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SEMI G74-0699 © SE MI 1998, 1999 2 Figure 1 300 mm Tape Frame D i mens ions
SEMI G74-0699 © SEMI 1998, 19991
SEMI G74-0699
SPECIFICATION FOR TAPE FRAME FOR 300 mm WAFERS
This specification was technically approved by the Global Assembly & Packaging Committee and is the
direct responsibility of the Japanese Packaging Committee. Current edition approved by the Japanese
Regional Standards Committee on March 17, 1999. Initially available at www.semi.org May 1999; to be
published June 1999. Originally published June 1998; previously published September 1998.
1 Purpose
1.1 The purpose of this document is to standardize the
specifications for 300 mm wafer tape frames used
between the dicing process and the die-bonding
process.
2 Scope
2.1 This standard documents the d imensions,
characteristics, and measurement methods for 300 mm
wafer tape frames.
2.2 This standard can be used as th e specification
sheet for tape frame upon purchasing.
2.3 This standard uses the SI unit system.
3 Referenced Documents
NOTE: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
3.1 ANSI Standard
1
ANSI/ASME B46.1 — Surface Texture (Surface
Roughness, Waviness, and Lay)
3.2 ISO Standards
2
ISO4287 Part 1 — Surface Roughness Terminology
Part 1: Surface and Its Parameters
3.3 JIS Standards
3
JIS B0601 — Surface Roughness - Definitions and
Designations
JIS Z2245 — Method of Rockwell and Rockwell
Superficial Hardness Test
4 Terminology
4.1 tape frame — the frame which applies the wafer
tape to the wafer and retains the wafer.
1
American National Standards Institute, 1430 Broadway, New York,
NY 10018
2
International Organization for Standardization, C.P. 56, CH-1211
Geneva 20, Switzerland
3
Japanese Standards Association, 1-24, Akasaka 4 Chome, Minato-
ku, Tokyo, Japan
4.2 wafer tape — an adhesive plastic tape which
retains the wafer or diced chip. It is used between the
dicing process and the die-bonding process.
5 Ordering Information
5.1 Purchase orders for tape frames furnished to this
specification shall include quantity.
6 Requirements
6.1 Dimensions — See Table 1 and Figure 1.
Table 1 300 mm Tape Frame Dimensions
Symbol Dimension (mm
unless noted))
Note
φ A
350 ± 0.5 Inner diameter
φ B
400 ± 0.5 Outer diameter
C 380 + 0/-0.5 Width between two cords
D 380 + 0/-0.5 Width between two cords
E 170.4 Outline dimension
F 172 Outline dimension
G 86 Outline dimension
H 90 Outline dimension
I 120°
J 60° Partition out with diameter N as
standard
tK 1.5 or (1.2) Plate thickness
L 190
M 190 Frame warpage
φ N
3.2 Pin diameter
P 100 ± 0.2 Diameter N position
Q 18 ± 0.2 Diameter N position
R 276 1 Notch position
S 19.6 ± 0.2 1 Notch position
NOTE 1: Plate thickness of 1.5 mm is recommended.
NOTE 2: No burrings on the edges.
NOTE 3: Surface Roughness: R
max
≤ 1 µm, R
a
≤ 0.1 µm;
(surface indicated as ∆) unindicated Cut Surface Roughness:
R
max
≤ 100 µm, R
a
≤ 25 µm.
SEMI G74-0699 © SEMI 1998, 1999 2
Figure 1
300 mm Tape Frame Dimensions
SEMI G74-0699 © SEMI 1998, 19993
6.2 Surface Hardness — HRc ≥ 47
6.3 Resiliency — Must return to original shape, where
the linear scale ruler reads 0, after one side is held firm
and the other is bent with a force of 30 N for 60
seconds.
6.4 Surface Roughness — R
a
≤ 0.1 µm, R
max
is within
≤ 1.0 µm
6.5 Flatness — Within 0.3 mm
7 Test Methods
7.1 Dimensions — To be measured with a measuring
device, such as a caliper, with a precision of 0.05 mm.
7.2 Surface Hardness — To be me asured according to
the method in JIS Z2245 with a Rockwell Hardness
Tester.
7.3 Resiliency — Secure one side of the frame in a
vice, and bend with a force of 30 N for 60 seconds.
After that, release the frame and measure the change
from the original shape with a linear scale ruler. The
linear scale ruler should have a precision of at least 0.5
mm.
7.4 Surface Roughness — Measur e with a surface
roughness gauge. Surface roughness is measured
perpendicular to the undulation and must be shown as
roughness average (R
a
) and maximum peak-to-valley
roughness height (R
max
). Refer to ISO4287 Part 1, JIS
B0601, and ANSI/ASME B46.1.
7.5 Flatness — Place the frame on a surface with
near-zero flatness. Measure the lowest point and the
highest point on the frame with a height gauge, and
record the difference in these values. Turn the frame
over and repeat the process. The flatness will be the
larger of the two values.
8 Certification
8.1 Upon request of the purchaser in the contract or
order, a manufacturer's or supplier's certification that
the material was manufactured and tested in accordance
with this specification, together with a report of the test
results, shall be furnished at the time of shipment.
9 Packing and Package Lab eling
9.1 The product must be packaged appropriately to
prevent deformities, moisture, and contamination, as
well as damage during normal shipping.
9.2 The products must be clearly m arked with the
purchase number, quantity, gross weight, and supplier's
name.
9.3 Special packaging and delivery requests will be
decided between the supplier and the purchaser at time
of purchase.
9.4 Surface Hardness — HRc ≥ 47
9.5 Resiliency — Must return to o riginal shape, where
the linear scale ruler reads 0, after one side is held firm
and the other is bent with a force of 30 N for 60
seconds.
9.6 Flatness — Within 0.3 mm