semi合集-English.pdf - 第2639页
SEMI E94-0705 © SEMI 2000, 2005 22 Step # Comment Dir Message CJS PJS 11 The rest of the product wafers H->E PRJ obDuplicateCreate (PRJobSpecLis t = (prj01_15, PW13), (prj01_16, PW14), …(prj01_27, PW25), RecID = P64ME…
SEMI E94-0705 © SEMI 2000, 2005 21
# Comment Dir Message CJS PJS
12 Material processing starts
after all material is in the
processing boat.
H<-E Event (PRJOBPROCESSING,
prj01_01)
ACTIVE/
PROCESSING
13 Output carriers begin to
arrive.
H<-E Event (CARRIERIDREAD,
CID=CSB01)
Until all output carriers
arrive.
Step 13 is repeated 3 more times
14 Equipment begins to load
output carriers.
H<-E Event (PROCESSINGCOMPLETE,
PRJob=prj01_01)
ACTIVE/
PROCESSING
COMPLETE
15 First output carrier is filled
with wafers.
H<-E Event (CarrierComplete=CSB04)
16 Host wants to get it. H->E Rcommand (CarrierOut=CSB04)
17 Gets rest of carriers. Steps 15 and 16 are repeated 3 more
times
18 H<-E Event (PRJOBCOMPLETE,
PRJob=prj01_01,)
No state
19 H<-E Event
(ControlJobCompleted=cjf01_01,
status=OK)
COMPLETE
R1-6 Using Cleaning Wafers
R1-6.1 For this scenario we assume a single wafer processing tool, such as an RIE. The tool has three fixed load
ports; two for product material, one for cleaning material. A cleaning wafer is run before the 1
st
and 13
th
wafer of
each carrier of product wafers. Show the load and unload of the cleaning wafers and the running of the ControlJob
for processing material. Note that control jobs do not provide functionality for dispositioning collateral material
consumed during processing (the cleaning wafers). The equipment is responsible for providing mechanisms to
determine when this collateral material has been consumed (should be replaced).
Step # Comment Dir Message CJS PJS
1 Remove the previously spent
wafers.
H<-E Event (ReadytoUnload, PortID=Cleaning,
CarrierID=CC01)
No state No state
2 After host picks up the spent
wafers, the equipment is
ready to load.
H<-E Event (ReadytoLoad, PortID=Cleaning)
3 Delivered material is
identified.
H<-E Event (CarrierIDRead, CarrierID=CC02)
4 Host directs carrier to be
moved to the wafer access
position.
H->E CMSProceedwithCarrier (CarrierID=CC02)
5 Create a job to run a
cleaning wafer.
H->E PRJobCreate (PRJobID=prj01_01, Mtrl =
ACleanWafer, RecID=CleaningProcess)
6 H<-E PRJobCreateAck (PRJobID, PRJobStatus) In POOL
7 Create the jobs for the first
12 wafers in the carrier
(PW1-12).
H->E PRJobDuplicateCreate (PRJobSpecList =
(prj01_02, PW1), (prj01_03, PW2),
…(prj01_13, PW12), RecID = P64ME5,
Start=AUTO, MtrlType=WAFER)
8 H<-E PRJobCreateAck (PRJobIDList,
PRJobStatus)
In POOL
9 Another cleaning wafer H->E PRJobCreate (PRJobID=prj01_14, Mtrl =
ACleanWafer, RecID=CleaningProcess)
10 H<-E PRJobCreateAck (PRJobID, PRJobStatus) In POOL
SEMI E94-0705 © SEMI 2000, 2005 22
Step # Comment Dir Message CJS PJS
11 The rest of the product
wafers
H->E PRJobDuplicateCreate (PRJobSpecList =
(prj01_15, PW13), (prj01_16, PW14),
…(prj01_27, PW25), RecID = P64ME5,
Start=AUTO, MtrlType=WAFER)
12 H<-E PRJobCreateAck (PRJobIDList,
PRJobStatus)
In POOL
13 Now the control job H->E CtrlJobCreate (CtrlJobID=cj01_01,
ProcessingCtrlSpecList = (prj01_01, null,
null), (prj01_02, null, null), …(prj01_27,
null, null), CarrierInputSpec = CP01, Start
= AUTO, ProcessOrderMgmt = LIST,
MtrlOutSpec = (CP01, null, CP01,null)
14 H<-E CtrlJobCreateAck (ID = cj01_01,
Status=OK )
QUEUED ->
SELECTED
15 H<-E Event (ReadytoLoad, PortID = P1)
16 H<-E Event (CarrierIDRead, CarrierID=CP01)
17 H->E CMSProceedwithCarrier (CP01)
18 H<-E Event (CtrlJobStart = cj01_01) EXECUTING
Host might not even have
these sent.
Lots of PRJob Start and End Events
19 H<-E Event (CtrlJobComplete = cj01_01) COMPLETED
20 H<-E Event (ReadytoUnload, CarrierID = CP01)
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Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
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consent of SEMI.
SEMI E94.1-1104 © SEMI 2001, 2004 1
SEMI E94.1-1104
SPECIFICATION FOR SECS-II PROTOCOL FOR CONTROL JOB
MANAGEMENT (CJM)
This specification was technically approved by the Global Silicon Wafer Committee and is the direct
responsibility of the North American Silicon Wafer Committee. Current edition approved by the North
American Regional Standards Committee on August 16, 2004. Initially available at www.semi.org
September 2004, to be published November 2004. Previously published November 2001.
1 Purpose
1.1 This document maps the services and data of SEMI
E94 to SECS-II streams and functions and data
definitions.
2 Scope
2.1 This is a specification covering equipment
supporting automated control job management.
2.2 This document applies to all implementations of
SEMI E94 that use the SECS-II message protocol
(SEMI E5). Compliance to this standard requires
compliance to both SEMI E94 and SEMI E5.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Limitations
3.1 This specification applies to semiconductor
equipment that also uses SEMI E40 Process Jobs.
4 Referenced Standards
4.1 SEMI Standards
SEMI E5 SEMI Equipment Communications
Standard 2 Message Content (SECS-II)
SEMI E30 Generic Model for Communications and
Control of Manufacturing Equipment (GEM)
SEMI E39.1 SECS-II Protocol for Object Services
Standard (OSS)
SEMI E40 Standard for Processing Management
(PJM)
SEMI E53 Event Reporting (ER)
SEMI E94 Specification for Control Job
Management (CJM)
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
5 Terminology
5.1 None.
6 Mapping
6.1 This section shows the specific SECS-II streams
and functions that shall be used for SECS-II
implementation of the services defined in SEMI E94, as
well as the parameter mapping for data attached to
services.
6.2 Message Mapping
6.2.1 Services Message Mapping
6.2.1.1 Table 1 defines the relationships between SEMI
E94 services and SECS-II messages.