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SEMI D28-1101 © SEM I 2001 3 X1 Z 1 Z 4 X2 Z5 E xclu s i on Z o ne Verti ca l D a t u m Pl a ne Z2 A X 3 Figure 1B Front View of Tool port
SEMI D28-1101 © SEMI 2001 2
6.2.9 Z4 — height of exclusion zone required for MGV
cart alignment equipment.
6.2.10 Z5 — height of exclusion fork zone below the
horizontal datum plane, which is needed by the
transport equipment in loading cassettes.
7 Requirements
7.1 Dimensions and tolerances of the required
characteristics are shown in Table 1 as well as Figures
1A and 1B.
7.2 The cassette is stored horizontally with the shorter
side parallel to the tool face and horizontal datum
plane.
Z5
Y3
Z4
Tool
Tool face
(Equipment
Boundary)
Horizontal Datum Plane
Y2 Y1
Facial datum plane
(cassette centroid)
Figure 1A
(Arrow ’A’ View)
Side View of Tool port
SEMI D28-1101 © SEMI 20013
X1
Z1
Z4
X2
Z5
Exclusion
Zone
Vertical
Datum Plane
Z2
A
X
3
Figure 1B
Front View of Tool port
SEMI D28-1101 © SEMI 2001 4
Table 1 Substrate Edge Length, Interface Dimensions, and Tolerances
Interface Dimensions and Tolerances[mm]
Substrate Edge
Length [mm]
X1
max.
X2
max.
X3
max.
Y1
max.
Y2
max.
Y3
max.
Z1
± 2 mm
Z2
max.
Z4
max.
Z5
max.
550 × 650
925 450 600 500 440 130 900, 950 1000 150 250
600 × 720
980 500 600 535 475 130 900, 1000 1000 150 250
680 × 880
1100 560 600 615 565 130
1000,
1100
1000 150 300
730 × 920
1150 600 600 630 590 130
1000,
1100
1000 150 300
800 × 950
1200 660 600 650 605 130
1000,
1100
1000 150 300
NOTE 1: Two values are specified for Z1, either value can be chosen.
8 Related Documents
8.1 SEMI Standards
SEMI D5 — Standard Size for Flat Panel Display
Substrates
SEMI D11 — Specification for Flat Panel Display
Glass Substrate Cassettes
SEMI D16 — Specification for Mechanical Interface
Between Flat Panel Display Material Handling System
and Tool Port
8.2 Semiconductor Equipment Association of Japan
(SEAJ)
Semiconductor Equipment Association of Japan (SEAJ)
Liquid Crystal Display Manufacturing Equipment
Standardization Guideline – for Glass Substrate Size
800 × 950 (SEAJ/P-S3005-98, SEAJ/P-S3006-98), June
1998
1
8.3 SEMI PCS-FPD
SEMI PCS-FPD — Production Cost Saving (PCS)
Forum – FPD Phase III Report, June 1999
2
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
1 Semiconductor Equipment Association of Japan, 7-10, Shinjuku 1-
chome, Shunjuku-ku, Tokyo, 160-0022 Japan, tel:+81-3-3353-7589,
fax:+81-3-3353-7970, http://www.seaj.or.jp
2 SEMI PCS-FPD Production Cost Saving (PCS) Forum – FPD
Phase III Report, June 1999, Semiconductor Equipment and
Materials International, 3081 Zanker Road , San Jose, CA 95134-
2127 U.S.A.tel.+1-408-943-6900 fax:+1-408-428-9600
http://www.semi.org
product data sheets, and other relevant literature with
respect to any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyright material or of an invention covered by patent
rights. With publication of this standard, SEMI takes no
position in respect to the validity of any patent rights or
copyrights asserted in connection with any item
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk or infringement of
such rights, are entirely their own responsibility.