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11 SEMI G69-0996 © SEMI 1996, 2004 APPENDIX 2 SAMPLE SIZE NOTICE : The material in this appendix is an o fficial part of SEMI G69 and was approved by full letter b allot procedures. A1-2 A1-2.1 Resul ts of adhesive st re…

SEMI G69-0996 © SEMI 1996, 2004 10
APPENDIX 1
SAMPLE OF MOLD FOR SHEAR METHOD
NOTICE: The material in this appendix is an official part of SEMI G69 and was approved by full letter ballot
procedures.
A1-1
A1-1.1 A mold to prepare samples for shear method is shown in Figure A1-1 as a sample.
Figure A1-1
Mold Sample

11 SEMI G69-0996 © SEMI 1996, 2004
APPENDIX 2
SAMPLE SIZE
NOTICE: The material in this appendix is an official part of SEMI G69 and was approved by full letter ballot
procedures.
A1-2
A1-2.1 Results of adhesive strength measurement made by some companies using the same leadframe material and
molding compound are shown in Figure A2-1. The figures show that apparent adhesive strength decreases with an
increase in adhesive area due to residual stress.
A1-2.2 Sample size in this document was determined in consideration of the effect of residual stress and easiness of
handling for samples.

SEMI G69-0996 © SEMI 1996, 2004 12
A1-2.3
Figure A1-2
Dependence of Measurement Results on Sample Size