.572 inch ± 0.005 inch)
D1b ± 0.13 mm (± 0.005 inch)
D2a 4.78 mm (0.188 inch) min.
D2b 6.35 mm (0.250 inch) min.
D3a 1.53 mm ± 0.77 mm (0.060 inch ± 0.030 inch)
D3b 1.53 mm ± 0.25 mm (0.060 inch ± 0.010 inch)
D4a 77.80 mm ± 0.51 mm (3.063 inch ± 0.020 inch)
D4b 77.80 mm ± 1.27 mm (3.063 inch ± 0.050 inch)
Figure 5
Reference
D5a 25.40 mm ± 0.25 mm (1.000 inch ± 0.010 inch)
D5b 6.10 mm ± 0.13 mm (0.240 inch ± 0.005 inch)
D5c 5.33 mm ± 0.76 mm (0.210 inch ± 0.030 inch)
D6a 76.2 mm ± 1.0 mm (3.00 inch ± 0.04 inch)
D6b 107.44 mm ± 0.76 mm (4.230 inch ± 0.030 inch)
D6c 3.17 mm/6.35 mm (0.125 inch/0.250 inch)
min./max.
D6d 31.75 mm (1.25 inch) min.
D6e 31.75 mm (1.25 inch) min.
D6f 3.2 mm radius (0.125 inch radius) max.
D6g 85.34 mm ± 1.0 mm (3.360 inch ± 0.04 inch)
Wafer Tilt Within ± 0.38 mm (0.015 inch)
Wafer
Center
Horizontal
Within ± 0.38 mm (0.015 inch)
Handling Slots
D7a 6.60 mm ± 0.25 mm (0.260 inch ± 0.010 inch)
D7b 5.59 mm ± 0.25 mm (0.220 inch ± 0.010 inch)
D7c 10° ± 2°
D7d 5.99 mm ± 0.25 mm (0.236 inch ± 0.010 inch)
Pickup Flanges
D8a 133.35 mm ± 1.0 mm (5.25 inch ± 0.04 inch)
D8b 6.85 mm ± 0.25 mm (0.270 inch ± 0.010 inch)
D8c 5.1 mm (0.20 inch) min.
D8d 3.56 mm ± 0.25 mm (0.140 inch ± 0.010 inch)
D8e 68.33 mm ± 0.5 mm (2.69 inch ± 0.02 inch)
Center Alignment Feature
D9a 5.08 mm ± 0.25 mm (0.200 inch ± 0.010 inch)
D9b 1.27 mm ± 0.05 mm (0.050 inch ± 0.002 inch)
D9c 135° included angle
D9d 57.15 mm ± 0.13 mm (2.250 inch ± 0.005 inch)
Usage Note: Because of the range of wafer carrier designs and wafer
carrier feature tolerances allowed by this standard, and because of the
range of wafer shapes and tolerances allowed by the wafer
dimensional standards, not every possible SEMI Standards wafer
carrier is compatible with every possible SEMI Standard wafer.
Please verify the compatibility of your specific wafer and carrier with
the respective vendors.