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SEMI G26-90 © SEMI 198 3, 1996 3 10 Packaging and M arking 10.1 Packagi ng — Containers sele c t e d sha ll be str ong enough a nd sui tably des i gned to prov ide maximum protection against crushing, spillage and other …

SEMI G26-90 © SEMI 1983, 1996 2

5 Dimensions and Permissi ble Variations

The lid dimensions shall conform as specified in Figure

3 and Table 1.

Figure 3

Dimensions

Table 1 Lid Dimensions for 0.050" Pad Centerline

Terminals

Chip Carrier

Base

Thickness

(Reference) DIM A DIM B DIM T DIM W

S/R,

WIDTH

20 0.020 0.310 0.230 0.060 0.020 0.040

28 0.025 0.410 0.330 0.060 0.025 0.040

44 0.040 0.500 0.420 0.065 0.025 0.040

68 0.040 0.700 0.560 0.065 0.022 0.070

6 Materials

6.1 Ceramic

6.1.1 Alumina content 90% minimum or Beryllia

content 94% minimum.

6.1.2 Dark or white.

6.2 Sealing Material — As specified in the ordering

information.

7 Defect Limits

7.1 Ceramic

7.1.1 Cracks — Cracks are not allowed.

7.1.2 Chips

7.1.2.1 Corner — 0.762 mm × 0.762 mm × 0.762 mm

(0.030" × 0.030" × 0.030").

7.1.2.2 Edge — 0.762 mm × 0.762 mm × 0.762 mm

(0.030" × 0.030" × 0.030").

7.1.2.3 Chips cannot reduce the seal path by more than

0.381 mm (0.015") or 10%, whichever is smaller.

7.1.3 Burrs, Projections, and Fins — Lids — 0.127

mm (0.005") maximum.

7.1.4 Camber — 0.004 inch/inch. For sizes below one

inch the maximum camber shall be 0.076 mm (0.003").

7.2 Glass

7.2.1 Chips or Voids — There shall be no chips or

voids after glass flow test.

7.2.2 Glass Misalignment — (As received.)

7.2.2.1 External Overhang — 0.254 mm (0.010")

maximum.

7.2.2.2 External Rundown — 30% of ceramic

thickness maximum at maximum material condition.

7.2.2.3 Glass Pullback — 0.254 mm (0.010")

maximum.

7.2.2.4 Regardless of maximum allowable criteria

stated above, the seal area must not be reduced by

greater than 20% of the nominal design width.

7.2.3 Glass thickness shall be measured in four

locations. Measurement shall be made on glass and

base total thickness. Base reference thickness shall be

measured on the same part by removal of a portion of

the glass.

7.2.4 Glass splatter in all areas may not exceed 0.052

mm (0.002") in height, 0.127 mm (0.005") in diameter,

with a maximum of three per 0.1" square area on the

cavity surface.

8 Sampling

Sampling will be determined between supplier and

purchaser.

9 Test Methods

9.1 Sequence of Events and Functional Testing —

During functional testing, the sequence of testing shall

be:

1. Seal

2. Vapor Content

3. Environmental Testing

4. Fine Leak

5. Gross Leak

6. Torque Test

9.2 Hermetic and Environmental Testing

9.2.1 The hermetic integrity of the package must be

maintained after all environmental testing. Hermetic

checks shall comply with MIL-STD-883, Method 1014,

Test Conditions A

, or B and C.

9.2.2 Environmental testing shall include: Temp

Cycle, MIL-STD-883, Method 1010, Condition C.

SEMI G26-90 © SEMI 1983, 19963

10 Packaging and Marking

10.1 Packaging — Containers selected shall be strong

enough and suitably designed to provide maximum

protection against crushing, spillage and other forms of

damage to the container or its contents. Containers shall

afford protection of the contents to contamination from

exposure to excessive moisture or oxidation by gases.

Packaging materials shall be so selected to prevent any

contamination of the ceramic component parts with

paper fibers or organic particles.

10.2 Marking — The outer containers shall be clearly

marked to identify the user stock number, user purchase

order number, drawing number, quantity, vendor lot

number, and solder glass type.

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI G27-89

SPECIFICATION FOR LEADFRAMES FOR PLASTIC LEADED CHIP

CARRIER (PLCC) PACKAGES

1 Preface

This specification is a guideline for high volume

production of leadframes for plastic leaded chip carrier

semiconductor packages. It is a design guideline for

packaging engineers, leadframe stampers and mold

manufacturers, and has been developed to meet the

requirements of automatic assemblers.

2 Applicable Documents

2.1 Order of Precedence — To avoid conflicts, the

order of precedence when ordering leadframes to this

specification shall be as follows:

Purchase Order

This Specification

Referenced Documents

2.2 SEMI Specifications

SEMI G4 — Specification for Integrated Circuit

Leadframe Material

SEMI G10 — Standard Method of Mechanical

Measurement for Leadframes

SEMI G18 — Specification, Integrated Circuit

Leadframe Materials Used in the Production of Etched

Leadframes

SEMI G21 — Specification, Plating Integrated Circuit

Leadframes

2.3 Military and Federal Specifications

MIL-STD-105 — Sampling Procedures and Tables for

Inspection by Attributes

MIL-STD-883 — Test Methods and Procedures for

Microelectronics

2.4 ANSI Specification

Y14.5M — Dimensioning and Tolerancing

2.5 JEDEC Publication

Publication 9b — Registered and Standard Outlines for

Semiconductor Devices

1 Military Standards, Naval Publications and Form Center, 5801

Tabor Avenue, Philadelphia, PA 19120

2 ANSI, 1430 Broadway, New York, NY 10018

3 JEDEC, 20001 Eye Street N.W., Washington, D.C. 20006

3 Selected Definitions

burr — a fragment of excess material either horizontal

or vertical attached to the leadframe.

camber — curvature of the leadframe strip edge (see

Figure 1).

Figure 1

Camber

coil set — longitudinal bowing of the leadframe (see

Figure 2).

Figure 2

Coil Set

coined area — that area at the tip end of the bond

fingers coined to produce a flattened area for functional

use (see Figure 3).