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SEMI F79-0703 © SEMI 2003 5 8.16 P. B. Henderson, et al. “Cylinder Package Effects on the Purity of Electroni c Specialty Gases.” Solid State Technology, pg. S5, June 1997. 8.17 H. Kobayashi. “How Gas Panels Affect Conta…

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In summary, it is recommended that neither silicon,
silicon dioxide nor silicon nitride be in the wetted
path when fluorine, F
2
, or the halogen fluorides,
ClF
3
, BrF
3
, BrF
5
, and IF
5
, plus XeF
2
are in use.
6.9 Organo-metallic and Siloxanes
6.9.1 References (1, 2, 3, 4, 5, 64, 65, 66) are cited
which indicate these compounds do not react with
silicon under the prescribed conditions.
6.10 Oxygen and Oxides and Sulfides
6.10.1 References (1, 2, 3, 4, 5, 64, 65, 66) are cited
which indicate these gases do not react with silicon
under the prescribed conditions.
6.11 Nitrogen and Nitrogen Compounds
6.11.1 References (1, 2, 3, 4, 5, 64, 65, 66) are cited
which indicate these gases do not react with silicon
under the prescribed conditions.
6.12 Acids
6.12.1 Aqueous HF is the only single acid reported to
etch silicon (70). Combinations of fluoride ions in
solution with an oxidizing acid such as HNO
3
in an
aqueous solution will etch silicon at practical rates (5,
54, 60, 64, 65, 66, 67, 68, 69).
6.12.2 Madou (70) has an excellent review of the
mechanisms required for aqueous based etching; he
cites Hu and Kerr (72) to report an etch rate of
0.3° A/min. for n-type, 2 ohm-cm (111) silicon in a 48%
HF solution at 25° C. Madou points out the strong
dependence of etch rate in aqueous solutions on doping
level, light conditions and relative potential.
NOTE 1: Most bases will etch silicon and silicon dioxide; the
oxide is etched very slowly.
6.13 Other
6.13.1 As currently designated these are materials in
SEMI E52-0302 not encountered in mass flow
controllers under typical conditions. The manufacturer
should be consulted.
7 Cautions and Warnings
7.1 The reader is specifically requested to consult the
MSDS and the manufacturer’s recommended practices
of any gas or liquid prior to use and to follow the
suggestions prescribed.
7.1.1 All other appropriate safety procedures should be
followed as well.
8 Related Documents
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SEMI F79-0703 © SEMI 2003 5
8.16 P. B. Henderson, et al. “Cylinder Package Effects
on the Purity of Electronic Specialty Gases.” Solid
State Technology, pg. S5, June 1997.
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