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SEMI G72.2-099 7 © SEMI 1997 3 Table 2 388 Pin Pl astic Ball Grid A rray 35×35 m m Bod y Design Design No.PBD0002 SEMI St andard BGA Design Library Revision Initial Date 10/22/ 96 Page 2 of 1 0 PBGA Wire Bond P ad (*1) S…
SEMI G72.2-0997 © SEMI 1997 2
Figure 1
388 Pin Plastic Ball Grid Array 35×35 mm Body Design
SEMI G72.2-0997 © SEMI 19973
Table 2 388 Pin Plastic Ball Grid Array 35×35 mm Body Design
Design
No.PBD0002 SEMI Standard BGA Design Library Revision Initial
Date
10/22/96
Page
2 of 10
PBGA Wire
Bond Pad (*1)
Solder Ball
Location
Die Wire Bond
Pad (*3) I/O Name (& Comments) (*4)
Pkg.
Side (*1) Notes
w/b ring 1 A1 3
w/b ring 1 A2 3
304 A3 4
300 A4 4
296 A5 4
293 A6 4
289 A7 4
285 A8 4
283 A9 4
279 A10 4
275 A11 4
272 A12 4
268 A13 4
264 A14 4
260 A15 4
258 A16 4
254 A17 4
251 A18 4
248 A19 4
244 A20 4
242 A21 4
238 A22 4
234 A23 4
231 A24 4
229 A25 4
w/b ring 1 A26 3
1B1 1
w/b ring 1 B2 3
302 B3 4
298 B4 4
295 B5 4
291 B6 4
287 B7 4
284 B8 4
281 B9 4
277 B10 4
273 B11 4
270 B12 4
266 B13 4
262 B14 4
259 B15 4
256 B16 4
252 B17 4
SEMI G72.2-0997 © SEMI 1997 4
Design
No.PBD0002 SEMI Standard BGA Design Library Revision Initial
Date
10/22/96
Page
2 of 10
PBGA Wire
Bond Pad (*1)
Solder Ball
Location
Die Wire Bond
Pad (*3) I/O Name (& Comments) (*4)
Pkg.
Side (*1) Notes
250 B18 4
246 B19 4
243 B20 4
239 B21 4
235 B22 4
232 B23 4
230 B24 4
w/b ring 1 B25 3
w/b ring 1 B26 3
3C1 1
2C2 1
w/b ring 1 C3 3
303 C4 4
301 C5 4
297 C6 4
294 C7 4
290 C8 4
286 C9 4
282 C10 4
278 C11 4
274 C12 4
271 C13 4
269 C14 4
265 C15 4
261 C16 4
257 C17 4
253 C18 4
249 C19 4
245 C20 4
241 C21 4
237 C22 4
233 C23 4
w/b ring 1 C24 3
226 C25 3
228 C26 3
6D1 1
4D2 1
5D3 1
w/b ring 1 D4 3
299 D5 4
w/b ring 2 D6 2
292 D7 4
288 D8 4
w/b ring 1 D9 3