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SEMI E30.5-0302 © SEMI 2001, 2002 11 9.2.2.1 T he following rules should b e adhered to in the reporting of these variables. • The inform at ion sh ould be sent using th e correspondin g formats defined on T able 4 an d …

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SEMI E30.5-0302 © SEMI 2001, 2002 10
Table 2 Processing State Events and Associated Reports
CENAME From State To State Required DVVAL's or Reports
END of RUN STOPPING IDLE RUN complete report available.
All jobs specified by PROCESS-BLD-GROUP
command parameter(s) in a CARRIERBLD command
parameter complete.
END of JOB LOAD SETTING
UP
JOB complete report available.
A job specified by a PROCESS-BLD-GROUP command
parameter in a CARRIERBLD command parameter that
specifies multiple jobs for the same material completes.
END of SUBSTRATE UNLOAD LOAD SUBSTRATE complete report available.
END of SITE TAKE MEASURE MEASURE
COMPLETE
SITE complete report available. Only required if
supporting sampling.
END of SAMPLE TAKE SAMPLE SAMPLE
COMPLETE
SAMPLE complete report available. Only required if
equipment performs measurements on individual sites.
8 Collection Event List
8.1 The purpose of this section is to identify data collection events for Metrology equipment and define reporting
levels.
8.2 Requirements — Only those collection events that are not associated with a change of state, and those requiring
specific DVVAL's or Reports defined in the SEM, are required to be included in this section. All SEMI E30
required events are required by this SEM.
8.2.1 Common collection events collection events common to, and required on, all equipment of the class being
addressed.
8.2.2 Configuration-specific collection events collection events associated with a specific configuration of the
equipment class being addressed.
8.3 Collection Event Tables
The first table contains processing state event transitions and associated reports. The
second table contains additional events or actions and associated reports.
8.3.1 All remote commands (S2F41) that are not preformed by the equipment before responding to the host (S2F42)
must generate an event indicating when the task was completed and whether it was successful.
Table 3 Additional Required Collection Events
ACTION or COMPLETED EVENT Required DVVAL's or Reports
Remote command MAP-CASSETTE completed successfully. SlotList
Operator hits button on equipment control panel. OperatorAction
9 Data Item Variables
9.1 The purpose of this section is to define the list of data item variables pertinent to the specific equipment. Values
of these variables shall be available to the host via collection event reports and host status queries.
9.2 Requirement
all generic variable data items defined in SEMI E30 are required by all Measurement
equipment. Data item variables are categorized as follows:
9.2.1 Common Variables (CV) variables common to all equipment of the class being addressed. These variables
are covered in Table 4 and must be used to regardless of the measurement tool type.
9.2.2 Configuration-specific variables (CSV) variables associated with a specific configuration of the above
equipment class.
SEMI E30.5-0302 © SEMI 2001, 200211
9.2.2.1 The following rules should be adhered to in the reporting of these variables.
• The information should be sent using the corresponding formats defined on Table 4 and 5.
• For ASCII variables A[n]. If the actual data does not fill the entire field, blanks shall be used to complete the
field.
• For ASCII variables A[1..n]. All fields should be left justified.
9.3 Since MSEM is generic to all equipment it tries not to specify the names of the measurement variables to be
sent to the host. MSEM does require that the data be reported at site, wafer and lot levels. It should include the
option of reporting data at the individual scan level if supported by the equipment. It is a requirement that the
equipment report at least: max, min, mean, standard deviation. Additional statistic calculations may be added by the
equipment supplier. For each type of data collected by the equipment at the site level; the data must be summarized
and available for reporting at the wafer and lot levels.
9.4 The following rules should be applied when reporting measurement values taken by the tool. The rules specify
the units to be used whenever these values are reported.
• All values specified should be reported in floating point format.
• All critical dimensions (lines and spaces) should be in microns.
• All overlay measurements should be in microns.
• All FTIR transmittance values and corresponding wavelengths should be reported in percent units and microns,
respectively.
• All film stress values should be reported in teradynes/cm-cm.
• All resistivity measurements should be reported in Ohm-cm.
• All film thickness measurements should be reported in Angstroms.
9.5 Data item variables should be documented in the MSEM data item variable dictionary using the following
format:
Variable Name Category Description Class Format Comments
Where:
Variable Name: A unique name for the data item variable (this name is for reference only).
Category: Defined as Common or Configuration-Specific variables.
Description: If class is DVVAL, then the description must contain a statement of when data
is valid in terms of MSEM events.
Class: Data type of the item.
Format: Acceptable formats are SEMI E5 lists, ASCII, floating point, unsigned integer or
signed integer. A description of “ANY”, indicates that any of the above formats
are acceptable and is left to the tool vendor to decide. When required use SECS
Message Language format.
Comments: Any additional information pertinent to the variable name.
9.6 Data Item Variable Types
9.6.1 Equipment Constants (ECV) — can be changed by the host using S2F15. The operator may have the ability to
change some of the values, but the equipment does not change the values on its own. The value of the equipment
constant may be queried by the host at any time using the S2F13/14 transaction.
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9.6.2 Status Variables (SV) — are valid at all times. A SV may not be changed by the host but may be changed by
the equipment or the operator. The value of status variables may be queried by the host at anytime using the S1F3/4
or S6F19/20 transactions.
9.6.3 Data Variables (DVVAL) are variables which are valid only upon occurrence of specific collection events.
An attempt to read a data variable at the wrong time shall not generate an error, but the data reported may not have
relevant meaning.
9.6.4 Variable Data (V) this is a class of variable data which includes all the previously defined types of
variables.
Table 4 Data Item Variable List
Variable name Category Description Class Format Comments
AlignList CSV A list of alignment site
information being used by the
currently active Process Program.
DVVAL
L,n
1. <AlignName>
.
.
n.
See Table 5 for
additional
information.
CarrierID CV ID of the Carrier that the
measurement data is associated
with.
DVVAL
A[1..16]
Valid in
processing
substate.
Coord CV The X,Y coordinate for a site in
microns.
DVVAL
L,2
1.<CoordX>
2.<CoordY>
See Table 5 for
additional
information.
Coordsys CV The identification for applicable
coordinate system.
DVVAL
A[1..16]
Options for
silicon wafers are:
SEMI M20,
M20P, SEMI
M21.
Default-Priority CV The default priority given a
location or carrier ID if none is
assigned.
EC
U4
DeltaX CSV The x axis translation between
the origins of two coordinate
systems, in µm.
DVVAL
F4
Units are in
microns.
DeltaY CSV The y axis translation between
the origins of two coordinate
systems, in µm.
DVVAL
F4
Units are in
microns.
ElementID CSV The M21 address for a specific
rectangular element on a
patterned silicon wafer.
DVVAL
I4[2]
M21 row number,
M21 column
number.
ElementList CSV A list of M21 elements where
measurements were attempted.
DVVAL
L,n
1. <ElementID>
.
.
n
See Table 5 for
additional
information.
EquipID CV Unique ID of measurement
equipment.
SV
A[1..16]
Valid in all sub
states.
EquipName CV Name of equipment SV
A[1..16]
Valid in all sub
states.
LotID CV Lot ID that is associated with the
measurement data.
DVVAL
A[1..80]
M20Data CV The silicon wafer size, fiducial
type, and orientation to use.
DVVAL
L,3
1.<WaferSize>
2.<Fiducial>
3. <Orientation>
See Table 5 for
additional
information.