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SEMI E119-1104 © SEMI 2002, 2004 17 RELATED INFORMATION 1 APPLICATION NOTES NOTICE : This Related Information is being balloted as an official part o f SEMI E119 by full letter ballot procedures. T h e recomm endations i…

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SEMI E119-1104 © SEMI 2002, 2004 16
Symbol
Used
Figure
Number
Value Specified Datum Measured from Feature Measured to
y58
#1
6, 10 75 mm (2.95 in.)
minimum
facial datum plane end of left and right conveyor rails
y62 10, 11
28 mm (1.10 in.)
maximum
facial datum plane rear of front retaining feature
y63 10, 11
37.3 ± 0.5 mm
(1.47 ± 0.02 in.)
facial datum plane rear of ramp on front retaining feature
y64 10, 11, 12
42.1 ± 0.5 mm
(1.66 ± 0.02 in.)
facial datum plane front of ramp on front retaining feature and
front side of advancing box sensing pads
y65 10, 11
104 mm (4.09 in.)
minimum
facial datum plane front of front retaining feature
y66 12
50 mm (1.97 in.)
minimum
facial datum plane rear side of advancing box sensing pads
y67 8, 10 25 mm (0.98 in.) facial datum plane origin of r67 on bilateral datum plane
y68
#1
9 55 mm (2.17 in.)
maximum
facial datum plane near end of the front kinematic groove in the
top robotic handling flange
z2 None 2 mm (0.08 in.)
maximum
horizontal datum plane bottom of carrier sensing pads and info pads
(when down)
z41 6, 7 0 mm (0 in.)
minimum
external horizontal datum
plane
bottom of FOBIT
z43
#1
6, 7 2 ± 1 mm
(0.08 ± 0.04 in.)
external horizontal datum
plane
bottom conveyor rails
z47
#1
6, 7, 9 221 ± 1 mm
(8.70 ± 0.04 in.)
external horizontal datum
plane
bottom surface of the top robotic handling
flange
z48
#1
6, 7, 9 15 mm (0.59 in.)
minimum
bottom of robotic
handling flange
encroachment of FOBIT top underneath
robotic handling flange
z49
#1
6, 7, 9 8 mm (0.31 in.)
maximum
bottom of robotic
handling flange
top of robotic handling flange and upper door
frame volume
z50
#1
9 5 mm (0.20 in.)
minimum
bottom of robotic
handling flange
encroachment of FOBIT top underneath the
center hole in the top robotic handling flange
z60 11
8.0 ± 0.5 mm
(0.31 ± 0.02 in.)
external horizontal datum
plane
top of slot in center retaining feature
z61 11
15 mm (0.59 in.)
minimum
external horizontal datum
plane
top of chamber above slot in center retaining
feature
z62 11
18 mm (0.71 in.)
minimum
external horizontal datum
plane
top of front retaining feature
z63 11
7.5 ± 0.5 mm
(0.30 ± 0.02 in.)
external horizontal datum
plane
top of ramp on front retaining feature
z65
#1
6, 7 7 mm (0.28 in.)
minimum
horizontal datum plane upper boundary of cylindrical fork-lift pin
holes in left and right bottom conveyor rails
#1
These dimensions are for optional features.
6 Related Documents
6.1 SEMI Standards
SEMI E22.1 — Cluster Tool Module Interface 300
mm: Transport Module End Effector Exclusion Volume
Standard
SEMI E63 — Mechanical Specification for 300 mm
Box Opener/Loader to Tool Standard (BOLTS-M)
Interface
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
SEMI E119-1104 © SEMI 2002, 2004 17
RELATED INFORMATION 1
APPLICATION NOTES
NOTICE: This Related Information is being balloted as an official part of SEMI E119 by full letter ballot
procedures. The recommendations in this appendix are optional and are not required to conform to this standard.
R1-1
R1-1.1 Although FOBIT parameters supporting effective reuse and cleaning (washing/drying) are not defined in
this document, it is essential that these capabilities be considered for a successful overall transportation box design.
R1-1.2 It is important to note that transportation boxes containing wafers are typically bagged for shipment. It is
therefore important to design the outer surfaces of the box to be compatible with this common practice.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
The user's attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E124-1103 © SEMI 2003 1
SEMI E124-1103
PROVISIONAL GUIDE FOR DEFINITION AND CALCULATION OF
OVERALL FACTORY EFFICIENCY (OFE) AND OTHER ASSOCIATED
FACTORY-LEVEL PRODUCTIVITY METRICS
This provisional guideline was technically approved by the Global Metrics Committee and is the direct
responsibility of the North American Metrics Committee. Current edition approved by the North American
Regional Standards Committee on July 27, 2003 and September 3, 2003. Initially available at www.semi.org
September 2003; to be published November 2003. Originally published July 2003.
1 Purpose
1.1 This guide describes metrics that show how well a
factory is operating compared to how well it could be
operating (for the given product mix). These metrics
can be used for tracking factory performance (in value-
added production) in a way that rewards good
operational decisions and that is not easy to adversely
manipulate. They can be used in a process of ongoing
improvement that can be visible to all levels of a
semiconductor manufacturing organization.
1.2 The metrics in this guide are intended for
evaluating the relative efficiency of factory production
after the factory is in production, not for capacity
analysis while the factory is being designed or
redesigned. However, some of these metrics can be
used in factory simulations for choosing equipment sets
and scheduling policies.
2 Scope
2.1 To evaluate the overall effectiveness of a factory,
there are at least three things in need of measurement:
production, utilization of assets, and costs. This guide
focuses on evaluating production; utilization of assets
and costs (as well as other economic factors) are
outside its scope. See Section R3-1.1 in Related
Information 3 for a discussion of metrics in other areas.
2.2 This guide describes metrics for an entire
integrated production line. Multiple production lines in
the same factory may be evaluated separately if they do
not share resources (such as material handling or
production equipment).
2.3 This guide is provisional because overall factory
efficiency (OFE) is a new concept. Once the metrics
have been validated by collecting data in production
factories, computing the metrics, and evaluating their
sensitivity to the data, this guide should be modified
and upgraded from provisional status (as specified in
the SEMI regulations). Also, additional supplemental
metrics may be defined, and the metric definitions
given here may be expanded to truly comprehend
assembly operations.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Limitations
3.1 In the context of this guide, it is important to note
that factory-level productivity is impacted greatly by
factors beyond the factory itself, including material
availability, efficiency of product device designs, and
customer demand.
3.2 The metrics in this guide are intended for
evaluating the overall efficiency of factory production,
not for diagnosing problems (or opportunities for
improvement) in the factory, although some component
metrics can be used that way. See Section R3-1.2 in
Related Information 3 for a discussion of the
differences between the two kinds of metrics.
3.3 This guide provides metrics and calculations for
measuring the overall productivity only of
manufacturing environments (such as wafer fabs, flat
panel factories, and some disk-drive production
facilities) in which product substrates move through the
factory with no assembly or disassembly processes.
These metrics can be applied in a post-wafer back-end
chip production facility if the lead frames are
considered to be consumable materials (not units of
production in their own right). However, in the future
this guide may be extended to comprehend other, more
complex manufacturing environments (including
assembly operations).
4 Referenced Standards
4.1 SEMI Standards
SEMI E10 — Specification for Definition and
Measurement of Equipment Reliability, Availability,
and Maintainability (RAM)
SEMI E79 — Standard for Definition and Measurement
of Equipment Productivity