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SEMI E1.9-0701 E2 © SEMI 1994, 2004 2 SEMI E19 — Standa rd Mechanical Interface (SMIF) SEMI E57 — Provisional Mech anical Spec ification for Kinemati c Couplings U sed to Align and Support 300 mm Wafer Carriers 4 Termino…

SEMI E1.9-0701

MECHANICAL SPECIFICATION FOR CASSETTES USED TO

TRANSPORT AND STORE 300 mm WAFERS

This specification was technically approved by the Global Physical Interfaces & Carriers Committee and is

the direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition

approved by the North American Regional Standards Committee on March 22 and April 30, 2001. Initially

available at www.semi.org May 2001; to be published July 2001. Originally published in 1994; previously

published June 1999.

This document was editorially modified in January 2003 to reflect the withdrawal of SEMI E44. Changes

were made to Sections 3.1, 4.2, 4.4, and 4.17. This document was also editorially modified in May 2004 to

reflect the withdrawal of SEMI E19.5. Changes were made to Section 7.1.

1 Purpose

1.1 This standard specifies the cassettes used to

transport and store 300 mm wafers in an IC

manufacturing facility. This includes both manual and

auto-transport use as well as high-speed extraction of

the wafers in processing equipment.

2 Scope

2.1 This standard is intended to set an appropriate level

of specification that places minimal limits on

innovation while ensuring modularity and

interchangeability at all mechanical interfaces. Most of

the requirements given in this specification are in the

form of maximum or minimum dimensions wit very

few required surfaces. Only the mechanical interfaces

for cassettes are specified; no materials requirements or

micro-contamination limits are given. However, this

standard has been written so that both metal and

injection-molded plastic cassettes can be manufactured

in conformance with it.

2.2 The cassette has the following components and

sub-components, and other features. A “† ” symbol

indicates components or features that include

dimensions required for boxes with non-removable

cassettes.

Key:

• Required feature

◊ Optional feature

• 1 top domain

• 2 optical wafer sensing paths

◊ 4 robotic handling flanges (optional)

◊ 1 top cassette identification tag area (optional)

• 2 or 4 side domains (2 in front and 2 in rear, if

needed)

• supports (for 13 or 25 wafers) with correct wafer

pitch (10 mm) †

• 1 optical cassette sensing hole on each front side

domain

◊ 1 side cassette identification tag area on front

right side domain only (optional)

◊ features that prevent wafer creep-out

(optional)

◊ 2 pentagonal side grip pits on each front side

domain (optional)

• 1 bottom domain

• 2 optical wafer sensing paths

• 5 carrier sensing pads †

• 4 info pads †

• 1 pod latch-pin hole

• 2 conveyor rails

• 2 fork-lift pick-up areas

• 2 fork-lift pin holes

• 3 features that mate with kinematic coupling pins

and provide a 10 mm lead in †

◊ 3 features that mate with kinematic coupling

pins and provide a 15 mm lead in (optional)

◊ 1 bottom cassette identification tag area

(optional)

• Other features

• multiple horizontal wafer sensing paths

• 2 end-effector exclusion zones †

3 Referenced Documents

3.1 SEMI Standards

SEMI E15 — Specification for Tool Load Port

SEMI E1.9-0701

SEMI E19 — Standard Mechanical Interface (SMIF)

SEMI E57 — Provisional Mechanical Specification for

Kinematic Couplings Used to Align and Support 300

mm Wafer Carriers

4 Terminology

4.1 bilateral datum plane — a vertical plane that

bisects the wafers and that is perpendicular to both the

horizontal and facial datum planes (as defined in SEMI

E57).

4.2 box — a protective portable container for a cassette

and/or substrate(s).

4.3 carrier capacity — the number of substrates that a

carrier holds.

4.4 cassette — an open structure that holds one or

more substrates.

4.5 cassette bottom domain — volume (below z6 above

the horizontal datum plane) that contains the bottom of

the cassette.

4.6 cassette sensing pads — surfaces on the bottom of

the cassette for triggering optical or mechanical sensors.

4.7 cassette side domains — volumes (from z6 above

the horizontal datum plane to z15 above the top

nominal wafer seating plane) that contain the mizo teeth

or slots that support the wafer and the supporting

columns on the sides and rear of the cassette.

4.8 cassette top domain — volume (higher than z15

above the top wafer) that contains the top of the

cassette.

4.9 conveyor rails — parallel edges on the bottom of

the cassette for supporting the cassette on roller

conveyors.

4.10 facial datum plane — a vertical plane that bisects

the wafers and that is parallel to the front side of the

carrier (where wafers are removed or inserted). On tool

load ports, it is also parallel to the load face plane

specified in SEMI E15 on the side of the tool where the

carrier is loaded and unloaded (as defined in SEMI

E57).

4.11 fork-lift slots — rectangular holes (open to the

front and rear) in the bottom of the cassette for picking

up the cassette with a fork.

4.12 front-opening unified pod (FOUP) — a box (that

complies with SEMI E47.1) with a non-removable

cassette (so that its interior complies with SEMI E1.9)

and with a front-opening interface (that mates with a

FIMS port that complies with SEMI E62) (as defined in

SEMI E47.1).

4.13 horizontal datum plane — a horizontal plane from

which projects the kinematic-coupling pins on which

the carrier sits. On tool load ports, it is at the load

height specified in SEMI E15 and might not be

physically realized as a surface (as defined in SEMI

E57).

4.14 nominal wafer center line — the line that is

defined by the intersection of the two vertical datum

planes (facial and bilateral) and that passes through the

nominal centers of the seated wafers (which must be

horizontal when the carrier is placed on the coupling)

(as defined in SEMI E57).

4.15 nominal wafer seating plane — horizontal plane

that bisects the wafer pick-up volume.

4.16 optical wafer sensing paths — lines of sight for

optically sensing the positions of the wafers. Several

horizontal optical wafer sensing paths are present in

between the cassette side domains. In addition, two

vertical optical wafer sensing paths are created by

rectangular exclusion zones in the front of the cassette

top and bottom.

4.17 pod — a box having a Standard Mechanical

Interface (SMIF) per SEMI E19.

4.18 process batch — a set of substrates that are

processed simultaneously in a process chamber.

4.19 robotic handling flanges — four horizontal

projections on top of the cassette for lifting and rotating

the cassette.

4.20 sensor hole — an indentation on the bottom of the

cassette for inserting optical sensors.

4.21 side grip pits — two rectangular indentations on

each side of the cassette for lifting and rotating the

cassette.

4.22 transport group — a set of substrates that are

transported together between tools.

4.23 virtual tracking unit — an entity (which could be

a number of substrates or an individual die or mask

group) that the factory floor control system treats as a

single unit for tracking purposes.

4.24 wafer carrier — any cassette, box, pod, or boat

that contains wafers (as defined in SEMI E15).

4.25 wafer extraction volume — the open space for

extracting a wafer from the cassette.

4.26 wafer pick-up volume — the space that contains

entire bottom of a wafer if the wafer has been pushed to

the rear of the cassette.

4.27 wafer set-down volume — the open space for

inserting and setting down a wafer in the cassette.

SEMI E1.9-0701

5 Ordering Information

5.1 Intended Use — This standard is intended to

specify 300 mm cassettes over a reasonable lifetime of

use, not just those in new condition. For this reason, the

purchaser needs to specify a time period and the

number and type of uses to which the cassettes will be

put. It is under these conditions that the cassettes must

remain in compliance with the requirements listed in

Section 6.

5.2 Temperature Ranges — The purchaser of 300 mm

cassettes needs to specify two sets of temperatures to

which the cassettes might be exposed. An operating

temperature range is the set of environmental

temperatures in which the cassettes will remain in

compliance with the requirements listed in Section 6. A

temporary temperature range is the set of environmental

temperatures to which the cassettes can be exposed

such that when the cassettes return to the operating

temperature range, the cassettes will be in compliance

with the requirements listed in Section 6. Limits on

exposure times to elevated temperatures should be

specified. Also, the purchaser needs to specify a range

of temperatures for the wafers that might be inserted in

the cassettes.

5.3 Info Pad Configurations — The purchaser of 300

mm carriers needs to specify the desired info pad

configuration (up or down). See Appendix 1

(Application Notes).

6 Requirements

6.1 Kinematic Couplings — The physical alignment

interface on the bottom of the cassette consists of

features (not specified in this standard) that mate with

six pins underneath as defined in SEMI E57. Most of

the dimensions of the cassette are determined with

respect to the three orthogonal datum planes defined in

that standard: the horizontal datum plane, the facial

datum plane, and the bilateral datum plane. All of the

dimensions for the cassette are bilaterally symmetric

about the bilateral datum plane. The three features that

mate with the pins must provide a lead-in capability

that corrects a cassette misalignment no greater than

r19 in any horizontal direction. However, it is

recommended that robots placing cassettes on

kinematic couplings use as little of this lead-in

capability as possible to avoid wear.

6.2 Wafer Orientation and Numbering — The wafers

must be horizontal when the carrier is placed on the

coupling, and the wafers are numbered in increasing

order from bottom to top (so the bottom wafer is wafer

number 1, the next wafer up is wafer number 2, etc.).

After processing at a tool, each wafer should be

returned to the same slot from which it was taken.

6.3 Cassette Sides — Figure 1 shows a cross-section of

the horizontal boundaries of the cassette side domains

(which contain the parts of the cassette higher than z6

above the horizontal datum plane and lower than z15

above the top wafer). In this and following figures, the

most heavy lines are used for surfaces that have

tolerances (not surfaces that have only maximum or

minimum dimensions). Table 1 defines the dimensions

shown in this and following figures. The maximum

protrusions of any part of the cassette from the nominal

wafer center line and from the bilateral datum plane is

r5 and x9, respectively. There are two optional side grip

pits on each side. For optically sensing whether a

cassette is properly in place, from left to right under the

bottom wafer is an optical cassette sensing hole. The

radius of this hole is given with both upper and lower

tolerances, but the upper tolerance is only to define a

minimum aperture that must be met at only one section

on each side. Other than through the optical cassette

sensing holes, the cassette bottom and side domains

must block any line of sight passing through both of the

two rectangles at x10 on each side bounded by z4, z20,

y2, and y3.

6.4 Cassette Top — Figure 2 shows a top view of the

horizontal boundaries of the cassette top domain which

contains any part of the cassette higher than z15 above

the top nominal wafer plane. The top robotic handling

flanges (optional), the side grip pits (optional), and

optical cassette sensing hole on the side can be seen in

Figure 3, which is an oblique view of the maximum

cassette dimensions (see Figure 14 to see how cassettes

need not take up all of that volume). The maximum

radial protrusions of the cassette top in the front and

rear are r6 and r12, respectively. Dimensions x6, x12

(shown in Figure 4), and y15 define a vertical path for

optically sensing wafers through the top and bottom

domains.