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SEMI F42-0600 © SEMI 199 9, 2000 2 5.1.5 s ag generator — test apparatu s c apable of reducing voltage su pplied to the devi ce under test for specific time durations. 5.1.6 vol tage sag — an rms redu ctio n in t he ac v…

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SEMI F42-0600 © SEMI 1999, 20001
SEMI F42-0600
TEST METHOD FOR SEMICONDUCTOR PROCESSING EQUIPMENT
VOLTAGE SAG IMMUNITY
This test method was technically approved by the Global Facilities Committee and is the direct responsibility
of the North American Facilities Committee. Current edition approved by the North American Regional
Standards Committee on March 2 and April 10, 2000. Initially available on www.semi.org May 2000; to be
published June 2000. Originally published June 1999.
1 Purpose
1.1 The purpose of this document is to define the test
method used to characterize the susceptibility of
semiconductor processing, metrology, and automated
test equipment to voltage sags.
2 Scope
2.1 This document defines the testing procedures and
test equipment required to characterize the suscepti-
bility of equipment to voltage sags by showing voltage
sag duration and magnitude performance data for the
equipment.
NOTE 1: Characterizing equipment voltage sag immunity
allows for the identification of tolerances, if any, that may
exist between the actual equipment immunity and any one or
more voltage sag performance specifications.
2.2 This test method is intended for, but not limited to,
the following equipment types:
Etch equipment (Dry & Wet)
Film deposition equipment (CVD & PVD)
Thermal equipment
Surface prep and clean
Photolithography equipment (Stepper & Tracks)
Chemical Mechanical Polishing equipment
Ion Implant equipment
Metrology equipment
Automated test equipment
2.3 This standard does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
3 Limitations
3.1 This standard does not address testing for over-
voltage conditions.
3.2 International, national and local codes, regulations
and laws should be consulted to ensure that the
equipment and procedures meets regulatory require-
ments in each location.
4 Referenced Standards
4.1 SEMI Standard
SEMI S2 — Safety Guidelines for Semiconductor
Manufacturing Equipment
4.2 IEEE Standard
1
IEEE 1250 — Guide for Service to Equipment
Sensitive to Momentary Voltage Disturbances
NOTE 2: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
5 Terminology
5.1 Definitions
5.1.1 device under test (DUT) — the semiconductor
process, metrology, or automated test equipment
intended to be tested, including the equipment
mainframe and all subsystems whose electrical power is
directly affected by the operation of the equipment’s
EMO system.
5.1.2 emergency off circuit (EMO) — a control circuit
which when de-activated, places the equipment into a
safe shut down condition and will restrict all hazardous
potentials to the main power enclosure. This is a state in
which all hazardous voltage has been removed from the
equipment, all hazardous production materials flow has
been stopped, any radiation sources de-energized or
totally contained, any capacitors grounded, all moving
parts stopped, internal and external heat sources shut
off, and the equipment presents minimum hazard to
personnel or the facility. [SEMI S2]
5.1.3 point of connection (POC) the point where
the facility utility connects to the exterior of the
equipment.
5.1.4 ride-through capability — the ability of equip-
ment to withstand momentary interruptions or sags
[IEEE 1250]. Also known as voltage sag immunity.
1 The Institute of Electrical and Electronic Engineers, Inc., 345 East
47th Street, New York, NY 10017-2394, USA
SEMI F42-0600 © SEMI 1999, 2000 2
5.1.5 sag generator — test apparatus capable of
reducing voltage supplied to the device under test for
specific time durations.
5.1.6 voltage sag — an rms reductio n in the ac
voltage, at power frequency, for durations from half-
cycle to a few seconds [IEEE 1250]. Also known as
voltage dip.
6 Test Apparatus
6.1 Data Acquisition System (DAS): The DAS will
allow monitoring of the device under test and selected
subsystems during the test. The DAS must measure the
voltage and current at least two cycles (40/33 ms)
before, during, and at least two cycles (40/33 ms) after
the voltage sag event. The DAS must have the
performance characteristics defined in Table 1.
NOTE 3: (40/33 ms) refers to 40 ms at 50 Hz or 33 ms at 60
Hz.
Table 1 Data Acquisition System Performance
Requirements
Parameter Requirement
Measurement Accuracy ± 3 percent of reading
Minimum Sample Rate 900 Hz
Minimum Number of
Analog Inputs
As required by the Test Plan
(see Section 10.1.4)
6.2 Digital Volt Meter (DVM) — A digital meter with
current and voltage measurement probes. Minimum
performance requirements of 1% accuracy, true rms,
and resolution of 3 1/2 digits.
6.3 Sag Generator The sag generator must be
capable of providing voltage sags of controlled
magnitude and duration relative to the nominal supply
voltage of the DUT. The sag generator must be able to
create voltage sags over the range of durations and
magnitudes as required. The sag generator must be
capable of producing independent output voltages on
each phase of the load. The sag generator must have the
performance characteristics in Table 2 (see Related
Information 1).
Table 2 Sag Generator Performance Requirements
Parameter Requirement
Insertion loss (the difference
between sag generator input and
output voltages when set to 100%
of nominal)
Less than 1.5%
Change in output voltage as load is
varied from 0–100% (steady state
load regulation)
± 5%
Output current capability As required by the
DUT.
Capability to supply inrush current Not to be limited by
the sag generator.
Under all conditions, the
maximum deviation from required
voltage (dynamic load regulation)
Less than ± 10% for
not more than 1
cycle (20/17 ms).
7 Safety Precautions
NOTE 4: The following are safety guidelines for voltage sag
testing and as such should be considered only recommend-
ations since regional safety regulations vary. International,
national and local codes, regulations and laws should be
consulted to ensure that the equipment and procedures meet
regulatory requirements in each testing location.
7.1 Work should be conducted in accordance with
industry standard safety procedures. Since panels may
need to be open in order to connect voltage probes and
route power leads to and from the sag generator, this
work is classified as Type 2 Energized Electrical Work
per SEMI S2. Test equipment manufacturer’s safety
recommendations should be followed.
7.2 Worker Safety
7.2.1 During testing lock and tag (lockout/tagout)
procedures should be followed to control hazardous
energy (reference appropriate regional regulations and
requirements). No circuit should be connected or wired
when electricity is present. This includes power
connections as well as the connection of various
monitoring probes.
7.2.2 The area immediately surrounding the device
under test (DUT) should be cordoned off and appro-
priate signs like “Test In Progress” should be posted.
7.2.3 Appropriate personal protective equipment
should be worn at all times.
7.2.4 Only authorized personnel should be allowed
within the cordoned off test area.
7.2.5 Work should be done as described in the test
procedure (see Section 10).
SEMI F42-0600 © SEMI 1999, 20003
7.2.6 Proper connections should be traced and verified
before energizing.
7.3 Equipment Safety
7.3.1 The sag generator should have a fail-safe design.
NOTE 5: Subjecting equipment to repeated voltage sags of
less than 80% nominal for longer than 3 seconds may damage
equipment.
7.3.2 The sag generator should be protected by an
appropriately sized branch circuit breaker at the utility
power source. This will protect the sag generator and
DUT from short circuits and overcurrent conditions.
7.3.3 Every effort should be made to protect the DUT.
As with other equipment tests damage to the DUT is
possible. Although only a remote possibility, the
equipment owner should be made aware of the potential
for damage.
8 Sampling and Test Specim ens
8.1 Characterization tests are conducted on samples of
production articles, not on each item produced.
Characterization tests apply to equipment that is
manufactured to a single design either in multiple
quantities or one-of-a-kind. The equipment selected for
testing should reflect current production models of the
supplier.
8.2 The intent of this document is to make reasonable
efforts to test the semiconductor process, metrology,
and automated test equipment as a complete operating
system under the actual intended conditions of end use.
To simulate the worst-case condition, the tests
described in this document should be performed during
the most sensitive process mode of the equipment as
determined by the equipment supplier.
9 Test Setup
9.1 The test setup should consist of a sag generator
and a data acquisition system as shown in Figure 1.
9.2 When the current required by the DUT is within
the sag generator’s rating, the sag generator shall be
connected between the incoming utility power source
and the point of connection (POC) on the DUT. If the
current required by the DUT is greater than the rating of
the sag generator, then individual subsystems of the
DUT can be tested separately.
9.2.1 If DUT subsystem testing is required due to the
limitation of the sag generator, each subsystem must be
tested independently with the other parts of the DUT
operating. Tested in this manner, any interlocks or
alarms that might activate during the test will be
apparent. Testing the DUT main power module may
require providing power to only the main power
module, leaving the subsystems turned off. After the
characteristics of the DUT main power module EMO
circuit are known, testing of DUT subsystems can begin
as described.
9.2.2 Power down the DUT.
Sag
Generator
Device
Under Test
(DUT)
Data
Acquisition
System
(DAS)
N
ominal
Voltage
Test
Voltage
Equipment and
Sub-component
Measurements
POC
Utility Power
Source Branch
Circuit Breaker
NOTE: Single-phase test fixture is shown for clarity.
Figure 1
Test Setup