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SEMI G22-1296 © SE MI 1980, 1996 4 10 Test Methods 10.1 Mechanical, Electrical , and Th e r mal Test Methods — Per MIL-STD-883 u nless otherw ise noted. 10.1.1 Gold plating and bake test of g o l d plated package shall b…

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SEMI G22-1296 © SEMI 1980, 19963
8 Defect Limits
A magnification of 10× to 30× shall be used to inspect
the packages unless otherwise specified.
8.1 Ceramic
8.1.1 Cracks — Per MIL-STD-883, Method 2009.
8.1.2 Chips — (See Figure 1.)
8.1.2.1 Edge — 0.100" (2.54 mm) length × 0.030"
(0.762 mm) width × 0.020" (0.508 mm) (see Figure 1,
A).
8.1.2.2 Corner — 0.030" (0.762 mm) length × 0.030"
(0.762 mm) width × 0.030" (0.762 mm) (see Figure 1,
B).
8.1.2.3 Chips cannot encroach upon contact pad or
expose any buried metallization.
8.1.2.4 Seal Area — 0.060" (1.52 mm) length × 0.020"
(0.508 mm) width × 0.020" (0.508 mm) depth
maximum.
8.1.2.5 Chips cannot reduce the seal width by more
than 1/3 of the design width.
8.2 Package Flatness — 0.004 inch/inch (0.004
mm/mm) maximum.
8.2.1 Seal Area Flatness
Seal Area Size Seal Area Flatness (TIR)
0.000" – 0.500" (0 – 12.7 mm) 0.002" (0.51 mm)
Maximum
0.501" – 0.750" (12.72 – 19.05 mm) 0.003" (0.076 mm)
Maximum
0.751" & greater (19.07 mm) 0.004" (0.101 mm)
Maximum
8.2.2 Die Attach Area Flatness
Die Attach Area Flatness
Die Attach Area Flatness
(TIR)
0.000" – 0.500" (0 – 12.7 mm) 0.002" (0.051 mm)
Maximum
0.501" – 0.750" (12.72 – 19.05 mm) 0.0035" (0.088 mm)
Maximum
8.3 Metallization Voids — (Voids greater than 0.003"
(0.075 mm) should be considered.)
8.3.1 Seal Area — Maximum number of three (3)
voids per seal ring allowed. The maximum void
dimension is 0.010" (0.254 mm) and voids must be
separated by a minimum of 0.030" (0.762 mm).
8.3.2 Wire Bond Finger — Be free of voids or bare
spots in the bonding area as defined by customer
drawing.
8.3.3 Die Attach Area — Three (3) voids allowed,
maximum 0.010" (0.254 mm) diameter voids separated
by a distance greater than 0.010" (0.254 mm). Voids
within 0.015" (0.381 mm) of die attach cavity wall shall
not be considered as the basis for rejection.
8.3.4 Braze Metallization — A 0.010" (0.254 mm)
maximum diameter void is acceptable, one (1) void per
pad.
8.4 Metallization Misalignment — (See Figure 2.)
8.4.1 Metallization Rundown — Internal cavity not to
exceed 0.010" (0.254 mm) maximum.
8.4.2 Wire Bond Finger Pullback — 0.010" (0.254
mm) maximum.
8.4.3 Wire Bond Finger Rundown — Metallization
rundown not to exceed 0.010" (0.254 mm) maximum.
8.4.4 Pattern Isolation — Minimum shall not be
reduced by more than 50% of the design.
8.5 Pins
8.5.1 Pin Attachment — The pin must be within the
area of the braze pad (fillet seen on all sides). The pin
must be located within 0.010" (0.254 mm) radius of
true location with respect to all other pins.
8.5.2 Pins that are broken, missing, twisted, or bent
more than 30 °.
8.5.3 Pin burrs greater than 0.005" (0.125 mm) in any
direction.
8.6 Plating
8.6.1 Any visual evidence of plating defects such as
blistering, peeling, voids, or stains.
8.6.2 Any plating damage such as scratches or marred
areas that expose underlying base metal.
8.7 Components (General)
8.7.1 Any visual evidence of corrosion, contamination,
or chemical stains on the package component.
8.7.2 Any protrusion, conductive, or non-conductive,
that is more than 0.005" (0.125 mm) in height.
9 Sampling
Sampling size must meet the requirements of MIL-
STD-105 or MIL-PRF-38535 and MIL-STD-1835, or
as agreed to between vendor and customer. Single,
double or multiple samples may be used per vendor and
customer agreement.
SEMI G22-1296 © SEMI 1980, 1996 4
10 Test Methods
10.1 Mechanical, Electrical, and Thermal Test
Methods — Per MIL-STD-883 unless otherwise noted.
10.1.1 Gold plating and bake test of gold plated
package shall be tested by placing parts on a calibrated
heater per MIL-STD-883, Method 1008 (excluding
temperature).
10.1.1.1 Condition A — 450 ± 10°C for two minutes in
air, or
10.1.1.2 Condition B — 470 ± 10°C for one minute in
nitrogen.
10.1.1.3 After cooling at room temperature the
packages will be examined for the following criteria:
1. Blisters — None allowed at 10× magnification.
2. Any non-uniform color change of the gold at die
attach pad. Discolorations within edges up to 0.015"
(.381 mm) from the cavity wall is acceptable.
3. Any non-uniform color change of the bonding
fingers, seal ring surface, or external pins is not
acceptable.
4. There shall be no flaking or peeling of the package
plating when viewed at 10x magnification.
5. Superficial stains left during drying or prior
operations is not cause for rejection.
6. Plating adhesion tape test.
10.1.2 Lead Pull — Under the test condition of five (5)
pounds ± one-quarter (1/4) pound pull at an angle of
20° or less from the pins vertical line, measured
perpendicular to the package, there shall be no visible
separation of the braze joint under 10x magnification.
This excludes plating.
10.1.3 Lead Fatigue — Test per MIL-STD-883,
Method 2004, Test Condition B2, Section 3.1.
10.2 Functional Test Methods
10.2.1 Die Attach Quality — Destructive die shear test
post environmental testing per MIL-STD-883, Method
2019, Paragraph 3.2C.
10.2.2 Wire Bond Quality — Minimum pre-seal and
post-seal bond strength test per MIL-STD-883, Method
2011, Test Condition D. Reject for bonds which cause
plating to lift from the base metal of the bonding fingers
or fail to meet minimum strength requirement.
10.2.3 Solderability — Test per MIL-STD-883,
Method 2003 (omit aging).
10.2.4 Insulation Resistance — Test per MIL-STD-
883, Method 1003, Condition D.
10.2.5 Hermetic and Environmental Testing per MIL-
STD-883.
10.2.5.1 The hermetic integrity of the package must be
maintained after all environmental testing. Hermetic
checks shall comply with MIL-STD-883, Method 1014,
Test Conditions A, B, C, or D.
10.2.5.2 Environmental testing shall include but not be
limited to the following:
1. Temperature Cycle — MIL-STD-883, Method
1010, Condition C without heat sink; Condition B
with heat sink.
2. Thermal Shock — MIL-STD-883, Method 1011,
Condition C without heat sink; Condition B with
heat sink.
3. Centrifuge — MIL-STD-883, Method 2001,
Condition E. Y1 axis only — cavity up; Y2 axis
only — cavity down (optional).
4. Mechanical Shock — MIL-STD-883, Method 2002,
Condition B.
5. Vibration — MIL-STD-883, Method 2007,
Condition A.
NOTE 1: Package applications requiring a heat sink attach
will require the environmental test requirements (temp. cycle,
shock, etc.) to be evaluated on an individual basis. The
material, form factor, and method of attach used for heat sinks
may result in severe stresses being induced on the package
assembly during environmental testing. Actual accelerated
test requirements should be based on the expected product
application environment and may be less rigorous than those
tests for packages without heat sinks.
11 Sequence of Events and I ncoming Testing
During incoming inspection the sequence of testing
shall be:
A. Visual
B. Dimensional
C. Functional (typical functional tests which may be
applied):
Die Attach
Wire Bond
Pre-seal wire pull
Seal
Heat sink attach (if applicable)
SEMI G22-1296 © SEMI 1980, 19965
Environmental Test
Fine Leak — MIL-STD-883, Method 1014,
Condition B
Gross Leak — MIL-STD-883, Method 1014,
Condition C
Post-Seal Bond Pull
Radiography
Die Shear — MIL-STD-883, Method 2019
Solderability — MIL-STD-883, Method 2003
NOTE 2: An initial vendor qualification may be performed on
the thermal and electrical characteristics of the package. The
characteristics tested will be:
Insulation Resistance — MIL-STD-883, Method 1003,
Test Condition D.
Thermal Dissipation — MIL-STD-883, Method 1012.
12 Packaging and Marking
12.1 Packaging — Containers selected shall be strong
enough and suitably designed to provide maximum
protection against crushing, spillage, and other forms of
damage to the container or its contents to contamination
from exposure to excessive moisture or oxidation by
gases. Packaging materials shall be so selected to
prevent any contamination of the ceramic components
parts with fibers or organic particles.
12.2 Marking — The outer containers shall be clearly
marked identifying the customer part number, customer
purchase order number, drawing number (optional),
quantity, date, and vendor lot number (optional).
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
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the contents in whole or in part is forbidden without express written
consent of SEMI.