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SEMI E69-0298 © SEMI 1998, 2003 10 NOTICE: SEMI makes no warranties or representations as to the suitability o f the standards set forth herein for any particular application. The determination of the suitability of the …

SEMI E69-0298 © SEMI 1998, 2003 9

13.3 Repeat Sections 13.2.1–13.2.6, for a total of three

times, until at least six sets of data have been collected

at each setpoint (with the exception of 100%).

13.4 Repeat Sections 13.1.1–13.3 weekly for a period

of at least 12 weeks. During the idle time, the MFC

should be continuously powered, with any exceptions

so noted. Gas flow is not required during the idle time,

but any gas flow shall be recorded. Finally, record all

details about the conditions of the MFC during the idle

time.

14 Data Analysis

14.1 Calculations

14.1.1 Determine the precision at a setpoint by

calculating the standard deviation of all the measured

values (both upscale and downscale) for that setpoint.

Perform this calculation at each setpoint:

−

)

∑

()

∑

P = Precision

The i

reading at a setpoint for a given cycle

Average measured value

umber of readings at a setpoint for a given cycle

14.1.2 Determine the short-term reproducibilty at a

setpoint by dividing the precision of the setpoint by the

average setpoint. This is expressed as a percentage of

setpoint. Perform this calculation at each point:

SRS% =

× 100

14.1.3 The long term reproducibility at a setpoint is the

greatest absolute weekly reproducibility at a setpoint.

14.1.4 Determine the precision over the test period at a

setpoint by calculating the standard deviation of all the

measured values (both upscale and downscale) for that

setpoint. Perform this calculation at each setpoint:

( V

−

)

∑

(

)

∑

( )

∑

(

)

∑

= Precision over the test period

The i

reading at a setpoint for a given cycle

Average measured

umber of readings at a setpoint for a given cycle

w =

umber of weeks

14.1.5 Determine the reproducibility at a setpoint by

dividing the precision over the test period at this

setpoint by the average setpoint. This is expressed as a

percentage of setpoint. Perform this calculation at each

setpoint:

RS% =

× 100

14.1.6 The overall reproducibility of the DUT is the

maximum value calculated in Section 14.1.4:

RD% = RS

max

RD = Reproducibility of the device

14.1.7 Calculate zero drift by subtracting the minimum

zero value from the maximum zero value and dividing

by two. This number is reported as ± sccm or slm over

the specified time period.

15 Data Presentation

15.1 Plot the average measured value of each setpoint

(10%, 50%, 100%) for each measurement period on a

graph, with the x-axis representing time, and the y-axis

showing the actual flow output in sccm or slm.

15.2 Plot the measured value at zero for each

measurement period on a graph, with the x-axis

representing time and the y-axis showing flow output

signal in sccm or slm.

15.3 Reproducibility — Report a single number, as

calculated above, as a percentage of reading stated, with

the time period of the test.

15.4 Zero Drift — Report a single number, as

calculated above, stated with the time period of the test.

16 Related Documents

16.1 SEMI

Standard

SEMI E67 — Test Method for Determining Reliability

of Mass Flow Controller (Refer to this standard if

reliability data is needed for some of the parameters

tested in this method.)

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

SEMI E69-0298 © SEMI 1998, 2003 10

NOTICE: SEMI makes no warranties or

representations as to the suitability of the standards set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer’s instructions, product labels,

product data sheets, and other relevant literature

respecting any materials mentioned herein. These

standards are subject to change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI E70-1103 © SEMI 1998, 2003 1

SEMI E70-1103

GUIDE FOR TOOL ACCOMMODATION PROCESS

This guide was technically approved by the Global Facilities Committee and is the direct responsibility of the

North American Facilities Committee. Current edition approved by the North American Regional Standards

Committee on September 3, 2003. Initially available at www.semi.org September 2003; to be published

November 2003. Originally published June 1998.

1 Purpose

1.1 This document will provide an overview of the

various elements of Tool Accommodation, a

methodology by which semiconductor processing

equipment is installed in a cost-effective and timely

manner. This addition to the SEMI Tool

Accommodation Standards set describes the process by

which the referenced SEMI documents can be

effectively used to achieve tool installation cost and

schedule goals.

2 Scope

2.1 This overview document will provide process

development, facilities, manufacturing, and sales

engineers (as well as purchasing agents and managers)

with a basic understanding of the various elements in a

Tool Accommodation methodology. This process

emphasizes quality, completeness, timeliness, and cost-

effectiveness as key elements of successfully installing

semiconductor processing equipment into wafer

fabrication facilities. By describing a generic process

flow, this document identifies a road map for using

published standards that comprehend all the procedures

involved in tool accommodation from procurement

through acceptance. As a common ground for

communication and comparison, terms and definitions

are also included.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Referenced Standards

3.1 SEMI Standards

SEMI E6 — Guide for Semiconductor Equipment

Installation Documentation

SEMI E10 — Specification for Definition and

Measurement of Equipment Reliability, Availability,

and Maintainability (RAM)

SEMI E45 — Test Method for the Determination of

Inorganic Contamination from Minienvironments Using

Vapor Phase Decomposition-Total Reflection X-Ray

Spectroscopy (VPD-TXRF), VPD-Atomic Absorption

Spectroscopy (VPD-AAS), or VPD/Inductively

Coupled Plasma-Mass Spectrometry (VPD/ICP-MS

SEMI E49 — Guide for Standard Performance,

Practices, and Sub-Assembly for High Purity Piping

Systems and Final Assembly for Semiconductor

Manufacturing Equipment

SEMI E49.1 — Guide for Tool Final Assembly,

Packaging and Delivery

SEMI E49.2 — Guide for High Purity Deionized Water

and Chemical Distribution Systems in Semiconductor

Manufacturing Equipment

SEMI E49.3 — Guide for Ultrahigh Purity Deionized

Water and Chemical Distribution Systems in

Semiconductor Manufacturing Equipment

SEMI E49.4 — Guide for High Purity Solvent

Distribution Systems in Semiconductor Manufacturing

Equipment

SEMI E49.5 — Guide for Ultrahigh Purity Solvent

Distribution Systems in Semiconductor Manufacturing

Equipment

SEMI E49.6 — Guide for Subsystem Assembly and

Testing Procedures - Stainless Steel Systems

SEMI E49.7 — Purity Guide for the Design and

Manufacture of Ultrapure Water and Liquid Chemical

Systems in Semiconductor Process Equipment

SEMI E49.8 — Guide for High Purity and Ultrahigh

Purity Gas Distribution Systems in Semiconductor

Manufacturing Equipment

SEMI E51 — Guide for Typical Facilities Services and

Termination Matrix

SEMI S4 — Safety Guideline for the

Segregation/Separation of Gas Cylinders Contained in

Cabinets

3.2 ISO Standards

ISO 14644-1 — Cleanrooms and associated controlled

environments Part 1: Classification of air cleanliness.

1 International Organization for Standardization, ISO Central

Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,

Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30,

Website: www.iso.ch