semi合集-English.pdf - 第6182页

SEMI G38-0996 © SEMI 1987, 2004 7 Figure 3 Test Board Orientation Inside Wind Tunnel

100%1 / 7923
SEMI G38-0996 © SEMI 1987, 2004 6
Pattern ___________________________________________
3. Measurement Condition
Ambient Temperature, T
a
________________ °C
Ambient Humidity, H
a
________________ %RH
Air Velocity, V
a
0, 1, 2, 5, ( ) mm/sec.
Power Dissipation, P
H
0, 1, 2 W
4. No. of Samples, N
________________
5.
Thermal Resistance, R
θJA
________________ °C/W
8 Related Documents
8.1 Laboratory Methods of Testing Fans for Rating, AMCA Standard 210-74/ASHRAE Standard 51-75, Air
Movement and Control Association and the American Society of Heating, Refrigerating and Air-Conditioning
Engineers, 1975.
8.2 Fluid Meters — Their Theory and Application, American Society of Mechanical Engineers, Sixth Edition, 1971.
Figure 1
Test Board Positioning
Figure 2
Wind Tunnel Set-Up
SEMI G38-0996 © SEMI 1987, 2004 7
Figure 3
Test Board Orientation Inside Wind Tunnel
SEMI G38-0996 © SEMI 1987, 2004 8
APPENDIX 1
REPORT FORMAT
NOTICE: This appendix was approved as an official part of SEMI G38 by full letter ballot procedure.
The following format is a sample of report format:
1. Description of Package
1.1 Package Type
Package Name ________________ (per JEDEC or EIAJ)
Pin Counts ________________ pins
Special Specification ________________ Yes ________________ No
1.2 Test Chip
Chip per SEMI G32 ________________ Yes ________________ No
Chip Size ________________ mm x ________________ mm
Chip Thickness ________________ mm
1.3 Leadframe
Leadframe Material Fe/Ni Alloy, Cu, Cu Alloy, Other (________________)
Leadframe Thickness ________________ mm
Die Pad Size ________________ mm x ________________ mm
1.4 Package Dimension & Compound
Package Size ________________ mm x ________________ mm
Package Thickness ________________ mm
Compound Material ________________________________
1.5 Others
Die Attach Material ________________________________
Heat Sink/Spreader ________________ Yes ________________ No
2. Description of Test Board
Test Board per SEMI G42 ________________ Yes ________________ No
No. of Layers ________________________________
3. Measurement Result
Power Dissipation ________________ W