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SEMI E47.1-0305 © SEMI 1997, 2005 2  2 fork-lift pin holes  5 carrier sensing pads  cen ter retaining feature  front retaining feature  4 info pads  2 advancing FOUP se nsing pads  3 features that mate with kinem …

SEMI E47.1-0305 © SEMI 1997, 2005 1

SEMI E47.1-0305

PROVISIONAL MECHANICAL SPECIFICATION FOR FOUPS USED TO

TRANSPORT AND STORE 300 mm WAFERS

This specification was technically approved by the Global Physical Interfaces & Carriers Committee and is

the direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition

approved by the North American Regional Standards Committee on December 10, 2004. Initially available

at www.semi.org February 2005; to be published March 2005. Originally published in 1997; previously

published November 2004.

1 Purpose

1.1 This standard partially specifies the FOUPs used to transport and store 300 mm wafers in an IC manufacturing

facility.

2 Scope

2.1 This standard is intended to set an appropriate level of specification that places minimal limits on innovation

while ensuring modularity and interchange-ability at all mechanical interfaces. Most of the requirements given in

this specification are in the form of maximum or minimum dimensions with very few required surfaces. Only the

physical interfaces (other than the door mechanism and kinematic couplings) for FOUPs are specified; no materials

requirements or micro-contamination limits are given. The enclosure specified in this standard can be a sealed

minienvironment, but it could also just be a box with well-defined interfaces.

2.2 The FOUP has the following components and sub-components:

Key:

 Required feature

 Optional feature

 top

 top handling flange

 center hole on top handling flange

 3 kinematic grooves on top handling flange (optional)

 interior

 cassette (with supports for 13 or 25 wafers)

 wafer capture mechanism

 2 end effector exclusion zones

 sides

 2 side fork-lift flanges (optional)

 ergonomic manual handles (optional)

 door

 holes for latch keys that lock the door to the FIMS interface when the door is unlatched from the FOUP

 holes for registration pins

 door sensing pads

 bottom

 4 bottom conveyor rails (with the bottom of the front seal zone acting as the fourth rail and the rear rail

optional)

SEMI E47.1-0305 © SEMI 1997, 2005 2

 2 fork-lift pin holes

 5 carrier sensing pads

 center retaining feature

 front retaining feature

 4 info pads

 2 advancing FOUP sensing pads

 3 features that mate with kinematic coupling pins and provide a 10 mm lead in

 3 features that mate with kinematic coupling pins and provide a 15 mm lead in (optional)

 front conveyor surface

2.3 This standard is provisional because of concerns about the kinematic coupling pins causing excessive wear on

carriers and the usefulness of the robotic handling flanges and conveyor rails. Once FOUP testing is done, this

standard should be modified and upgraded from provisional status.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish appropriate safety and health practices and determine the

applicability of regulatory or other limitations prior to use.

3 Referenced Standards

3.1 SEMI Standards

SEMI E1.9  Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers

SEMI E15 — Specification for Tool Load Port

SEMI E15.1 — Specification for 300 mm Tool Load Port

SEMI E19 — Standard Mechanical Interface (SMIF)

SEMI E47 — Specification for 150 mm/200 mm Pod Handles

SEMI E57 — Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer

Carriers

SEMI E62 — Provisional Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS)

SEMI S8 — Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment

NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

4 Terminology

4.1 Definitions

4.1.1 bilateral datum plane — a vertical plane that bi-sects the wafers and that is perpendicular to both the

horizontal and facial datum planes (as defined in SEMI E57).

4.1.2 box — a protective portable container for a cassette and/or substrate(s).

4.1.3 carrier capacity — the number of substrates that a carrier holds (as defined in SEMI E1.9).

4.1.4 cassette — an open structure that holds one or more substrates.

4.1.5 facial datum plane — a vertical plane that bisects the wafers and that is parallel to the front side of the carrier

(where wafers are removed or inserted). On tool load ports, it is also parallel to the load face plane specified in

SEMI E15 on the side of the tool where the carrier is loaded and unloaded (as defined in SEMI E57).

SEMI E47.1-0305 © SEMI 1997, 2005 3

4.1.6 front-opening unified pod (FOUP) — a box (that complies with SEMI E47.1) with a non-removable cassette

(so that its interior complies with SEMI E1.9) and with a front-opening interface (that mates with a FIMS port that

complies with SEMI E62).

4.1.7 horizontal datum plane — a horizontal plane from which projects the kinematic-coupling pins on which the

carrier sits. On tool load ports, it is at the load height specified in SEMI E15 and might not be physically realized as

a surface (as defined in SEMI E57).

4.1.8 minienvironment — a localized environment created by an enclosure to isolate the product from contamination

and people.

4.1.9 nominal wafer center line — the line that is defined by the intersection of the two vertical datum planes (facial

and bilateral) and that passes through the nominal centers of the seated wafers (which must be horizontal when the

carrier is placed on the coupling) (as defined in SEMI E57).

4.1.10 pod — a box having a Standard Mechanical Interface (SMIF) per SEMI E19.

4.1.11 robotic handling flanges — horizontal projec-tions on the top of the FOUP for lifting and rotating the FOUP.

4.1.12 wafer carrier — any cassette, box, pod, or boat that contains wafers (as defined in SEMI E15).

5 Ordering Information

5.1 Intended Use — This standard is intended to specify 300 mm FOUPs over a reasonable lifetime of use, not just

those in new condition. For this reason, the purchaser needs to specify a time period and the number and type of uses

to which the FOUPs will be put. It is under these conditions that the FOUPs must remain in compliance with the

requirements listed in §6.

5.2 Temperature Ranges — The purchaser of 300 mm FOUPs needs to specify two sets of temperatures to which

the FOUPs might be exposed. An operating temperature range is the set of environmental temperatures in which the

FOUPs will remain in compliance with the requirements listed in §6. A temporary temperature range is the set of

environmental temperatures to which the FOUPs can be exposed such that when the FOUPs return to the operating

temperature range, the FOUPs will be in compliance with the requirements listed in §6. Limits on exposure times to

elevated temperatures should be specified. Also, the purchaser needs to specify a range of temperatures for the

wafers that might be inserted in the FOUPs.

5.3 Fire Resistance — The purchaser of 300 mm FOUPs may need to consider the flammability of the FOUPs.

5.4 Info Pad Configurations — The purchaser of 300 mm carriers needs to specify the desired info pad

configuration (up or down).

6 Requirements

6.1 Kinematic Couplings — The physical alignment mechanism from the FOUP to the tool load-port (or a nest on a

vehicle or in a stocker) consists of features (not specified in this standard) on the top entity that mate with three or

six pins underneath as defined in SEMI E57. Most of the dimensions of the FOUP are determined with respect to the

three orthogonal datum planes defined in that standard: the horizontal datum plane, the facial datum plane, and the

bilateral datum plane. All of the dimensions for the FOUP are bilaterally symmetric about both the bilateral and

facial datum planes with the following exceptions:

 The features that mate with the kinematic coupling pins and the FOUP sensing pads are symmetrical only about

the bilateral datum plane.

 The FOUP has a door only on the front and conveyor rails on the left and right sides that are required to extend

all the way to the front.

 The orientation notches on the robotic handling flange are different for each of the four sides.

The three features that mate with the kinematic coupling pins must provide a lead-in capability that corrects a FOUP

misalignment of up to r69 in any horizontal direction.

6.2 (This section, “Internal Kinematic Couplings” is no longer applicable, and is intentionally left blank so as to

maintain paragraph numbering.)