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SEMI E49.7-0304 © SEMI 1995, 2004 1 SEMI E49.7-0304 PURITY GUIDE FOR THE DE SIGN AND MANUFACTURE OF ULTRAPURE WATER AND LIQUID CHEMICAL SYSTEMS IN SEMICONDUCTOR PR OCESS EQUIPMENT This guide was technicall y approved by …

SEMI E49.6-1103 © SEMI 1995, 2003 7
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
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respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
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the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.

SEMI E49.7-0304 © SEMI 1995, 2004 1
SEMI E49.7-0304
PURITY GUIDE FOR THE DESIGN AND MANUFACTURE OF
ULTRAPURE WATER AND LIQUID CHEMICAL SYSTEMS IN
SEMICONDUCTOR PROCESS EQUIPMENT
This guide was technically approved by the Global Liquid Chemicals Committee and is the direct
responsibility of the North American Liquid Chemicals Committee. Current edition approved by the North
American Regional Standards Committee on December 4, 2003. Initially available at www.semi.org
February 2004 to be published March 2004. Originally published 1995, last published July 2002.
This standard was editorially modified in January 2004 to correct a typographical error. A change was made
to Section 10.5.4.
1 Purpose
1.1 The objective of this document is to provide
recommendations that will help maintain the quality of
the liquid being delivered. Recommendations are given
for activities specific to polymer ultrapure water and
liquid chemical systems used in Semiconductor process
equipment.
NOTE 1: As with any SEMI guide, the practices outlined
herein are recommendations, not specifications. Users of this
document should recognize that alternate practices are not
excluded as long as they produce results that are equivalent to
those produced using the recommendations outlined here and
meet the requirements of the end user.
2 Scope
2.1 It is within the scope of this standard to recommend
procedures that complement the requirements in SEMI
F57 with the goal of ensuring the quality of the liquid
being delivered. Recommendations are provided in the
following areas:
• Manufacturing Facility
• Utilities
• System Design
• Pre-Production and Inspection
• Assembly
• System Testing
• Packaging
• Traceability
2.2 For the purposes of this document, systems include
all liquid delivery components inside semiconductor
process equipment and ancillary support equipment, as
well as additional plumbing provided by the OEM with
the processing equipment. This includes any assembly
of two or more liquid delivery components provided
with or within semiconductor process equipment.
2.3 Typical semiconductor process equipment with
ultrapure water and liquid chemical delivery systems
includes, but is not limited to the following:
• Wafer Handling Equip.
• Wafer Cleaning Systems
• Chemical Filtration/Mixing Skids provided by
OEM
• Wet Clean Stations
• Wafer Scrubbers
• CMP
• Photolithography coaters and developers
• Ion Implanters
• Metrology equipment
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Limitations
3.1 This standard does not define the performance
requirements of components, which may be addressed
by SEMI F57. Nor does this standard define the
performance requirements of equipment systems.
Facility distribution systems are also outside the scope
of this standard.
3.2 Organic liquids, such as isopropyl alcohol and
methyl alcohol, are typically in contact with stainless
steel or other non-polymeric components. The polymer
systems described within this document are NOT
intended for use with such organic liquids. Refer to
SEMI E49.4, SEMI E49.5, and SEMI E49.6 for
information on stainless steel components.

SEMI E49.7-0304 © SEMI 1995, 2004 2
3.3 System design issues outside those that directly
impact liquid purity or quality are not within the scope
of this document’s recommendations and are left to the
individual system designers.
3.4 Polymer systems described within this document
are intended for use in ultrapure water and liquid
chemical delivery only. Their performance
requirements may exceed the needs of systems used in
drainage and other lesser quality liquids.
4 Referenced Standards
4.1 SEMI Standards
SEMI C3.28 Standard for Nitrogen (N2), VLSI
Grade in Cylinders, 99.9996% Quality
SEMI C41 Specifications and Guidelines for 2-
Propanol
SEMI E49 Guide for Standard Performance,
Practices, and Sub-Assembly for High Purity Piping
Systems and Final Assembly for Semiconductor
Manufacturing Equipment
SEMI E49.4 Guide for High Purity Solvent
Distribution Systems in Semiconductor Manufacturing
Equipment
SEMI E49.5 Guide for Ultrahigh Purity Solvent
Distribution Systems in Semiconductor Manufacturing
Equipment
SEMI E49.6 Guide for Subsystem Assembly and
Testing Procedures – Stainless Steel Systems
SEMI F34 Guide for Liquid Chemical Pipe Labeling
SEMI F57 Provisional Specification for Polymer
Components Used in Ultrapure Water and Liquid
Chemical Distribution Systems
SEMI F61 Guide for Ultrapure Water System Used
in Semiconductor Processing
4.2 Federal Standard (FED-STD)
1
Fed Stand 209E — Airborne Particulate Cleanliness
Classes in Cleanrooms and Clean Zones
1 Available from General Service Administration, Federal Supply
Service Bureau, Specification Section, Suite 8167, 470 East L' Enfant
Place SW, Washington, D.C. 20407.
4.3 ISO Document
2
ISO 14644 Cleanrooms and Associated Controlled
Environments – Part 1 Classification of Air Cleanliness
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
5 Terminology
5.1 See Section 4 of SEMI E49.
6 Manufacturing Facility Recommendations
6.1 Cleanroom Class designations as used within this
document are defined within Federal Standard 209E
Airborne Particulate Cleanliness Classes in Clean
rooms and Clean Zones. (ISO standard 14644-1
classifications are listed parenthetically.)
6.2 Materials Storage Area The storage area for
components and assemblies should be a dedicated
enclosed area, protected from the elements and
separated from other materials. Only components and
assemblies that have passed inspection, and are clean
and packaged should be placed in the storage area.
6.3 Gowning Area Gowning area should be Class
10,000 (ISO Class 7) or better. All personnel working
in cleanrooms should follow appropriate gowning
protocol such as: wear booties prior to entering the
gowning area; and wear gowns, hood, boots, gloves,
and safety glasses before entering clean areas.
6.4 Staging Area Staging Area should be Class
10,000 (ISO Class 7) or better. The staging area (if
used) should be located immediately outside the
assembly cleanroom, with appropriate access to the
assembly cleanroom.
6.5 Assembly Areas All production operations such
as cutting, welding, cleaning, assembly, final
integration, final test, and packaging (if applicable)
should be performed in a class 10,000 (ISO Class 7)
cleanroom or better.
7 Utility Recommendations
7.1 Nitrogen (Uses include leak testing of non-brittle
materials, drying, and purging.)
• Nitrogen quality should meet requirements of
SEMI C3.28.
• Particle filtration should be 99.99999% removal of
0.003 micron particles.
2 International Organization for Standardization, ISO Central
Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,
Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30
Website: www.iso.ch