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SEMI E19.4-0998 E © SEMI 1992, 2003 7 APPENDIX 1 APPLICATION NOTES NOTICE : This appendix was approved as an official part of SEMI E19.4 by full letter ballot procedure, but the recommendations in th is appendix are opti…

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SEMI E19.4-0998
E
© SEMI 1992, 2003 6
Figure 3
Dimensions of Pod Hold Down Latches
Figure 4
Dimensions of Pod Latch Hole
SEMI E19.4-0998
E
© SEMI 1992, 2003 7
APPENDIX 1
APPLICATION NOTES
NOTICE: This appendix was approved as an official part of SEMI E19.4 by full letter ballot procedure, but the
recommendations in this appendix are optional and are not required to conform to this standard.
A1-1 Notes
A1-1.1 Automated pod transfer between load port and
automated material handling system (AMHS) might
require a lead-in capability of more than 5 mm. This
can be achieved by increasing the height of the guide
rails (dimension B5). SEMI standard E15 limits this
height to 50 mm (1.97 inches) maximum (see Figure
A1-1). The capture range can be increased to more than
15 mm (0.6 inches) if supplier and customer agree to
increase the guide rail height without violating SEMI
E15.
Figure A1-1
Optional Rail Dimensions
A1-1.2 The dimensions of the pod bottom are not
specified in this standard (see Section 6.2.5.1). It is
recommended that these dimensions should not exceed
282.0 mm (11.14 inches) in one direction and 292.6
mm (11.52 inches) in the other direction. These
maximum outer dimensions ensure a sufficient gap
around the pod and the guide rails in relation to B1 and
B2 to allow a reliable motion of the pod onto the port
plate.
A1-1.3 It is important that the external top of the pod
does not exceed the top of the cassette by more than 50
mm (1.97 inches). This is to prevent possible
interference between the pod and the equipment.
NOTICE: By publication of these standards,
Semiconductor Equipment and Materials International
(SEMI) takes no position respecting the validity of any
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mentioned herein. These standards are subject to
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Copyright by SEMI® (Semiconductor Equipment and Materials
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SEMI E19.5-0996 © SEMI 1978, 2003 1
SEMI E19.5-0996 (Withdrawn 1103)
SPECIFICATION FOR 300-mm BOTTOM-OPENING STANDARD
MECHANICAL INTERFACE (SMIF)
NOTICE: This document was balloted and approved
for withdrawal in 2003.
NOTICE: Hewlett-Packard has patent coverage for this
concept and is offering non-exclusive licenses on an equal
basis to any company. Companies intending to manufacture
products to this standard should be aware of Hewlett-
Packard' s position.
The user’s attention is called to the possibility that
compliance with this standard may require use of an
invention covered by patent rights. By publication of
this standard, Semiconductor Equipment and Materials
International (SEMI) takes no position with respect to
the validity of any patent rights asserted in connection
with any item mentioned in this document. Users of this
document are expressly advised that determination of
any such patent rights, and the risk of infringement of
such rights are entirely their own responsibility.
1 Purpose
This standard specifies a standard interface for
containers intended to control the transport environment
of contained wafers. The interface must address the
proper container orientation for material transfer and
maintain continuity between the container and
equipment environment in order to control particulate
and non-particulate contamination.
2 Scope
This specification describes an approach to interfacing
a clean transport container (pod) to a clean
environmental housing on a piece of semiconductor
processing equipment or to other clean environments.
The system concept involves mating a pod door to a
port door in an equipment interface and transferring the
wafers into, and out of, the equipment without exposing
the wafers to outside contamination.
The incorporation of this standard may require
equipment designers to include the features of the
interface into the tool design. Spacing between
equipment interface ports must be considered when
incorporating this interface. Designers are directed to
the recommendations made in SEMI E15.1 in this
regard.
This standard is specific to the size of the designated
wafer and references the appropriate Semiconductor
Equipment and Materials International (SEMI) cassette
and wafer diameter. This specification focuses on
applications in which the interface port is positioned
horizontally.
3 Referenced Documents
3.1 SEMI Standard
SEMI E15.1 — Provisional Specification for 300-mm
Tool Load Port
4 Terminology
(See Figure 1 for a pictorial depiction of most terms.)
Figure 1
Port Terminology