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SEMI X##-#### © SEMI 2001 1 SEMI G57-0302 GUIDE FOR STA NDARDIZA TION OF LEADFRA M E TERM INOLOGY This gu ide was technically app roved by the Glo bal Assembly and P ackaging Committee and is the d irect responsibility o…
SEMI G56-93 © SEMI 1993, 2002 3
Figure 1
Error in Silver Thickness Measurement
Figure 2
Measurement Principles
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express writte
n
consent of SEMI.
SEMI X##-#### © SEMI 2001 1
SEMI G57-0302
GUIDE FOR STANDARDIZATION OF LEADFRAME TERMINOLOGY
This guide was technically approved by the Global Assembly and Packaging Committee and is the direct
responsibility of the Japanese Assembly and Packaging Committee. Current edition approved by the
Japanese Regional Standards Committee on November 26, 2001. Initially available on www.semi.org
December 2001; to be puiblished March 2002. Originally published in 1993.
1 Preface
1.1 Purpose — This guideline defines standard
terminologies for all the features of leadframes used in
the production of semiconductor circuits.
1.2 Significance — Use of this guide in
communications between customers and vendors can
reduce the errors caused by the current use of different
nomenclatures for the same feature of a leadframe.
Table 1 Nomenclature for Figures
1 Die Pad
2 Die Pad Support
3 Lead Lock
4 Anchor Hole
5 Inner Lead
6 Outer Lead
7 Standard Pilot Hole
8 Pilot Hole
9 Top Rail Standard Pilot Hole Side
10 Bottom Rail
11 Lead Cut-off Notch
12 Dam Bar
13 Lead Shoulder
14 Mold Dam
15 Bumper Support Cut-off Notch
16 Lead Lock Groove
17 Mold Line
18 Expansion Slot
19 Down Set
20 Die Pad Dimple
21 Side Rail
22 Strip Cut-off Line
23 Coined Area
24 Degate Hole
Figure 1
Figure 2
SEMI G57-0302 © SEMI 1993, 2002 2
Figure 3
Figure 4
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express writte
n
consent of SEMI.