semi合集-English.pdf - 第5043页
SEMI M18-0704 © SEMI 1990, 2004 29 Line Item EDI Code ID Sub Param ID 7.1 Surface Metal Contamination -- Potassium 100053 7.1 Surface Metal Contamination -- Chromium 100054 7.1 Surface Metal Contamination -- Iron 100055 …
SEMI M18-0704 © SEMI 1990, 2004 28
Line Item EDI Code ID Sub Param ID
2.2 Radial Resistivity Variation (RRG) 100007
2.3 Resistivity Striations 100008
2.4 Minority Carrier Lifetime 100009
3.1 Oxygen Concentration 100010
3.2 Radial Oxygen Variation 100011
3.3 Carbon Concentration 100012
3.4 Boron Concentration in Heavily Doped n-type Si 100013
4.1 Dislocation Etch Pit Density 100014
4.2 Slip 100015
4.3 Lineage 100016
4.4 Twin 100017
4.5 Swirl 100018
4.6 Shallow Pits 100019
4.7 Oxidation Induced Stacking Faults (OSF) 100020
4.8 Oxide Precipitates (BMD) 100021
5.1 Wafer ID Marking 100022
5.2 Front Surface Thin Film(s) Appl 100023
5.3 Denuded Zone 100024
5.4 Extrinsic Gettering Treatment 100025
5.5 Backseal 100026
5.6 Annealing 100027
6.01 Dimensions Specified According to SEMI M1.xx 100028
6.1 Diameter 100029
6.2 Primary Flat Length/Diameter Notch Dimensions 100030
6.3 Primary Flat/Notch Orientation 100031
6.4 Secondary Flat Length 100032
6.5 Secondary Flat Location 100033
6.6 Edge Profile 100034
6.7 Thickness 100035
6.8 Thickness Variation (TTV) 100036
6.9 Surface Orientation 100037
6.10 Bow 100038
6.11 Warp Method 100039 SEMI MF657
6.11 Warp Method 100040 SEMI MF1390
6.12 Sori 100041
6.13 Flatness/Global 100042
6.14 Flatness/Site 100043 SF3R
6.14 Flatness/Site 100044 SF3D
6.14 Flatness/Site 100045 SFLR
6.14 Flatness/Site 100046 SFLD
6.14 Flatness/Site 100047 SFQR
6.14 Flatness/Site 100048 SFQD
6.14 Flatness/Site 100049 SBIR
6.14 Flatness/Site 100050 SBID
7.1 Surface Metal Contamination -- Sodium 100051
7.1 Surface Metal Contamination -- Aluminum 100052
SEMI M18-0704 © SEMI 1990, 2004 29
Line Item EDI Code ID Sub Param ID
7.1 Surface Metal Contamination -- Potassium 100053
7.1 Surface Metal Contamination -- Chromium 100054
7.1 Surface Metal Contamination -- Iron 100055
7.1 Surface Metal Contamination -- Nickel 100056
7.1 Surface Metal Contamination -- Copper 100057
7.1 Surface Metal Contamination -- Zinc 100058
7.1 Surface Metal Contamination -- (Producer-User Defined Metal) 100059
7.1 Surface Metal Contamination -- (Producer-User Defined Metal) 100060
7.1 Surface Metal Contamination -- (Producer-User Defined Metal) 100061
7.1 Surface Metal Contamination -- (Producer-User Defined Metal) 100062
7.1 Surface Metal Contamination -- (Producer-User Defined Metal) 100063
7.1 Surface Metal Contamination -- (Producer-User Defined Metal) 100064
7.2 Surface Organics 100065
8.01 Front Surface Visual Inspection Specified According to SEMI M1 Table 1 100066
8.1 Scratches 100067
8.2 Pits 100068
8.3 Haze 100069
8.4 Localized Light Scatterers (LLS) 100070 ≥ 0.50µ
8.4 Localized Light Scatterers (LLS) 100071 ≥ 0.30µ
8.4 Localized Light Scatterers (LLS) 100072 ≥ 0.20µ
8.4 Localized Light Scatterers (LLS) 100073 ≥ 0.19µ
8.4 Localized Light Scatterers (LLS) 100074 ≥ 0.18µ
8.4 Localized Light Scatterers (LLS) 100075 ≥ 0.17µ
8.4 Localized Light Scatterers (LLS) 100076 ≥ 0.16µ
8.4 Localized Light Scatterers (LLS) 100077 ≥ 0.15µ
8.4 Localized Light Scatterers (LLS) 100078 ≥ 0.14µ
8.4 Localized Light Scatterers (LLS) 100079 ≥ 0.13µ
8.4 Localized Light Scatterers (LLS) 100080 ≥ 0.12µ
8.4 Localized Light Scatterers (LLS) 100081 ≥ 0.11µ
8.4 Localized Light Scatterers (LLS) 100082 ≥ 0.10µ
8.4 Localized Light Scatterers (LLS) 100083 ≥ 0.09µ
8.4 Localized Light Scatterers (LLS) 100084 ≥ 0.08µ
8.4 Localized Light Scatterers (LLS) 100085 ≥ 0.07µ
8.4 Localized Light Scatterers (LLS) 100086 ≥ 0.06µ
8.4 Localized Light Scatterers (LLS) 100087 ≥ 0.05µ
8.4 Localized Light Scatterers (LLS) 100088 ≥ 0.04µ
8.4 Localized Light Scatterers (LLS) 100089 ≥ 0.03µ
8.4 Localized Light Scatterers (LLS) 100090 ≥ 0.02µ
8.5 Contamination/Area 100091
8.6 Edge Chips 100092
8.7 Edge Cracks 100093
8.8 Cracks, Crow's Feet 100094
8.9 Craters 100095
8.10 Dimples 100096
8.11 Grooves 100097
8.12 Mounds 100098
SEMI M18-0704 © SEMI 1990, 2004 30
Line Item EDI Code ID Sub Param ID
8.13 Orange Peel 100099
8.14 Saw Marks 100100
8.15 Dopant Striation Rings 100101
8.16 Stains 100102
9.01 Back Surface Visual Inspection Specified According to SEMI M1 Table 1 100103
9.1 Edge Chips 100104
9.2 Cracks, Crow’s Feet 100105
9.3 Contamination/Area 100106
9.4 Saw Marks 100107
9.5 Stains 100108
9.6 Roughness 100109
9.7 Brightness 100110
11.1 Conductivity Type/Structure 100111
11.2 Dopant 100112
11.3 Silicon Source Gas 100113
11.4 Growth Method 100114
11.5 Net Carrier Density (Resistivity) 100115
11.6 Net Carrier Density Variation 100116
11.7 Thickness 100117
11.8 Thickness Variation 100118
11.9 Transition Width 100119
11.10 Flat Zone 100120
11.11 Phantom Layer 100121
12.1 Bow 100122
12.2 Warp Method 100123 SEMI MF657
12.2 Warp Method 100124 SEMI MF1390
12.3 Sori 100125
12.4 Flatness/Global 100126
12.5 Flatness/Site 100127 SF3R
12.5 Flatness/Site 100128 SF3D
12.5 Flatness/Site 100129 SFLR
12.5 Flatness/Site 100130 SFLD
12.5 Flatness/Site 100131 SFQR
12.5 Flatness/Site 100132 SFQD
12.5 Flatness/Site 100134 SBIR
13.01 Epi Front Surface Visual Inspection
Specified According to SEMI M2 Table 1 or SEMI M11 Table 1
100135
13.1 Stacking Faults 100136
13.2 Slip 100137
13.3 Large Point Defects 100138
13.4 Total Points Defects 100139
13.5 Scratches 100140
13.6 Dimples 100141
13.7 Orange Peel 100142
13.8 Cracks/Fractures 100143
13.9 Crow’s Feet 100144