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SEMI D11-95 © SEMI 1995, 2003 1 SEMI D11-95 (Reaproved 0703) SPECIFICATION FOR FLAT PANE L DISPLAY GLASS SUBSTRATE CASSETTES This specification was technic ally approved b y the Global Flat Panel Display Committee and is…
SEMI D10-95 © SEMI 1995, 2003 5
RELATED INFORMATION 1
NOTICE: This related information is not an official part of SEMI D10 and is not intended to modify or supercede
the official standard. Publication was authorized by full letter ballot procedures. Determination of the suitability of
the material is solely the responsibility of the user.
NOTICE: This related information does not purport to address all of the safety issues associated with its use. It is
the responsibility of the user of this related information to establish appropriate safety and health practices and
determine the applicability of regulatory limitations prior to use.
R1-1.1 The following chemicals and test conditions are recommended when this test is applied to flat panel display
glass substrates:
Buffered hydrofluoric acid (1:5) 49% HF, 49% NH
4
F, at 40° C for 10 minutes.
Hydrofluoric acid nitric acid (1:5) 49% HF, 70% HNO
3
, at 40° C for 10 minutes.
Hydrochloric acid (diluted) (1:1) 36% HCl, H
2
O, at
50° C for 20 minutes.
Sodium hydroxide solution (10%) at 50° C for 20 minutes.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI D11-95 © SEMI 1995, 2003 1
SEMI D11-95 (Reaproved 0703)
SPECIFICATION FOR FLAT PANEL DISPLAY GLASS SUBSTRATE
CASSETTES
This specification was technically approved by the Global Flat Panel Display Committee and is the direct
responsibility of the Japanese FPD Materials and Components Committee. Current edition approved by the
Japanese Regional Standards Committee on April 28, 2003. Initially available at www.semi.org June 2003;
to be published July 2003. Originally published in 1995.
1 Purpose
1.1 This document describes cassettes that are used
with glass substrates in the fabrication and processing
of subassemblies and masks for flat panel displays
(FPD).
2 Scope
2.1 This document applies to cassettes that hold a
quantity of rectangular FPD substrates. Selected terms
and definitions and summary specifications are
included. The specifications for single-substrate
cassettes will be developed in other documents.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI D3 — Quality Area Specification for Flat Panel
Display Substrates
SEMI D5 — Standard Size for Flat Panel Display
Substrates
SEMI D6 — Specification for Edge Length and
Thickness for Liquid Crystal Display (LCD) Mask
Substrates
SEMI D9 —Terminology for FPD Substrates
SEMI D21 — Definitions for Flat Panel Display Masks
SEMI E1 — Specification for 3 inch, 100 mm, 125
mm, and 150 mm Plastic and Metal Wafer Carriers
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 The following descriptions assume that the cassette
orientation places the substrates in a horizontal plane.
4.2 Definitions
4.2.1 cassette bottom plate — the bottom plate of the
cassette. It is parallel to the substrate plane. It is
physically different from the cassette top plate for
purposes of machine interface and for mechanical
positioning by operators.
4.2.2 cassette front — the area between top and bottom
cassette plates through which substrates pass during
loading and unloading.
4.2.3 cassette plate opening — an opening in the
cassette top and bottom plate that provides access to the
glass substrates for external roller driver mechanisms to
move substrates into/from the cassette.
4.2.4 cassette rear — the area between top and bottom
cassette plates opposite the cassette front.
4.2.5 cassette top plate — the upper plate of the
cassette. It is parallel to the substrate plane. It is
physically different from the cassette bottom plate for
the purpose of machine interface and for mechanical
positioning by operators.
4.2.6 first mizo clearance — the distance between the
inside surface of the bottom plate and the centerline of
the nearest mizo.
4.2.7 first mizo dimension — the distance between the
outside surface of the bottom plate and the centerline of
the nearest mizo.
4.2.8 glass substrate cassette — a container for holding
glass substrates for processing, storage, and
transportation during the fabrication of FPD.
4.2.9 inner height — the shortest distance between the
inside surface of the bottom plate and the inside surface
of the top plate.
4.2.10 mizo — a term (plural form = mizo) describing a
family of rails that support the substrates. They may be
smooth-sided, toothed symmetrically, or toothed non-
symmetrically. Precise mizo contours are not described
in this document.
SEMI D11-95 © SEMI 1995, 2003 2
4.2.11 mizo base — the innermost portion of a mizo.
4.2.12 mizo centerline — 1/2 the mizo clearance.
4.2.13 mizo clearance — the minimum dimensions
between two adjacent mizo teeth, into which a substrate
can be placed.
4.2.14 mizo depth — the distance between the base of
the mizo and the top of the tooth. It is also called ‘tooth
height.’
4.2.15 mizo flat — the distance along the mizo base
between two adjacent mizo teeth.
4.2.16 mizo opening width — the distance between the
extreme ends of two adjacent mizo teeth.
4.2.17 mizo pitch — the distance between adjacent
mizo centerlines.
4.2.18 mizo plate — a plate that contains mizo for
supporting glass substrates.
4.2.19 mizo plate space — the distance between
adjacent mizo plates. It is used in the alignment of
substrates after loading.
4.2.20 mizo size — the distance between opposite mizo
bases.
4.2.21 substrate clearance — the difference between
the substrate width and the mizo size.
4.2.22 substrate load depth — the shortest distance
between the front surface of the cassette and the front
surface of the substrate stops.
4.2.23 substrate stop — a portion of the cassette,
located at the cassette rear, that provides a mechanical
stop for substrates during their insertion.
4.2.24 tooth — the protrusion, on the inner surface of
the mizo-pocket plate, that contains the mizo shape.
4.2.25 tooth height — see “mizo depth.”
5 Cassette Specification
5.1 An FPD substrate cassette contains the following
items:
5.1.1 One cassette bottom plate.
5.1.2 One cassette top plate.
5.1.3 One or more substate stops. A mizo plate may be
used as a substrate stop.
5.1.4 Three or more mizo plates.
5.2 Capacity — Two or more substrates.
5.3 Dimensions and Tolerances — To be agreed upon
between supplier and user. The following table and
figures explain application of the above definitions and
located related dimensions.
5.4 Material — To be agreed upon between supplier
and user. Construction may be of one or more molded
or machined parts.
Table 1 Cassette Designations
Symbol Description
A1 Outer height
A2 Outer width
A3 Outer length
B1 Mizo per plate
B2 Mizo pitch
B3 The distance between the first mizo centerline and
the last mizo centerline
B4 Substrate load depth
B5 The distance between the cassette rear and the
inside surface of the substrate stop
B6 The distance between the cassette front and the
front edge of the substrate
C1 Mizo opening width
C2 Mizo depth
C3 Mizo clearance
C4 Mizo size
C5 Tooth size
C6 Substrate clearance
D1 First mizo dimension
D2 First mizo clearance
D3 Thickness of the cassette bottom plate
D4 Thickness of the cassette top plate
D5 Inner height
D6 Width of mizo plate space