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SEMI P22-0699 © SEMI 1993 , 1999 7 S2 S1 S2 S1 Figure 27 Figure 28 Corner Extensio n Randomly S haped Corner Int rusion Rando mly Shaped S1 S2 S2 S1 Figure 29 Figure 30 Corner Extensio n Randomly S haped Corner Int rusio…

SEMI P22-0699 © SEMI 1993, 1999 6

Figure 21 Figure 22

Missing Opaque Pattern Missing Clear Pattern

Figure 23 Figure 24

Dot Randomly Shaped Edge Extension Randomly Shaped

Figure 25 Figure 26

Misplacement On Opaque Pattern Opaque Bridge

SEMI P22-0699 © SEMI 1993, 19997

Figure 27 Figure 28

Corner Extension Randomly Shaped Corner Intrusion Randomly Shaped

Figure 29 Figure 30

Corner Extension Randomly Shaped Corner Intrusion Randomly Shaped

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer's

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user's attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI P23-0200 © SEMI 1993, 20001

SEMI P23-0200

GUIDELINES FOR PROGRAMMED DEFECT MASKS AND

BENCHMARK PROCEDURES FOR SENSITIVITY ANALYSIS OF MASK

DEFECT INSPECTION SYSTEMS

These guidelines were technically approved by the Global Mask and Mask Equipment Committee and are the

direct responsibility of the Japanese Mask and Mask Equipment Committee. Current edition approved by the

Japanese Regional Standards Committee on September 10, 1999. Initially available at www.semi.org

February 2000; to be published February 2000. Originally published in 1993; previously published in 1996.

NOTE: These guidelines were rewritten in their entirety

in February 2000.

1 Purpose

1.1 The purpose of this guideline is to propose a test

mask to be used for evaluation of the sensitivity of

Mask Defect Inspection Systems. This test mask

consists of test chips including programmed pattern

defects and reference test chips without programmed

defects. Since the test chip is an assembly of cells, the

test chips are defined in this guideline by cell patterns,

programmed defects in cell patterns, and the layout of

the cells. Also, the test mask is defined by defining the

test chips arrangement. Furthermore, the use of this

mask is described. It is desirable that these test masks

and benchmark procedures be used when the sensitivity

of a Mask Defect Inspection System is evaluated.

1.2 Background — Different masks have been used by

many equipment manufacturers and users in the past,

and sensitivity has been tested by various methods

decided independently by each manufacturer and user.

In some cases, no common measurement methods or

sensitivity analysis methods have been agreed upon.

Therefore, confusion exists concerning the sensitivity

comparison of equipment between manufacturers, the

definition for specifications between users and

suppliers, and the definition for specifications between

users. Also, due to the fact that several problems were

found when using the previous guideline in actual

manufacturing, the document has been reviewed and

content has been changed throughout. It was also the

goal of this revision, while considering ease of

manufacturing of test masks first, to fully cover the

evaluation of mask defect inspection systems.

2 Scope

2.1 This guideline defines the content and methods for

use of test masks used in the evaluation of mask defect

inspection systems. Although it is possible to use this

test mask to evaluate transcription of defects etc., this

standard does not attempt to define these processes.

2.2 This guideline shall be revised when a new

effective measurement technology for defect sizing

becomes commonly available in the market.

2.3 This guideline does not purport to address safety

issues, if any, associated with its use. It is the

responsibility of the users of this guideline to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

3 Referenced Standards

3.1 SEMI Standards

SEMI P1  Specification for Hard Surface Photomask

Substrates

SEMI P22  Guideline for Photomask Defect

Classification and Size Definition.

SEMI P33  Provisional Specification for

Developmental 230 mm Square Hard Surface

Photomask Substrates

NOTE 1: As listed or revised, all documents cited shall be the

latest publications of adopted standards.

4 Terminology

4.1 Definitions

4.1.1 Many terms relating to photomask technology

are defined in SEMI P22 and SEMI P33.

4.1.2 design pattern  pattern of intended design

data.

4.1.3 photomask pattern  pattern on photomask

surface.

5 Mask (See Figure 1)

5.1 Masks will be either 5" or 6" which meet SEMI

P1; both the 5" and 6" will be the same layout.

5.2 Masks will be limited to two types, namely

Conventional and Attenuated (Half Tone). Note that

Levenson and Optical Proximity Correction (OPC)

types will not be included.