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SEMI G3-90 © SEMI 1 980, 199 6 7 Table 1 Sidebraz ed Laminate Packages Dime nsions and Tolerance R equirements Desr iption Package Le ngth Package Widt h (Inc . Leadframe) Packag e Thickness Min. Max. Cavity Leng th (Mea…

100%1 / 7923
SEMI G3-90 © SEMI 1980, 1996 6
Layers shall be designated by letter beginning with “A”
as that layer nearest terminal insertion plane. Layers,
regardless of function, shall be designated by
succeeding letters, (B, C, D, etc.) as being progressively
remote from the terminal insertion plane.
Should any lead be common to the die attach surface,
that lead number will serve both as lead one
identificationand as an indicator as to the lead that is
common to the die attach surface (Figure 7).
14
Figure 7
Lead Identification
11.3 Sidebraze Ceramic Package Layer Design
(See Figure 8).
Figure 8
Layer Designation
SEMI G3-90 © SEMI 1980, 19967
Table 1 Sidebrazed Laminate Packages Dimensions and Tolerance Requirements
Desription Package Length
Package Width
(Inc. Leadframe)
Package Thickness
Min. Max.
Cavity Length
(Measured at Cavity
Bottom)
Cavity Width
(Measured at Cavity
Bottom) Units
8MSI 0.520 ± 0.008 0.310 + 0.010 - 0.015 0.076 – 0.094 0.180 ± 0.005 0.150 ± 0.005 in
13.21 ± 0.203 7.87 + 0.254 - 0.381 1.93 – 2.39 4.57 ± 0.127 3.81 ± 0.127 mm
8LSI 0.520 ± 0.008 0.310 + 0.010 – 0.015 0.076 - 0.094 0.220 ± 0.005 0.175 ± 0.005 in
13.21 ± 0.203 7.87 + 0.254 - 0.381 1.93 - 2.39 5.59 ± 0.127 4.45 ± 0.127 mm
8VLSI 0.520 ± 0.008 0.310 + 0.010 – 0.015 0.076 - 0.094 0.260 ± 0.005 0.175 ± 0.005 in
13.21 ± 0.203 7.87 + 0.254 - 0.381 1.93 - 2.39 6.60 ± 0.127 4.45 ± 0.127 mm
14MSI 0.750 ± 0.010 0.310 + 0.010 – 0.015 0.076 – 0.094 0.180 ± 0.005 0.150 ± 0.005 in
19.05 ± 0.254 7.87 + 0.254 - 0.381 1.93 – 2.39 4.57 ± 0.127 3.81 ± 0.127 mm
14LSI 0.750 ± 0.010 0.310 + 0.010 – 0.015 0.076 - 0.094 0.220 ± 0.006 0.175 ± 0.005 in
19.05 ± 0.254 7.87 + 0.254 - 0.381 1.93 - 2.39 5.59 ± 0.152 4.45 ± 0.127 mm
14VLSI 0.750 ± .010 0.310 + 0.010 – 0.015 0.076 – 0.094 0.260 ± 0.006 0.175 ± 0.005 in
19.05 ± 0.254 7.87 + 0.254 - 0.381 1.93 – 2.39 6.60 ± 0.152 4.45 ± 0.127 mm
16MSI 0.800 ± 0.010 0.310 + 0.010 – 0.015 0.076 - 0.094 0.220 ± 0.006 0.175 ± 0.005 in
20.32 ± 0.254 7.87 + 0.254 - 0.381 1.93 - 2.39 5.59 ± 0.152 4.45 ± 0.127 mm
16LSI 0.800 ± 0.010 0.310 + 0.010 – 0.015 0.076 – 0.094 0.240 ± 0.006 0.175 ± 0.005 in
20.32 ± 0.254 7.87 + 0.254 - 0.381 1.93 – 2.39 6.10 ± 0.152 4.45 ± 0.127 mm
16VLSI 0.800 ± 0.010 0.310 + 0.010 – 0.015 0.076 - 0.094 0.320 ± 0.007 0.175 ± 0.005 in
20.32 ± 0.254 7.87 + 0.254 - 0.381 1.93 - 2.39 8.13 ± 0.178 4.45 ± 0.127 mm
18MSI 0.900 ± 0.010 0.310 + 0.010 – 0.015 0.076 – 0.094 0.220 ± 0.006 0.175 ± 0.005 in
22.86 ± 0.254 7.87 + 0.254 - 0.381 1.93 – 2.39 5.59 ± 0.152 4.45 ± 0.127 mm
18LSI 0.900 ± 0.010 0.310 + 0.010 – 0.015 0.076 - 0.094 0.265 ± 0.006 0.175 ± 0.005 in
22.86 ± 0.254 7.87 + 0.254 - 0.381 1.93 - 2.39 6.73 ± 0.152 4.45 ± 0.127 mm
18VLSI 0.900 ± 0.010 0.310 + 0.010 – 0.015 0.076 – 0.094 0.320 ± 0.007 0.175 ± 0.005 in
22.86 ± 0.254 7.87 + 0.254 - 0.381 1.93 – 2.39 8.13 ± 0.178 4.45 ± 0.127 mm
20MSI 1.000 ± 0.010 0.310 + 0.010 – 0.015 0.076 - 0.094 0.215 ± 0.005 0.175 ± 0.005 in
24.89 ± 0.254 7.87 + 0.254 - 0.381 1.93 - 2.39 5.46 ± 0.127 4.45 ± 0.127 mm
20LSI 1.000 ± 0.010 0.310 + 0.010 – 0.015 0.076 – 0.094 0.265 ± 0.006 0.175 ± 0.005 in
24.89 ± 0.254 7.87 + 0.254 - 0.381 1.93 – 2.39 6.73 ± 0.152 4.45 ± 0.127 mm
20VLSI 1.000 ± 0.010 0.310 + 0.010 – 0.015 0.076 - 0.094 0.320 ± 0.007 0.175 ± 0.005 in
24.89 ± 0.254 7.87 + 0.254 - 0.381 1.93 - 2.39 8.13 ± 0.178 4.45 ± 0.127 mm
22MSI 1.08 ± 0.011 0.410 + 0.010 – 0.015 0.076 – 0.094 0.250 ± 0.006 0.220 ± 0.006 in
27.34 ± 0.279 10.41 + 0.254 - 0.381 1.93 – 2.39 6.35 ± 0.152 5.59 ± 0.152 mm
22LSI 1.08 ± 0.011 0.410 + 0.010 – 0.015 0.076 - 0.094 0.285 ± 0.006 2.20 ± 0.006 in
27.34 ± 0.279 10.41 + 0.254 - 0.381 1.93 - 2.39 7.24 ± 0.152 5.59 ± 0.152 mm
22VLSI 1.08 ± 0.011 0.410 + 0.010 – 0.015 0.076 – 0.094 0.280 ± 0.006 0.260 ± 0.006 in
27.34 ± 0.279 10.41 + 0.254 - 0.381 1.93 - 2.39 7.11 ± 0.152 6.60 ± 0.152 mm
24MSI 1.20 ± 0.012 0.610 + 0.010 – 0.015 0.076 - 0.094 0.250 ± 0.006 0.250 ± 0.006 in
30.48 ± 0.305 15.49 + 0.254 - 0.381 1.93 - 2.39 6.35 ± 0.152 6.35 ± 0.152 mm
24LSI 1.20 ± 0.012 0.610 + 0.010 – 0.015 0.076 – 0.094 0.305 ± 0.010 0.305 ± 0.010 in
30.48 ± 0.305 15.49 + 0.254 - 0.381 1.93 – 2.39 7.75 ± 0.254 7.75 ± 0.254 mm
24VLSI 1.20 ± 0.012 0.610 + 0.010 – 0.015 0.076 - 0.094 0.340 ± 0.008 0.340 ± 0.008 in
30.48 ± 0.305 15.49 + 0.254 - 0.381 1.93 - 2.39 8.64 ± 0.203 8.64 ± 0.203 mm
28MSI 1.40 ± 0.014 0.610 + 0.010 – 0.015 0.076 – 0.094 0.250 ± 0.006 0.250 ± 0.006 in
35.56 ± 0.356 15.49 + 0.254 - 0.381 1.93 – 2.39 6.35 ± 0.152 6.35 ± 0.152 mm
28LSI 1.40 ± 0.014 0.610 + 0.010 – 0.015 0.076 - 0.094 0.305 ± 0.010 0.305 ± 0.010 in
SEMI G3-90 © SEMI 1980, 1996 8
35.56 ± 0.356 15.49 + 0.254 - 0.381 1.93 - 2.39 7.75 ± 0.254 7.75 ± 0.254 mm
28VLSI 1.40 ± 0.014 0.610 + 0.010 – 0.015 0.076 – 0.094 0.340 ± 0.008 0.340 ± 0.008 in
35.56 ± 0.356 15.49 + 0.254 - 0.381 1.93 – 2.39 8.64 ± 0.203 8.64 ± 0.203 mm
40MSI 2.00 ± 0.020 0.610 + 0.010 – 0.015 0.076 - 0.094 0.250 ± 0.006 0.250 ± 0.006 in
50.8 ± 0.508 15.49 + 0.254 - 0.381 1.93 - 2.39 6.35 ± 0.152 6.35 ± 0.152 mm
40LSI 2.00 ± 0.020 0.610 + 0.010 – 0.015 0.076 – 0.094 0.305 ± 0.010 0.305 ± 0.010 in
50.8 ± 0.508 15.49 + 0.254 - 0.381 1.93 – 2.39 7.75 ± 0.254 7.75 ± 0.254 mm
40VLSI 2.00 ± 0.020 0.610 + 0.010 – 0.015 0.076 - 0.094 0.340 ± 0.008 0.340 ± 0.008 in
50.8 ± 0.508 15.49 + 0.254 - 0.381 1.93 - 2.39 8.64 ± 0.203 8.64 ± 0.203 mm
48LSI 2.40 ± 0.025 0.610 + 0.010 – 0.015 0.076 – 0.094 0.305 ± 0.010 0.305 ± 0.010 in
60.96 ± 0.635 15.49 + 0.254 – 0.381 1.93 – 2.39 7.75 ± 0.254 7.75 ± 0.254 mm
48VLSI 2.40 ± 0.025 0.610 + 0.010 - 0.015 0.076 - 0.094 0.340 ± 0.008 0.340 ± 0.008 in
60.96 ± 0.635 15.49 + 0.254 – 0.381 1.93 - 2.39 8.64 ± 0.203 8.64 ± 0.203 mm
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