semi合集-English.pdf - 第318页
SEMI E49-1104 © SEMI 1995, 2004 4 5.1.5 Final Assembl y Contamination Cont rol — Will result in reduced possibility o f cleanroom contaminat ion upon to ol delivery, and avoi d time delay of tool cleaning at wafer fab si…
SEMI E49-1104 © SEMI 1995, 2004 3
3.5 National Fire Protection Association
4
NFPA Fire Protection Guide to Hazardous Materials
NFPA 704 — Standard System for the Identification of
the Hazards of Materials for Emergency Response
3.6 Military Standard
5
MIL-STD-105 — Sampling Procedures and Tables for
Inspection by Attributes
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 Abbreviations and Acronyms
4.1.1 Ar — argon
4.1.2 C
v
— valve flow coefficient
4.1.3 CVD — chemical vapor deposition
4.1.4 DSF — dead space free
4.1.5 DIW — deionized; for this document, used as
deionized water
4.1.6 ESCA — electron spectroscopy for chemical
analysis (also known as XPS)
4.1.7 FTIR — Fourier transform infrared
4.1.8 HD — high density, i.e., polymer
4.1.9 HP — high purity
4.1.10 HPM — hazardous production material
4.1.11 IEEE — Institute of Electrical and Electronics
Engineers, Inc.
4.1.12 ID/OD — inside/outside (i.e., diameter)
4.1.13 IPA — isopropyl alcohol
4.1.14 MFC — mass flow controller
4.1.15 MTBA — mean time between assists
4.1.16 MTBF — mean time between failure
4.1.17 MTTR — mean time to repair
4.1.18 PFA — perfluoroalkoxy
4.1.19 PPB — parts per billion
4.1.20 PTFE — polytetrafluoroethylene
4 National Fire Protection Association, Batterymarch Park, Quincy,
MA 02269, Telephone: 617-770-3000, Fax: 617-770-0700, Website:
www.nfpa.org
5 Military Specifications, Commanding Officer, Naval Publications,
and Forms Center, Attention: MPFC 105, 5801 Tabor Avenue,
Philadelphia, PA 19120
4.1.21 PVDF — polyvinylidene fluoride
4.1.22 QA — quality assurance
4.1.23 QC — quality control
4.1.24
R
a — roughness average (e.g., surface)
4.1.25 SMTR — Smelter’s test report
4.1.26 SPC — statistical process control
4.1.27 TEOS — tetraethylorthosilicate
4.1.28 TOC — total organic carbons
4.1.29 UHP — ultrahigh purity
4.1.30 WC — water column, inches (cm) of water
4.1.31 XPS – X-ray photoelectron spectroscopy
4.2 Definitions
4.2.1 high purity (HP) — for industry standard systems
consisting of high grade materials, components, and
standard design/configuration, assembly method, and
performance capability.
4.2.2 ultrahigh purity (UHP) — for advanced or
special systems consisting of higher grade materials and
components, with advanced or integrated design and
configuration, the latest assembly methods, and
enhanced performance capabilities, especially related to
purge or rinse time and contamination levels.
4.2.3 subassembly — an assembled unit designed to be
incorporated with other units in a finished product.
5 Impact
5.1 The impact of improved tool quality and
standardization is:
5.1.1 Reduced tool purchase price for customized
piping distribution systems, by employing standard
designs and practices for HP and UHP systems.
5.1.2 Reduced tool installation cost and cycle time.
5.1.3 Reliability, Maintainability — Improved tool up-
time, repair time, and availability will positively affect
cost of ownership. Primary improvement is in system
MTBF and MTTR.
5.1.4 Sub-Assembly Contamination Control — Cost of
ownership will also be improved by lower long-term
contamination levels in the process chamber or bath,
resulting in wafer defect reductions and/or yield
improvement. Long-term flow accuracy for mass flow
controllers (MFC’s) will also be improved for better
wafer level uniformity.
SEMI E49-1104 © SEMI 1995, 2004 4
5.1.5 Final Assembly Contamination Control — Will
result in reduced possibility of cleanroom
contamination upon tool delivery, and avoid time delay
of tool cleaning at wafer fab site.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer's instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction
of the contents in whole or in part is forbidden without express
written consent of SEMI.
SEMI E49.2-1104 © SEMI 1995, 2004 1
SEMI E49.2-1104
GUIDELINE FOR THE QUALIFICATION OF POLYMER ASSEMBLIES
USED IN ULTRAPURE WATER AND LIQUID CHEMICAL SYSTEMS IN
SEMICONDUCTOR PROCESS EQUIPMENT
This guideline was technically approved by the Global Liquid Chemicals Committee and is the direct
responsibility of the North American Liquid Chemicals Committee. Current edition approved by the North
American Regional Standards Committee on August 16, 2004. Initially available at www.semi.org
September 2004; to be published November 2004. Originally published in 1995; last published February
1998.
NOTICE: This document was rewritten in its entirety in 2004, and is a replacement for the previous versions of
both E49.2 & E49.3.
NOTICE: Paragraphs entitled NOTE are not an official part of this document and are not intended to modify or
supercede it.
1 Purpose
1.1 The objective of this document is to provide a
guideline by which the purity and mechanical integrity
of all ultrapure water and liquid chemical Assemblies
shipped to end users may be qualified. It is also the
purpose of this guideline to complement the following:
SEMI F57: Provisional Specification For Polymer
Components Used in Ultrapure Water and Liquid
Chemical Distribution Systems and;
SEMI E49.7: Purity Guide For the Design and
Manufacture of Ultrapure Water and Liquid
Chemical Systems in Semiconductor Process
Equipment
NOTE 1: As with any SEMI guide, the practices outlined
herein are recommendations, not specifications. Users of this
document should recognize that alternate practices are not
excluded as long as they produce results that are equivalent to
those produced using the recommendations outlined here and
meet the requirements of the end user.
2 Scope
2.1 To ensure the purity and mechanical integrity of
ultrapure water and liquid chemical Assemblies the
following tests and quality guidelines are
recommended:
Hydrostatic Pressure Tests – See Table 1, Section
9.1, and Section 9.2.
Ultrapure Water Flush Test – See Table 1 Section
9.1, and Section 9.3.
Particle Test – See Table 1, Section 9.1 and Section
9.4
Ionic and Metallic Contamination Tests – See
Table 1, Section 9.1, and Section 9.5
Certification – See Section 10 for defining,
establishing, executing, and maintaining a
certification program.
Traceability – See Section 11 for the
responsibilities for suppliers to verify compliance
with SEMI F57, SEMI E49.7, and this document.
2.2 Typical semiconductor process equipment with
ultrapure water and liquid chemical delivery
Assemblies includes, but is not limited to the following:
Wafer Handling Equipment
Wafer Cleaning Systems
Chemical Filtration/Mixing Skids provided by
OEM
Wet Clean Stations
Wafer Scrubbers
CMP
Photolithography coaters and developers
Ion Implanters
Metrology equipment
Ancillary equipment provided with the process
equipment.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.