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SEMI E98-1102 © SEMI 2000, 2002 44 R1-2.2 In addition to issues regarding acces s, users require that equipment be capable of continuous processing. T o meet this requirement, certain types of equipment need to provide i…

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SEMI E98-1102 © SEMI 2000, 2002 43
R1-1.4 Combined Linked Litho
Equipment
Module
(Apply &
Develop
Track)
Equipment
Subsystem
(LoadPort)
Equipment
Subsystem
(Wafer
Transport)
Equipment
Module
(Chill Plate)
Equipment
Module
(Vapor
Prime)
1+
Equipment
Module
(Vacuum
Bake)
Equipment
Module
(Apply)
Equipment
Module
(Develop)
1+
1+
1+
1+ 1+ 1+
Equipment
Subsystem
(Temp
Control)
used by
used by
1+
Figure R1-4
Linked Litho Track Module
R1-1.4.1 The Linked Litho Equipment has two major EquipmentModules, the track module and the expose module
in this model. The track, in turn, is composed of various types of Sub-modules, such as the Vapor Prime module,
the Spin module, and so forth.
Equipment
Module
(Litho)
1+
Equipment
Subsystem
(Wafer
Transport)
Equipment
Subsystem
(Expose Stage)
Equipment
Resource
(Laser System)
Equipment
Subsystem
(Alignment
Stage)
Equipment
Subsystem
(Reticle
Management)
Equipment
Subsystem
(Single
WaferPort)
1+
Figure R1-5
Linked Litho Expose Module Object Model
R1-1.4.2 Figure R1-6 shows the makeup of another track module. This process may be extended as many times as
is required by the particular installation.
R1-2 300 mm Equipment
R1-2.1 Because of the size and the weight of wafers with a diameter of 300 mm or greater, a 25-wafer cassette is
too heavy for repetitive lifting by people. 300 mm factories must be able to integrate automated material handling
systems and production equipment. To achieve this, equipment loadports must be standardized for access by
different material handling technologies such as overhead tracks and rail-guided vehicles in addition to personal-
guided vehicles (PGVs) used by operators.
SEMI E98-1102 © SEMI 2000, 2002 44
R1-2.2 In addition to issues regarding access, users require that equipment be capable of continuous processing. To
meet this requirement, certain types of equipment need to provide intermediate storage for carriers to prevent
starvation, running out of work before new work is delivered.
Equipment
Module
(SpinCoat)
Equipment
Subsystem
(Dispense Arm
Position)
Equipment
Subsystem
(Spindle)
1+1+
Sensor
(Vacuum)
Equipment
Subsystem
(Spindle
Chuck)
Equipment
Subsystem
(Spin Motor)
Equipment
Subsystem
(Temperature
Control)
uses
Equipment
Subsystem
(Dispense)
Equipment
Subsystem
(Nozzle)
Equipment
Subsystem
(Pump)
Equipment
Subsystem
(Reservoir)
shared
resource
1+
- temperature
- humidity
Equipment
Subsystem
(Wafer
Positioning)
- occupied
- ramp rate
- speed
Figure R1-6
Spin/Coat Track Module Object Model
300mm
Production
Equipment
Equipment
Subsystem
(Buffer)
Equipment
Module
(Process)
Equipment
Subsystem
(LoadPort)
1+
Equipment
Subsystem
(Wafer
Transport)
...
1+1+
Equipment
Subsystem
(Carrier
Storage Unit)
Equipment
Subsystem
(Substrate
Port)
1+1+ 1+
Equipment
Subsystem
(Carrier
Transport)
Figure R1-7
Example of Object Model for 300 mm Equipment
SEMI E98-1102 © SEMI 2000, 2002 45
R1-2.3 The term “Equipment Front End Module” (EFEM) refers to the aggregation shown in Figure R1-8
consisting of all the components handling carriers, i.e., the loadport and buffer subsystems. An EFEM would not
typically provide ARAMS capability and therefore would be considered as an EquipmentSubsystem and not
considered as an OBEM EquipmentModule.
Equipment
Front End Module
(EFEM)
Equipment
Subsystem
(Buffer)
Equipment
Subsystem
(LoadPort)
1+
Equipment
Subsystem
(Carrier
Storage Unit)
Equipment
Subsystem
(Substrate
Port)
1+1+
1+
Equipment
Subsystem
(Carrier
Transport)
Figure R1-8
Equipment Front End Module (EFEM)