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SEMI G21-94 © SEMI 198 0, 1996 4 9.5.2 Wire Bond 9.5.3 Sa mple leadfra mes shall be bo n d e d using wire and procedures ag reed between vendor an d customer. 9.5.3.1 Wi res and bonds sh all be teste d according to MIL-S…
SEMI G21-94 © SEMI 1980, 19963
8.5.2 Wire Bond
8.5.3 Solderability
8.6 Plating Hardness
9 Test Methods
9.1 Visual Inspection
9.1.1 Visually inspect the plated area using a binocular
microscope, at 10×–30× magnification for the
following rejectable conditions.
9.1.1.1 Any bare spots or missing plating in critical
areas as defined by the coined areas or minimum flat
wire bond area in the appropriate leadframe
specification.
9.1.1.2 Any peeling or blistered plating.
9.1.1.3 Any nodules in critical area as defined in
9.1.1.1.
Note 1: Nodules not exceeding 0.0005" (0.0381 mm) in a
surface dimension and 0.0005" (0.0127 mm) in height in non-
critical areas are allowed providing there are no more than
one per internal lead finger or six (6) per leadframe.
9.1.1.4 Any pits which exceed 0.0003" (0.008 mm) in
depth or 0.0005" (0.0127 mm) in a surface dimension in
critical areas or 0.001" (0.0254 mm) in depth or 0.002"
(0.051 mm) in a surface dimension in non-critical areas.
9.1.1.5 Any scratches or scrapes in the metallization
plating which expose underplate or base material.
9.1.1.6 Any scratches or scrapes in critical areas which
cause a build up of material in excess of 0.0005"
(0.0127 mm) in height.
9.1.1.7 Any foreign material, contamination, oxidation
or tarnish.
9.2 Surface Finish
9.2.1 The surface finish or brightness shall be
inspected according to procedures agreed upon between
vendor and customer.
9.3 Plating Area and Thickness
9.3.1 Plating Area
9.3.1.1 Using a toolmaker’s microscope determine if
spot plated areas meet the requirements of the
leadframe drawing for position and size tolerance.
9.3.2 Thickness
9.3.2.1 Plating thickness shall be measured at
locations agreed between vendor and customer
according to procedures detailed in ASTM B 487,
ASTM B 567, or ASTM B 568.
Note 2: Only use ASTM B 487 for thicknesses greater than
100 micro-inches (0.0025 mm).
9.4 Plating Quality — Heat Test a nd Adhesion Test.
9.4.1 Copper Plate — Test according to procedures
agreed between vendor and customer.
9.4.2 Gold and Silver Plate
9.4.2.1 Submit gold plated samples to 450°C + 10°C
for two (2) minutes in air on a die attach heater block or
hot plate and silver plated samples to 300° C + 10° C
with the same conditions.
Note 3: For silver plating thicknesses less than 100 micro-
inches (0.0025 mm), heat testing is not valid unless an
alternate time and temperature is agreed upon between the
vendor and the customer.
9.4.2.2 Visually inspect the plating under the
microscope set at 10× magnification for blistering,
peeling, and discoloration.
Note 4: For gold plating, discoloration after the heat testing is
only allowable if the fold plate thickness is less than 20
micro-inches (508 microns) by design.
Note 5: 30× magnification may be used for confirmation.
9.4.2.3 Place a strip of tape across the plated area.
Press firmly with fingertips or another smooth object.
9.4.2.4 Peel the tape quickly off the plated surface. If
there is any plating on the tape the component shall be
rejected.
9.4.3 Nickel Plate — Test according to procedures
agreed between vendor and customer.
9.4.4 Palladium Plate — Test according to procedures
agreed between vendor and customer.
9.4.5 Tin Plate — Test according to procedures agreed
between vendor and customer.
9.5 Functional Tests
9.5.1 Die Attach
9.5.1.1 Sample die, using a resin agreed between
vendor and customer, shall be attached to plated
leadframes.
9.5.1.2 Die shear tests shall be performed per MIL-
STD-883, Method 2019 or to a method agreed between
vendor and customer.
9.5.1.3 Resin bleed-out shall not exceed 0.010" (0.254
mm).
Note 6: Control samples from a previously accepted
leadframe lot shall be tested at the same time, using the same
resin batch, for comparison.
SEMI G21-94 © SEMI 1980, 1996 4
9.5.2 Wire Bond
9.5.3 Sample leadframes shall be bonded using wire
and procedures agreed between vendor and customer.
9.5.3.1 Wires and bonds shall be tested according to
MIL-STD-883, Method 2011, and/or ASTM F 1269 by
agreement between vendor and customer.
9.5.4 Tin Plate Solderability
9.5.5 The solderability or alloying capability of the tin
plate shall be evaluated per procedures agreed between
vendor and customer.
9.6 Plating Hardness
9.6.1 Where required for verification of results
obtained in other tests, the plating hardness shall be
measured per ASTM E 384.
10 Certification
10.1 Upon request by the customer in the purchase
order, a vendor’s certification that the plating was
performed and tested in accordance with this
specification, together with a report of the test results,
shall be furnished at the time of shipment. This
certification does not remove the vendor's responsibility
for discrepant product subsequently found by the
customer.
10.2 When certification is requested, the following
information shall be supplied as a minimum
requirement:
10.2.1 Vendor Name
10.2.2 Purchase Order Number
10.2.3 Vendor Lot Number
10.2.4 Customer Part Number
10.2.5 Plating Type, Grade and Measured Thickness
for Under and Finsh Plates
10.2.6 Plating hardness if agreed between vendor and
user.
11 Packaging and Marking
11.1 Packaging
11.1.1 Shipping containers and materials shall be
suitably selected to provide the material with protection
from normal transportation damage risks which include
crushing, abrasion, spillage, and exposure to moisture
and other corrosive gases. The inner packing materials
may be further specified by the customer for cleanliness
and non-tarnishing issues.
11.2 Marking
11.2.1 Internal Packages — Each internal package
shall be marked as follows:
Vendor’s Name
Customer’s Part Number
Customer’s Order Number
Vendor’s Specification Number and Customer’s, if
appropriate
Manufacturing Lot Number
Quantity
Date of Manufacture
11.2.2 External Packages
Customer’s Specification Number
Customer’s Order Number
Quantity
Shipping Date
Any specific instructions for receiving dock
personnel if requested on the purchase order
12 Discrepancy Material
12.1 Material rejected at incoming inspection shall be
segregated and tagged as rejectable.
12.2 The vendor shall be informed and the returned
goods policy activated.
Note 7: Samples showing the defects shall be identified for
the vendor. If the vendor wishes to see the samples before
return of the complete shipment, the material shall be stored
by the customer in a manner to prevent further damage or
deterioration.
SEMI G21-94 © SEMI 1980, 19965
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
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other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
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