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SEMI D23-0999 © SEMI 1999 6 Item Unit Value Definition & Formula Notes I. C.E.O. Cost of Equi pment Ow nership (68) C ost per Substrate ($/shee t) (56)/(67) 7 Related Documents 7.1 SEM I Standards SEMI E35 — Cost of …

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SEMI D23-0999 © SEMI 19995
Item Unit Value Definition & Formula Notes
Expenditures (to external) for
maintenance.
(48) Consumables ($/month) Monthly cost for scheduled
replacement parts.
(49) Scheduled
Maintenance
($/month) Monthly cost for scheduled
maintenance.
Forecast maintenance
Maintenance
Costs
(50) Other ($/month) Monthly maintenance costs not
included in above items.
(51) Maintenance
Subtotal
($/month) Subtotal of monthly
expenditures (to external) for
maintenance; sum of (48)
through (50).
(52) Running Cost
Subtotal
($/month) Monthly running cost total:
(41) + (47) + (51).
E. Labor
Costs
In-house labor costs
(53) Operator ($/month) Equipment operator monthly
labor cost
(54) In-house
maintenance
($/month) Equipment maintenance
monthly labor cost
(55) Labor Cost
Subtotal
($/month) Subtotal of above costs (53) +
(54).
Managers and engineers
not included.
F. Cost Total
(56) Cost ($/month) Total monthly costs necessary
for operation of equipment: (11)
+ (16) + (22) + (28) + (31) +
(52) + (55).
G. Runtime
(57) Operating time (hr/month) Hours per month of factory
operation
(58) 1-Item process
time
(hr/
process)
Process recipe exchange time
(59) Number of
processes/month
(process/
month)
Number of process recipe
exchanges per month
(60) Process time (hr/month) Hour per month of process
recipe exchange (58) × (59)
(61) Scheduled
maintenance time
(hr/month) Monthly scheduled maintenance
time
(62) Start-up
inspection time
(hr/month) Time necessary, per month, for
start-up.
(63) Down time
(mc failure)
(hr/month) Down time, per month, for
machine failure.
(64) Other down time (hr/month) Down time, per month, not
included in above items.
Product wait time not
included.
(65) Run time (hr/month) Monthly operation time (57) –
[Σ (60) through (64)].
H. Process
Capacity
(66) Sheets/hour (sheets/hr) Number of sheets processed per
hour
(67) Process capacity (sheets/
month)
Number of sheets processed per
month (65) × (66)
SEMI D23-0999 © SEMI 1999 6
Item Unit Value Definition & Formula Notes
I. C.E.O. Cost
of Equipment
Ownership
(68) Cost per
Substrate
($/sheet) (56)/(67)
7 Related Documents
7.1 SEMI Standards
SEMI E35 — Cost of Ownership for Semiconductor
Manufacturing Equipment Metrics
SEMI E35.1 — Guide for Cost of Equipment
Ownership Comparison Metric
7.2 STEP ‘95 COO & RAM Textbook
FPD Expo ‘95 Tutorial Seminar Textbook — a-Si TFT-
LCD Front End Manufacturing Technology – Cost
Reduction Seen from a Production Technology
Viewpoint
NOTE 1: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI D24-0200 © SEMI 20001
SEMI D24-0200
SPECIFICATION FOR GLASS SUBSTRATES USED TO
MANUFACTURE FLAT PANEL DISPLAYS
This specification was technically approved by the Global Flat Panel Display – Material and Components
Committee and is the direct responsibility of the North American Flat Panel Display Committee. Current
edition approved by the North American Regional Standards Committee on September 3, 1999. Initially
available on SEMI OnLine November 1999; to be published February 2000.
1 Purpose
1.1 This standard specifies selecte d geometrical
requirements of glass substrates used to manufacture
flat panel displays.
2 Scope
2.1 This standard is intended to se t levels of
specification for glass substrates to insure repeatable
manufacture of flat panel displays and uniformity of
substrates from all vendors. This standard will also
insure inter-changeability at all mechanical interfaces
within process tools as well as with Transportation and
Automation Cassettes.
2.2 This standard does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
3 Limitations
3.1 Substrate size (edge length and width) and
thickness are not specified so as not to infringe on
supplier/customer relationships. Wherever possible,
tolerances are specified independent of substrate size.
Additional documents will be developed to specify the
standard method of measuring each dimension.
4 Referenced Standards
4.1 SEMI Standards
SEMI D3 — Quality Area Specification for Flat Panel
Display Substrates
SEMI D4 — Method for Referencing Flat Panel
Display Substrates
SEMI D5 — Standard Size for Flat Panel Display
Substrates
SEMI D6 — Specification for Edge Length and
Thickness for Flat Panel Display Mask Substrates
SEMI D7 — FPD Glass Substrate Surface Roughness
Measurement Method
SEMI D9 — Definitions for Flat Panel Display
Substrates
SEMI D12 — Specification for Edge Condition of Flat
Panel Display (FPD) Substrates
SEMI D15 — FPD Glass Substrate Surface Waviness
Measurement Method
4.2 ISO Standard
1
ISO 1101 — Technical drawings — Geometrical
Tolerances — Tolerances of Form, Orientation,
Location and Run-Out — Generalities, definitions,
symbols, indications on drawings
NOTE 1: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
5 Terminology
5.1 FPD Waviness W
fpd
— surface profile calculated
by a moving minimum zone method. It is expressed as
the maximum value of a minimum zone method
straightness of a certain sampling within an evaluation
length. An approximation in Appendix 1 of SEMI D15
can be used as well.
NOTE 2: It is recommended that the computer approximation
method described in Appendix 1 of SEMI D15 be used.
5.2 minimum zone method straightness — the smallest
distance between two parallel straight lines between
which all of objective profile is included (see ISO 1101,
Section 3.1).
5.3 reference edges — the two edges adjacent to the
orientation corner.
5.4 squareness — the total variatio n of the position of
the short sides of a substrate relative to straight lines
drawn between the ends of, and perpendicular to, the
long reference edge of the substrate.
5.5 warp — the gap between a) the bottom surface of
an FPD substrate and b) the reference plate on which
the substrate rests.
NOTE 3: Warp in other applications has traditionally been the
TIR, or peak-to-valley of a surface (top, or bottom or median
surface) of a substrate, measured with respect to a reference
plane.
1 ISO Central Secretariat, C.P. 56, CH-1211 Geneve 20, Switzerland;
available in the U.S. from American National Standards Institute, 11
West 42nd Street, 13th Floor, New York, NY 10036