semi合集-English.pdf - 第1027页
SEMI E140-0305 © SEMI 2005 13 NOTICE: SEMI makes no warranties or represen tations as to the suitability o f the standards set forth herein for any particular application. The determination of the suitability of the stan…
SEMI E140-0305 © SEMI 2005 12
Row
#1
Year 1 Year 2 Year 3 Year 4 Year 5 Year 6 Year 7 Formula
TD22 Cumulative, $ 0 0 0 0 0 0 0 =(Year 1 value =
Year 2 value = …
= Year n value)
#1
Row numbers begin with 16 to align with the corresponding rows in the sample spreadsheet. The row numbering convention is the Table
number (using a lettering scheme to simplify the formulae) followed by the row in that table.
Table 5 COO for the Input Data Listed in Table 1.
Row
#1
Year 1 Year 2 Year 3 Year 4 Year 5 Year 6 Year 7 Formula
TE4 Fixed Costs, $ 96,800 15,718 15,718 15,718 15,718 14,843 14,843 For Year n,
=IF(TA14>=1,TB4
4 value for year n,”
Asset Fully
Depreciated”)
TE5 Recurring Costs, $ 64,035 65,956 67,935 69,973 72,072 Asset
Retired
Asset
Retired
For Year n,
=IF(TA16>=1,TC3
6 value for year n,”
Asset Retired”)
TE6 Yield Costs, $ 0 0 0 0 0 Asset
Retired
Asset
Retired
For Year n,
=IF(TA16>=1,TC3
6 value for year n,”
Asset Retired”)
TE7 Total Costs, $ 160,836 81,674 83,653 85,691 87,790 14,843 14,843 =(TE4:TE6)
TE9 Cumulative Fixed
Costs, $
96,800 112,518 128,236 143,954 159,672 174,515 189,358 =Year n value in
row TB45
TE10 Cumulative
Recurring Costs, $
64,035 129,992 197,927 267,900 339,973 339,973 339,973 =Year n value in
row TC37
TE11 Cumulative Yield
Costs, $
0 0 0 0 0 Asset
Retired
Asset
Retired
=Year n value in
row TD22
TE12 Cumulative Total
Costs, $
160,836 242,510 326,163 411,854 499,644 514,487 529,330
#3
=(TE9:TE11)
TE24 Yearly Cost,
$/wafer
0.5887 0.2990 0.3062 0.3137 0.3214 Asset
Retired
Asset
Retired
=IF(TA16>=1,TE7
/ TA16/(TA26 ×
TA31)/(TA147 ×
TA148),”Asset
Retired”)
TE26 Cumulative Cost,
$/wafer
0.5887 0.4439 0.3980 0.3769 0.3658 0.3767 0.3875
#4
=IF(TA16>=1,TE1
2/TA16/(TA26 ×
TA31)/(TA147 ×
TA148),TE12/TA1
6/TA16/(TA26 ×
TA31)/(TA147 ×
TA148))
#1
Row numbers begin with 4 to align with the corresponding rows in the sample spreadsheet. The row numbering convention is the Table
number (using a lettering scheme to simplify the formulae) followed by the row in that table.
#2
For the results shown in the table, Useful Life of Piece of Equipment = 5 yrs; Depreciable Life of Piece of Equipment = 7 yrs; Tool
Throughput = 33 wafers/hr = 277,200 wafers/yr; Equipment Utilization = 0.9855.
#3
Total Cost = $529,330
#4
Total COO = $0.3875/wafer. (The Cumulative Cost in the last year equals the Total COO.)
SEMI E140-0305 © SEMI 2005 13
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
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Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction
of the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E141-0705 © SEMI 2005 1
SEMI E141-0705
GUIDE FOR SPECIFICATION OF ELLIPSOMETER EQUIPMENT FOR
USE IN INTEGRATED METROLOGY
This standard was technically approved by the global Metrics Committee. This edition was approved for
publication by the global Audits and Reviews Subcommittee on May 20, 2005. It was available at
www.semi.org in June 2005 and on CD-ROM in July 2005.
1 Purpose
1.1 The application of integrated metrology is anticipated to become a key factor for advanced process control in
future integrated circuit (IC) manufacturing. Important parameters, which are typically measured for the
characterization and qualification of device manufacturing steps, are the thickness and the optical properties of
fabricated layers and the critical dimensions (CD) of submicron structures. For the measurement principle of
ellipsometry, which is commonly applied in both applications, different equipment and, hence, procedures and
notations for data acquisition and modeling exist. If, therefore, ellipsometry is to be applied for integrated metrology
equipment, the physical and the software integration into the equipment should be standardized to avoid efforts for
specific installations depending on the equipment and fabrication environment.
1.2 The description of the mechanical integration of an ellipsometer into an equipment module (e.g. a front end
module or an equipment chamber) comprises the
specification of the ellipsometer equipment and the spatial arrangement of the ellipsometer modules and
components,
specification of the relative position of the ellipsometer equipment to the equipment module, and
specification of the mechanical interfaces to the equipment module.
1.3 A prerequisite for a standardized software integration of an ellipsometer is the standardized notation of the layer
counting method, the measurement parameters, the measurement data, and the measurement results. This document
describes the position of the metrology equipment with respect to the sample. The position of the measurement
position (i.e. the position of the measurement spot) refers to the description of the wafer surface coordinate system
as described in SEMI M20.
1.4 The purpose of this standard is to provide a guide for a unique specification of the most commonly applied
ellipsometer equipment, the comprised modules and components, and their spatial arrangement. In this standard, the
notation for parameters required in data acquisition and modeling is specified, and a unique notation for remote
access on measurement parameters, data, and results is provided. Derived from these definitions, the required
parameters to identify the calibration status of an ellipsometer are specified. Additionally, recommendations for
preferred physical units are given.
1.5 The standard is intended for use in integrated metrology, but may also be applicable for stand-alone metrology.
2 Scope
2.1 This standard covers reflection ellipsometric measurements in integrated metrology.
2.2 The standard covers the typical applications of ellipsometry, which are the determination of layer thickness and
optical properties.
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
3 Limitations
3.1 The standard is limited to the measurement technique of ellipsometry although definitions may be applicable to
the measurement technique of polarimetry.