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SEMI E106-1104 © SEMI 2000, 2004 4 FIMS port that complies with SEMI E62) (as defined in SEMI E47.1) . 5.2.13 horizont al datum plane — a horiz ontal plane from whic h projects the ki nematic-coupl ing pins on which the …

SEMI E106-1104 © SEMI 2000, 2004 3

SEMI E99.1 — Specification for SECS-I and SECS-II

Protocol for Carrier ID Reader/Writer Functional

Standard

SEMI E100 — Specification for a Reticle SMIF Pod

(RSP) Used to Transport and Store 6 Inch or 230 mm

Reticles

SEMI E101 — Guide for EFEM Functional Structure

Model

SEMI E103 — Provisional Mechanical Specification

for a 300 mm Single-Wafer Box System that Emulates

a FOUP

SEMI G74 — Specification for Tape Frame for 300

mm Wafers

SEMI G77 — Specification for Frame Cassette for 300

mm Wafers

SEMI M1.15 — Standard for 300 mm Polished

Monocrystalline Silicon Wafers (Notched)

SEMI M8 — Specification for Polished

Monocrystalline Silicon Test Wafers

SEMI M28 — Specifications for Developmental 300

mm Diameter Polished Single Crystal Silicon Wafers

SEMI M29 — Specification for 300 mm Shipping Box

SEMI M31 — Provisional Mechanical Specification for

Front-Opening Shipping Box Used to Transport and

Ship 300 mm Wafers

SEMI S2 — Environmental, Health, and Safety

Guideline for Semiconductor Manufacturing Equipment

SEMI S8 — Safety Guidelines for Ergonomics

Engineering of Semiconductor Manufacturing

Equipment

SEMI S11 — Environmental, Safety, and Health

Guidelines for Semiconductor Manufacturing

Equipment Minienvironments

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

5 Terminology

5.1 Abbreviations and Acronyms

5.1.1 AGV — automatic guided vehicle (as defined in

SEMI E101).

5.1.2 PGV — person guided vehicle (cart) (as defined

in SEMI E101).

5.1.3 RGV — rail guided vehicle (moving on the floor)

(as defined in SEMI E101).

5.2 Definitions

5.2.1 bilateral datum plane — a vertical plane that

bisects the wafers and that is perpendicular to both the

horizontal and facial datum planes (as defined in SEMI

E57).

5.2.2 BOLTS plane — a plane parallel to the facial

datum plane near the front of the tool where the box

opener/loader is attached (as defined in SEMI E63).

5.2.3 box — a protective portable container for a

cassette and/or substrate(s).

5.2.4 box opener/loader or BOLTS unit — the

equipment component that opens wafer carriers (if

needed) and presents the carriers to the equipment’s

wafer handler for unloading and loading wafers (as

defined in SEMI E63).

5.2.5 carrier handler — receives and passes the

carriers from and/or to the external system (such as the

factory material handling system). A carrier handler of

the internal buffer type has the functions of handling

and storing the carriers. A carrier handler for FOUPs

has the opener(s) for opening and closing FOUPs.

5.2.6 cart — a floor-based carrier transfer vehicle (as

defined in SEMI E101).

5.2.7 cassette — an open structure that holds one or

more substrates.

5.2.8 docking — the act of locating a floor-based

carrier transport vehicle for carrier transfer to/from

equipment (as defined in SEMI E101).

5.2.9 equipment front end module (EFEM) — consists

of the carrier handler that receives carriers from the

factory material handling system on one or more load

ports (as specified in SEMI E15.1), opens the carriers

(if needed), and may include a substrate handler for

unloading and loading wafers from the carrier to the

process part of the equipment (as defined in SEMI

E101).

5.2.10 facial datum plane — a vertical plane that

bisects the wafers and that is parallel to the front side of

the carrier (where wafers are removed or inserted). On

tool load ports, it is also parallel to the load face plane

specified in SEMI E15 on the side of the tool where the

carrier is loaded and unloaded (as defined in SEMI

E57).

5.2.11 fixed buffer – EFEM configuration with carrier

places only on load port units arranged in a load port

group (as defined in SEMI E101).

5.2.12 front-opening unified pod (FOUP) — a box

(that complies with SEMI E47.1) with a non-removable

cassette (so that its interior complies with SEMI E1.9)

and with a front-opening interface (that mates with a

SEMI E106-1104 © SEMI 2000, 2004 4

FIMS port that complies with SEMI E62) (as defined in

SEMI E47.1).

5.2.13 horizontal datum plane — a horizontal plane

from which projects the kinematic-coupling pins on

which the carrier sits. On tool load ports, it is at the load

height specified in SEMI E15 and might not be

physically realized as a surface (as defined in SEMI

E57).

5.2.14 internal buffer — EFEM configuration with

carrier places different from load port units (as defined

in SEMI E101).

5.2.15 minienvironment — a localized environment

created by an enclosure to isolate the product from

contamination and people.

5.2.16 OHT — overhead transport system with hoist

for lifting carriers between load port level and transport

level (as defined in SEMI E101).

5.2.17 pod — a box having a Standard Mechanical

Interface (SMIF) per SEMI E19.

5.2.18 substrate handler — transfers substrates

between carriers and the process part of the equipment

(as defined in SEMI E101).

5.2.19 wafer carrier — any cassette, box, pod, or boat

that contains wafers (as defined in SEMI E15).

6 Description of the Standards

6.1 Overview — Figure 2 shows roughly what most of

the SEMI standards for 300 mm physical interfaces and

carriers specify. However, this picture is greatly over-

simplified. For example, a front-opening shipping box

(FOSB) compliant with SEMI M31 (with its thicker

door) generally cannot be opened by equipment load

ports that are compliant with SEMI E63. Also, a wire

link to an OHT for the carrier handoff parallel I/O can

also be located at the top of the equipment.

Furthermore, the atmospheric wafer handler for

emptying the carrier will generally be different from the

wafer handler used in the vacuum environment of the

central handler module of a cluster tool.

6.2 Kinematic Coupling — The foundational document

of the SEMI standards for 300 mm physical interfaces

and carriers is SEMI E57 which specifies the

mechanical couplings used to ergonomically align and

precisely support 300 mm wafer carriers. The

kinematic coupling consists of three pins that mate with

grooves on the bottom of the wafer carrier (which are

not specified) for physical alignment and support. Most

of the dimensions in the SEMI standards for 300 mm

physical interfaces and carriers are determined with

respect to the three orthogonal datum planes defined in

SEMI E57: the horizontal datum plane, the facial datum

plane, and the bilateral datum plane. Such a kinematic

coupling can be used at several interfaces, including:

 between a FOUP or cassette and an equipment load

port or vehicle nest,

 between a transport cassette and a box, and

 between a process cassette or quartz boat and the

floor of a process chamber.

E21.1 (Cluster-Tool

Module Interface

)

E22.1 (Cluster-

Tool End Effector

)

E26.1 (Cluster-Tool Footprint)

and

E25 (

Cluster-Tool Access)

E57 (Kinematic Coupling)

E64 (Cart Docking Interface)

and

E83 (

PGV Docking Flange)

E72 (Equipment

Footprint, Height,

and Wei

)

Carriers:

E47.1 (

FOUP),

E1.9 (

Cassette),

M31 (

FOSB), or

E103 (

SWIF)

E62 (FIMS)

E15.1 (Load Port)

E84 (Carrier Handoff

Parallel I/O

)

M1.15, M8, M28 (Wafer)

E63 (BOLTS-M)

and/or

E92 (

BOLTS-Light)

E110 (Indicator/

switch Placement

)

Figure 2

Key Standards for 300 mm Equipment

SEMI E106-1104 © SEMI 2000, 2004 5

6.3 Wafer Carriers — SEMI E1.9 and SEMI E47.1

specify the carriers used to transport and store 300 mm

wafers in an IC manufacturing facility. SEMI E47.1

specifies the outside features of the front-opening

unified pod (FOUP). The inside features of the FOUP

are specified in SEMI E1.9, which also specifies the

open cassette. Both standards specify carriers that hold

either 13 or 25 wafers. SEMI M31 specifies the front-

opening shipping box (FOSB) used to transport and

ship 300 mm wafers. SEMI E103 specifies a system

that includes a box that holds only one wafer and that

fits onto an adapter mechanism called a single-wafer

interface (SWIF). This system appears to the

equipment to be a 300 mm FOUP (except that only the

volume around the middle wafer may be accessible).

6.4 Equipment Load Ports — SEMI E15.1 specifies

the carrier load ports at the front of 300 mm process or

metrology equipment (or stockers). In addition, the

substrate port that opens a FOUP door is specified in

SEMI E62 (FIMS). At the floor below each load port is

a cart docking interface exclusion volume specified in

SEMI E64; this volume can contain a PGV docking

flange as specified in SEMI E83. SEMI E63 (BOLTS-

M) or SEMI E92 (BOLTS-Light) or both standards

specify the mechanical interface between the main part

of a process or metrology tool and the box

opener/loader unit that opens FOUPs and presents them

to the tool wafer handler for unloading and loading 300

mm wafers. Also associated with each load port is a

wire or optical link (from the equipment to the AMHS

carrier delivery system) specified in SEMI E84 which

is the 300 mm version of SEMI E23. SEMI E99 and

SEMI E99.1 specify the electronics and communication

interface between a carrier ID reader/writer and the

equipment controller. SEMI E101 specifies the

functional structure model and component behavior for

the entire equipment front-end module (EFEM). SEMI

E110 specifies the placement of indicators and switch.

6.5 Cluster-Tools — SEMI standards for 300 mm

cluster tools include SEMI E22.1, SEMI E21.1, SEMI

E26.1, and SEMI E25.

6.6 AMHS — SEMI standards for automated material

handling systems (AMHS) include SEMI E85.

6.7 Equipment Volume and Weight — SEMI E72

specifies limits on the footprint, height, and weight of

equipment for 300 mm fabs. Separate limits are given

for the parts of the equipment in the main fab and in the

sub-fab. Separate limits are also given for the

equipment after it is installed and for the components of

the equipment as it is moved into the fab.

6.8 Back-End Standards — SEMI G74 specifies the

tape frames used for 300 mm wafers between the dicing

process and the die-bonding process. SEMI G77

specifies the mechanical features of a metal or plastic

frame cassette used for framed 300 mm wafers between

the wafer mounting process and the die-bonding

process. Future standards may also specify the carrier

for thinned 300 mm wafers and the load port for back-

end process or metrology equipment.

6.9 Standards of Uncertain Use — Some SEMI 300

mm standards that passed balloting have a scope of

application or extent of use that is yet to be fully

determined. Such standards include SEMI M29 which

specifies a manually-opening shipping box for 300 mm

wafers. In the other SEMI 300 mm standards are also

some options of uncertain use such as bottom-opening

pods and pods with removable cassettes.

7 Application of Standards to Products

7.1 One-Sided Interface Specifications — The SEMI

standards for 300 mm physical interfaces and carriers

are intended to set an appropriate level of specification

that places minimal limits on innovation while ensuring

modularity and inter-changeability between different

types of products. To accomplish this, only one side of

each mechanical interface (between different types of

products) is specified, leaving the supplier of the

product on the other side of the interface more freedom

to improve their product. For example, only the bottom

half of the kinematic coupling (the pin) is specified by

SEMI E57 so that suppliers can be flexible in designing

wafer carrier grooves that can mate with it. Table 1

shows which standards apply to each type of product

and shows which side of the interface is specified:

 “D” indicates if the standard directly specifies that

type of product (by specifying that product’s side

of the relevant interface).

 “I” indicates if the standard indirectly specifies that

type of product (by specifying the other side of the

relevant interface).

7.2 Carriers — A FOUP is directly specified by SEMI

E47.1 (for its outside features not including the door)

and by SEMI E1.9 (for its inside features). The FOUP

is indirectly specified by SEMI E57 (for its kinematic

coupling grooves) and by SEMI E62 (for its FIMS door

interface). Thus, if a FOUP door fails to open or close

correctly on any load port that complies with SEMI E57

and SEMI E62, that FOUP is in violation of the

standards. The wafer support function of all of the 300

mm carriers is specified directly (by specifying where

the wafers must be located rather than specifying the

shape and location of the supports), so the 300 mm

wafer standards indirectly specify the carriers.

7.3 Stockers — A carrier stocker is directly specified

by SEMI E57 (for the kinematic coupling pins on its

shelves, if any, and on its manual/AGV/RGV and