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SEMI G72.1-099 7 © SEMI 1997 10 NOTICE: These st andards do not purport to addres s safety issues, if any, ass o ciated with their use. It is the responsibility of t he user of these standards to establish appropriate sa…
SEMI G72.1-0997 © SEMI 19979
Design No.
PBD0001 SEMI Standard BGA Design Library Revision Initial
Date
6/20/96
Page
2 of 8
PBGA Wire
Bond Pad (*1)
Solder Ball
Location
Die Wire Bond
Pad I/O Name (& Comments) (*4)
Pkg.
Side (*1) Notes
91 W12 2
95 W13 2
98 W14 2
101 W15 2
105 W16 2
108 W17 2
112 W18 2
115 W19 2
117 W20 3
58 Y1 1
60 Y2 2
64 Y3 2
65 Y4 2
68 Y5 2
72 Y6 2
75 Y7 2
78 Y8 2
82 Y9 2
85 Y10 2
86 Y11 2
90 Y12 2
94 Y13 2
97 Y14 2
99 Y15 2
102 Y16 2
106 Y17 2
109 Y18 2
113 Y19 2
116 Y20 2
NOTES:
*1. Please refer to Notes column for explanations of wirebond (w/b) rings. PBGA Wirebond Pads are numbered counter
clockwise, starting with Pad #1 in the upper left hand corner. Please refer to Top View of package for package side #1, 2, 3, or 4
(Figure 1).
*2. Metallized wirebond (w/b) ring 2 surrounds die attach area for wirebonding to electrically common die pads and electrical
connection with solder balls designated by 2nd Electrical Group symbol on BGA Design Library Drawing (Figure 1).
*3. Metallized wirebond (w/b) ring 1 surrounds die attach area for wirebonding to electrically common die pads and electrical
connection with both die attach pad and solder balls designated by 1st Electrical Group symbol on BGA Design Library Drawing
(Figure 1).
*4. If the number of signal Die Wirebond Pads (not including Electrical Groups) total less than 231, the total number may be
divided by 4 and wirebond placement centered on each package side.
*5. Thermal enhancement of 6 x 6 solder balls.
SEMI G72.1-0997 © SEMI 1997 10
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G72.2-0997 © SEMI 19971
SEMI G72.2-0997
DESIGN PROPOSAL FOR BALL GRID ARRAY DESIGN LIBRARY:
388 PIN PLASTIC BALL GRID ARRAY
Table 1 Plastic Ball Grid Array (PBGA) General Design Characteristics
Ball Count Signal I/O Body Size Pitch Matrix Array
Thermal
Enhan.
Profile
Height
Cavity
Orient.
Wirebond
Rings
388 304
35×35
1.27
26×26
depopulated
6×6
2.33 up 2
Substrate
Material
Metal
Layers
Die Inter-
connect
Encapsulation
Design / Material
Ball
Composition
JEDEC
Designation
Precondition-
ing Level
Design
No.
SEMI
Designa-
tion No.
BT Laminate 2(2S0P0G) wirebond overmolded epoxy 63/37 Sn/Pb MO-151
BAR-2, B
Level 3,Rev 0 PBD0002 G72.2