semi合集-English.pdf - 第6100页
SEMI G19-0997 © SE MI 1980, 1997 5 Applica tion Note: T h ere is a question reg arding the abil ity of material suppliers to m eet this specific ation. Revision of this speci fica tion is under r evie w. 6.10.2 Die Attac…
SEMI G19-0997 © SEMI 1980, 1997 4
tolerances for untaped frames and Table 2 tolerances
for taped frames.
Table 1 Tolerances for Untaped Frames
No. of
Leads Strip Width Lead Tip Coplanarity
8 - 16 600"–1.000"
(15.24 mm–25.4 mm)
+ 0.004"/-0.004"
(0.101 mm)
18 - 22 1.070"– 1.020"
(27.18 mm–25.91 mm)
+ 0.005"/-0.005"
(0.127 mm)
22 1.270"–1.300"
(32.26 mm– 33.02 mm)
+ 0.0065"/-0.0065"
(0.165 mm)
24 1.470"–1.500"
(37.34 mm–38.10 mm
+ 0.0075"/-0.0075"
(0.191 mm)
28 1.670"–1.700"
(42.42 m–43.18 mm)
+ 0.0085"/-0.0085"
(0.216 mm)
40 & up 2.270"–2.300"
(57.66 mm–58.42 mm)
+ 0.015"/-0.007"
(+0.381 mm/-0.178 mm)
Table 2 Tolerances for Taped Frames
No. of
Leads Strip Width Lead Tip Coplanarity
28 1.670"–1.700"
(42.42 mm–43.18 mm)
+0.007"/-0.005"
(+187 mm/-0.127 mm)
40 & up 2.270"–2.300"
(57.66 mm–58.42 mm)
+0.010"/0.005"
(+0.254 mm/-0.127
mm)
NOTE: It is recommended that 40 leads and more be taped
prior to bonding.
6.6.2 Die Attach Pad Planarity
6.6.2.1 The die attach pad when measured at the center
must be within the tolerances of the “Z” plane as shown
in Table 3.
Table 3 Pad Planarity Tolerances
No. of Leads Pad Planarity
8 - 16 +0.003"/-0.005"
(+0.076 mm/-0.127 mm)
18 - 20 +0.006"/-0.003"
(+0.152 mm/-0.076 mm)
22 - 40 +0.006"/-0.003"
(+0.152 mm/-0.076 mm)
48 +0.006"/-0.003"
(+0.152 mm/-0.076 mm)
64 +0.006"/-0.003"
(+0.152 mm/-0.076 mm)
6.6.2.2 Die attach pads utilizing the four point tie
design (support bars to both dambars) shall meet ±
0.002" (0.051 mm) of the “Z” plane.
6.7 Material — Thickness shall be as shown in Table
4.
Table 4 Material Thickness
Parameters 0.010"
(0.254 mm)
0.015"
(0.381 mm)
0.020"
(0.508 mm)
Thickness ± 0.0003"
(0.0076 mm)
± 0.0004"
(0.0102 mm)
± 0.0005"
(0.0127 mm)
Strip Width
2.0" (50.8 mm) ± 0.002"
(0.051 mm)
± 0.002"
(0.051 mm)
± 0.002"
(0.051 mm)
2.0" (50.8 mm) ± 0.003"
(0.076 mm)
± 0.003"
(0.076 mm)
± 0.003"
(0.076 mm)
6.8 Crossbow — Shall not exceed the dimensions
given in Table 5. If a certain width is not shown, 1% of
the leadframe width shall apply.
Table 5 Maximum Crossbow Dimensions
No. of
Leads Strip Width Max. Crossbow
8 0.600" (15.24 mm) 0.005" (0.127 mm)
14 - 16 0.970"/1.00" (24.64
mm/25.40 mm)
0.005" (0.127 mm)
18 1.070"/1.100" (27.18
mm/27.94 mm)
0.005" (0.127 mm)
20 1.170"/1.200"(29.72
mm/30.48 mm)
0.010" (0.254 mm)
22 1.270"/1.300"(32.26
mm/33.02 mm)
0.010" (0.254 mm)
24 1.470"/1.500"(37.34
mm/38.10 mm)
0.010" (0.254 mm)
28 1.670"/1.700"(42.42
mm/43.18 mm)
0.010" (0.254 mm)
40 2.270"/2.300"(56.66
mm/58.42 mm)
0.010" (0.254 mm)
48+ 2.400"/2.670"(60.96
mm/67.82 mm)
0.010" (0.254 mm)
6.9 Progression — Progression over the (# of) steps in
the strip should be within ± 0.051 mm (0.002") and
non-cumulative.
6.10 Pits (Indentations) — Pits and imperfections
cannot affect leadframe strength regardless of size (see
Figure 6).
6.10.1 Critical Bond Area — 0.635 mm (0.025") of
the finger tips + 0.508 mm (0.020") border of die attach
pad; nothing greater than 0.0005" (0.0127 mm)
diameter × 0.0076 mm (0.0003") in depth; not more
than 1 pit.
SEMI G19-0997 © SEMI 1980, 19975
Application Note: There is a question regarding the ability of
material suppliers to meet this specification. Revision of this
specification is under review.
6.10.2 Die Attach Pad — Functional side inside 0.508
mm (0.020") border; nothing greater than 0.127 mm
(0.005") diameter × 50% metal thickness in depth; not
more than 2 pits.
6.10.3 Die Attach Pad — Nonfunctional side; nothing
greater than .508 mm (0.020") × 50% of metal
thickness in depth; not more than 3 pits; cannot affect
leadframe strength regardless of size (i.e., pit cannot be
located within 0.127 mm (0.50") of pad support bar
attachments).
6.10.4 Internal leadframe areas where design width is
0.635 mm (0.025") or more, must be less than 0.381
mm (0.015") × 50% metal thickness in depth; if design
width is less than 0.635 mm (0.025"), area must be 50%
of design width. Cannot affect leadframe strength
regardless of size.
6.10.5 Major Lead Areas (outside dambar) —
Nothing greater than 0.127 mm (0.005") × 50% of
metal thickness in depth; nothing greater than 0.254
mm (0.010") on shoulder above taper. Cannot affect
leadframe strength regardless of size.
6.10.6 Dambar — Pit cannot extend all the way across
the bar.
6.11 Mold Locating Holes — Conventional mold
damage design dictates that gating is opposite pin #1;
therefore, the mold locating holes must be in the rail
adjacent to pin #1. In order to minimize gate flashing
between the mold and the rail edge, a specific tolerance
of ± 0.051 mm (0.002") is required from the centerline
of the mold hole to the opposite rail edge.
6.12 Strip Length — Strip length cut off shall be
within 0.005", lead tip to lead tip centerline (excluding
rails). The rail cut off length shall be within + 0.635
mm (0.025") unless otherwise specified by the user.
7 Sampling
Sampling will be determined between supplier and
purchaser.
8 Packaging and Marking
8.1 Packaging — Leadframes must be packaged in
containers designed and constructed to prevent damage
and/or contamination. Specific protection must be
provided against crushing, exposure to moisture, and
mixture gases.
8.2 Marking — The outer containers shall be clearly
marked to identify the user stock number, user purchase
order number, drawing number, supplier lot number,
and reel numbers within the carton. Additional
information required should be specified by the user.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G20-96 © SEMI 1980, 19961
SEMI G20-96
SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES
(ACTIVE DEVICES ONLY)
1 Purpose
This specification defines lead finishes for plastic
packages (e.g., single-in-line, dual-in-line, quad-in-line)
utilizing leadframes with SEMI specified leadframe
materials.
2 Scope
This specification defines the composition, properties,
and limits and refers to the appropriate tests for utility.
3 Referenced Documents
Unless otherwise specified, the following standards and
specifications, with appropriate issue letter at time of
order entry, form a part of this specification to the
extent, and for the purpose, specified herein.
3.1 SEMI Specifications
SEMI G4 — Specification for Integrated Circuit
Leadframe Materials Used in the Production of
Stamped Leadframes
SEMI G18 — Specification for Integrated Circuit
Leadframe Material Used in the Production of Etched
Leadframes
SEMI G55 — Test Method Measurement of Silver
Plating Brightness
SEMI G56 — Test Method Measurement of Silver
Plating Thickness
3.2 ASTM Specifications
1
B 487 — Measuring Metal and Oxide Coating
Thickness by Microscopical Examination of Cross
Section
B 545 — Standard Specification for Electrodeposited
Coatings of Tin
B 567 — Measurement of Coating Thickness by the
Beta Backscatter Principle
B 568 — Measurement of Coating Thickness by X-Ray
Spectrometry
E 1B 571 — Adhesion of Metallic Coatings
E 10 — Standard Test Method for Brinell Hardness for
Metallic Materials
1 American Society for Testing Materials, 100 Barr Harbor Drive,
West Conshohoken, PA 19428-2959
E 384 — Standard Test Methods for Microhardness of
Materials
3.3 Federal Specifications
2
QQ-S-365 — Silver Plating, Electrodeposited, General
Requirements for
QQ-S-571 — Solder, Tin Alloy: Tin Lead Alloy, and
Lead Alloy
3.4 Military Specifications
2
MIL-G-45204 — Gold Plating, Electrodeposited
MIL-P-81728 — Plating, Tin Lead, Electrodeposited
MIL-STD-883 — Test Methods and Procedures for
Microelectronics
MIL-T-10727 — Tin Plating; Electrodeposits or Hot-
Dipped, for Ferrous and Non-Ferrous Metals
4 Application
4.1 Table 1 lists recommended finishes for copper and
nickel/iron alloys.
4.1.1 Silver is approved as a lead finish for all alloys
but only for internal processing. When shipped to a
customer, silver must be removed and replaced by tin
lead.
4.1.2 Gold plate is usable in socketed applications as
well as in soldered applications. Hardness, grain size,
and other properties shall be specified on the
procurement drawing.
4.1.3 Solder, as used in this specification, refers to tin
lead as 63/37 or 60/40 unless otherwise specified and
agreed upon between user and supplier, and stated on
procurement drawings.
4.1.4 “Tinning” is a generic term (pr imarily used in
user industries) and means hot solder dip (near 60/40
tin lead) and not an application of tin.
4.2 Composition, limits, mechanical and physical
properties, and dimensions and tolerances for
leadframes are stated in SEMI G4 and SEMI G18.
4.3 Lead finish details are stated in Section 5.
2 Military Standards, Naval Publications and Forms Center, 5801
Tabor Ave., Philadelphia, PA 19120