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SEMI E6-0303 © SEMI 1982, 2003 1 SEMI E6-0303 GUIDE FOR SEMICONDUCTOR EQUIPMENT INSTALLATION DOCUMENTATION This guide was technically approved b y the Global Fa cilites Committee and is the direct responsibility of the N…

SEMI E2.5-93 © SEMI 1993, 2003 2

NOTICE: These standards do not purport to address safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish appropriate safety and health practices and determine the

applicability of regulatory limitations prior to use. SEMI makes no warranties or representations as to the suitability

of the standards set forth herein for any particular application. The determination of the suitability of the standard is

solely the responsibility of the user. Users are cautioned to refer to manufacturer's instructions, product labels,

product data sheets, and other relevant literature respecting any materials mentioned herein. These standards are

subject to change without notice.

The user's attention is called to the possibility that compliance with this standard may require use of copyrighted

material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position

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standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights, are entirely their own responsibility.

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consent of SEMI.

SEMI E6-0303 © SEMI 1982, 2003 1

SEMI E6-0303

GUIDE FOR SEMICONDUCTOR EQUIPMENT INSTALLATION

DOCUMENTATION

This guide was technically approved by the Global Facilites Committee and is the direct responsibility of the

North American Facilities Committee. Current edition approved by the North American Regional Standards

Committee on November 22, 2002. Initially available at www.semi.org January 2003; to be published March

2003. Originally published in 1982; previously published December 1996.

NOTICE: This document was balloted as a complete

rewrite of SEMI E6 in 2002.

1 Purpose

1.1 Within the semiconductor industry, the diversity

and complexity of equipment creates difficult

challenges for facilities design and equipment

installation. This guide should benefit equipment

suppliers and semiconductor manufacturers by

communicating, in a standardized way, the information

necessary to prepare the facility and to efficiently install

semiconductor equipment.

2 Scope

2.1 This standard applies to the facilities interface of

all semiconductor production equipment and supplier-

provided support equipment.

2.2 The recommended equipment installation

documentation should cover all installation

requirements from receiving until hookup is complete.

2.3 The series of data sheets included should address

all site facilities necessary to support semiconductor

equipment processing.

2.4 The data sheets provide a consistent format for

both the equipment supplier and equipment purchaser

to use in compiling and interpreting equipment

installation data.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Limitations

3.1 SEMI E6 applies to the facility interface of

semiconductor equipment only. Other equipment

interfaces, such as the physical interfaces for material

handling (see SEMI E106 and related standards) and

software interfaces (see SEMI Information and Control

Standards) are defined by other SEMI Standards.

3.2 This guide is not intended to address the internal

connections of the equipment that are typically

completed by the equipment supplier. This document

includes only information related to the utility

connections on the equipment or support equipment

that are the responsibility of the semiconductor

manufacturer’s equipment installation team.

3.3 This guide is not intended to address the

documentation provided for equipment start-up,

qualification, or commissioning.

4 Referenced Standards

4.1 SEMI Standards

SEMI E30 — Generic Model for Communications and

Control of Manufacturing Equipment (GEM)

SEMI E52 — Practice for Referencing Gases Used in

Digital Mass Flow Controllers

SEMI E63 — Mechanical Specification for 300 mm

Box Opener/Loader to Tool Standard (BOLTS-M)

Interface

SEMI E70 — Guide for Tool Accommodation Process

SEMI E72 — Specification and Guide for 300 mm

Equipment Footprint, Height, and Weight

SEMI E73 — Specification for Vacuum Pump

Interfaces - Dry Pumps

SEMI E74 — Specification for Vacuum Pump

Interfaces - Turbomolecular Pumps

SEMI E76 — Guide for 300 mm Process Equipment

Points of Connection to Facility Services

SEMI E106 — Provisional Overview Guide to SEMI

Standards for Physical Interfaces and Carriers for 300

mm Wafers

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

SEMI E6-0303 © SEMI 1982, 2003 2

5 Terminology

NOTE 1: A complete list of equipment installation

terminology can be found in SEMI E70.

5.1 Definitions

5.1.1 idle — the condition where the equipment is

energized and readied for processing (all systems ready

and temperatures controlled) but is not actually

performing any active function such as material

movement or processing.

5.1.1.1 idle average flow — the average flow rate

when the equipment is in idle condition. Idle average

flow should be measured at the equipment point of

connection.

5.1.2 maximum pressure — the highest supply pressure

that can be used for the equipment to operate correctly.

Maximum pressure should be measured at the

equipment point of connection and may be driven by

process requirements or component limits.

5.1.3 maximum pressure fluctuation — the maximum

supply pressure change during the processing cycle for

the equipment to operate correctly.

5.1.4 minimum pressure — the minimum supply

pressure that must be maintained or exceeded for the

equipment to operate correctly. Minimum pressure

should be measured at the equipment point of

connection.

5.1.5 processing cycle — a sequence wherein all of the

material contained in a processing unit is processed.

This is often used as a measure of action or time [SEMI

E30]. (See Figure 1.)

5.1.5.1 process average flow — the average flow rate

over the processing cycle. Process average flow should

be measured at the equipment point of connection.

6 Ordering and Use

6.1 Semiconductor manufacturers may use this

standard when procuring semiconductor equipment to

specify type and format of facility interface information

to be provided by equipment supplier.

6.2 Orders for semiconductor equipment in accordance

with this standard should include the standard number

and date of issue. The request should also include

documentation due date, the data transmission method,

file format for data, file format for drawings, and any

additional information to be included that is not covered

in SEMI E6.

6.3 Roles and Responsibilities — The equipment

supplier submits information requested in SEMI E6.

Unless otherwise specified, equipment suppliers should

submit the utilities and installation information prior to

the equipment ship date. The semiconductor

manufacturer’s equipment engineers, facilities

engineers, and installation managers use equipment

information provided to prepare the facility and

efficiently install the tool.

7 Installation Documentation

Recommendations

7.1 Consider every step from receiving until hookup is

complete. All requirements should be indicated. The

following is a list of recommended equipment

installation documentation to be provided by the

equipment supplier.

7.1.1 Administrative Interface Information — The

administrative interface information should include an

installation contacts sheet naming all relevant supplier

and purchaser contacts for commercial and technical

questions. Also included should be installation roles

and responsibilities for the supplier and purchaser. (See

Related Information 1 at the end of this document.)

7.1.2 Shipping and Receiving Information —

Documentation should include information such as

container inventory, storage, and unpacking

instructions. Suppliers should include information about

the size, weight, type and number of containers in

which this equipment is shipped. Include detailed lists

of all supplied components and parts. How the

containers are to be received, handled and stored should

be documented. Any special staging, inspection, and

uncrating instructions should be provided. If containers

cannot be unloaded by hand the necessary equipment

should be listed. (See Related Information 2.)

7.1.3 Move-in, Placement, and Assembly Instructions

— Documentation should include information such as

moving, positioning, wall mounting, leveling,

alignment, floor loading, floor mounting, pedestal

mounting, and seismic restraint of equipment. Detailed

instructions should be provided for all assembly and

hookup steps required to make the equipment

functional. List any necessary parts, resources and

special equipment to be provided by the purchaser. (See

Related Information 3.)

7.1.4 Installation ESH Information — Document any

concerns relating to environmental, safety, and health

aspects of installation of the equipment (see related

SEMI Safety Guidelines).

7.1.5 Data Sheets and Drawings — Recommended

data sheets are defined in the following sections of this

document. Equipment suppliers should reference and

provide all necessary equipment drawings and

schematics with these data sheets. (See Sections 9

through 19.)