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SEMI E25-92 © SEMI 1992, 2004 3 Figure 1 Figure 2 7 Related Documents 7.1 SEMI Docume nts SEMI E6 — SEMI Facilities Interface Specifications Guideline and Form at

SEMI E25-92 © SEMI 1992, 2004 2

4.3 Outboard Plane — The outboard surface should be

limited to non-rigid lines. To minimize potential

mechanical damage, chemical utilities should not enter

through the lower half of this surface.

4.4 Sides — In order to facilitate maintenance access,

utilities and facility services should not penetrate the

module envelope sides.

4.5 Top Surface — The top surface is preferred for

power, exhaust, process gases and make-up air.

Communications and electronic control harnesses could

also enter through this surface.

4.6 Bottom Surface — The bottom surface is preferred

for vacuum lines and all liquid supplies, returns and

drains. The location of all lines should not restrict the

removal of the module.

5 Module Considerations

5.1 The locations of utility and facility lines and

connections to the module, which is located within the

module envelope, are given below.

5.2 Exhaust, Vacuum and Make-up Air — The size of

piping for exhaust, vacuum and make-up air suggests

that the module sides are undesirable locations for

connections.

5.3 Maintenance Access — Utility and facility lines

and connections to the module sides should not com-

promise maintenance access to the module. Connect-

ions should be located above or below areas requiring

periodic maintenance access.

5.4 Liquids — Liquid supply connections to the

module sides should be as low as practical.

5.5 Electrical Components — Electrical components

that need to be accessible for maintenance while

energized should not be located at the sides of the

module. (See SEMI S2.)

5.6 Remote Equipment — For ease of maintenance

access, some pieces of equipment (for example, coolant

chiller and RF power supplies) may be located outside

the module envelope. In such cases, the lines and

connections between the remote equipment and the

module should follow this guideline.

6 Examples

6.1 The relationship between the location of specific

utility and facility lines entering the module envelope

and their subsequent routing and connection to the

module within the module envelope is illustrated by the

following examples.

6.2 Liquid Connections — Two suggested methods of

providing liquid connections are shown in Figures 1

and 2. The liquid lines enter through the bottom of the

module envelope (see Section 4.5) then connect to

either the side of the module or the bottom of the

module (see Section 5.3).

6.3 Gas Connections — Two suggested methods of

providing gas connections are shown in Figure 2. The

gas lines pass through the top of the module envelope

(see Section 4.4), and then connect to the module either

at the top or at the side.

6.4 Exhaust and/or Make-Up Air — Two suggested

methods of providing exhaust and/or make-up air

connections are shown in Figure 2. The exhaust line

passes through the top of the module envelope (see

Section 4.4) and then connects to the module at or near

the top. Exhaust and make-up air connections are

flanged in Figure 2.

SEMI E25-92 © SEMI 1992, 2004 3

Figure 1

Figure 2

7 Related Documents

7.1 SEMI Documents

SEMI E6 — SEMI Facilities Interface Specifications

Guideline and Format

SEMI E26 — Radial Cluster Tool: Module Footprint

Standard.

NOTICE: SEMI makes no warranties or

representations as to the suitability of the guidelines set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer's instructions, product labels,

product data sheets, and other relevant literature,

respecting any materials or equipment mentioned

herein. These standards are subject to change without

notice.

By publication of this guideline, Semiconductor

Equipment and Materials International (SEMI) takes no

position respecting the validity of any patent rights or

copyrights asserted in connection with any item

mentioned in this guideline. Users of this guideline are

expressly advised that determination of any such patent

rights or copyrights, and the risk of infringement of

such rights are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of

the contents in whole or in part is forbidden without express written

consent of SEMI.