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SEMI E21-94 © SEMI 1991, 2002 1 SEMI E21-94 (Reapproved 1102) CLUSTER TOOL MODULE INTERF ACE: MECHANICAL INTERFACE AND WAFER TRANSPORT STANDARD This standard was technically rea pproved by the Global Physical Interfaces …

SEMI E20-0697 © SEMI 1991, 2002 5

Figure R1-2

Example: EMO Connect/Disconnect Circuit(Module Power is “off,” as drawn.)

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SEMI E21-94 © SEMI 1991, 2002 1

SEMI E21-94 (Reapproved 1102)

CLUSTER TOOL MODULE INTERFACE: MECHANICAL INTERFACE

AND WAFER TRANSPORT STANDARD

This standard was technically reapproved by the Global Physical Interfaces & Carriers Committee and is the

direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition

reapproved by the North American Regional Standards Committee on July 21, 2002. Initially available at

www.semi.org October 2002; to be published November 2002. Originally published in 1991; previously

published in June 1999.

1 Purpose

1.1 The purpose of the standard is to simplify cluster

tool implementation in the fab. Equipment suppliers are

required to provide modules that can be connected into

any cluster tool using the specifications contained

herein.

1.1.1 Process and cassette modules accept wafers at

locations that may vary substantially from one module

to another. This places a burden on the capabilities of

transport modules to move wafers to and from various

modules in a cluster tool. This specification defines

wafer transport planes within cassette and process

modules. This obviates the wafer transport problem to a

large extent, but does not unduly restrict module

content.

2 Scope

2.1 The standard defines the interface plane between

modules in a cluster tool. It provides the mechanical

specifications at the interface that allow modules from

different suppliers to be connected together; no

requirements are imposed on the module content.

2.1.1 The standard is limited to wafers which are 200

mm (~ 8 in.) in diameter or smaller and to the interface

between cluster tool modules, with the following

exception. The transport module operates across the

interface plane; thus, a definition of the wafer transport

plane within cassette and process modules is required.

2.2 This standard does not purport to address safety

issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety health practices and determine the

applicability or regulatory limitations prior to use.

3 Impact

3.1 The adoption of the standard requires cluster tool

equipment designers to limit the wafer transport height

to a nominal value at the interface plane between two

modules. It also requires equipment designers to assure

that wafer transport planes within cassette and process

modules be clear for wafer transport. The transport

module requires the capability for a minimum reach

outside the module across the interface plane. Modules

may be connected using a quick connect/disconnect

clamping system. Constraints are placed on sealing

surfaces.

4 Referenced Standards

ISO 1609-1986 (E)

— “Vacuum Technology — Flange

Dimensions,” International Organization for

Standardization (ISO).

5 Terminology

5.1 Definitions

5.1.1 cassette module — a two-port module. One port

accepts or presents a cassette of wafers or possibly, in

an automated factory, an individual wafer for intertool

transport; the second port accepts or presents a single

wafer within the module for intratool transport.

5.1.2 cluster tool — an integrated, environmentally

isolated manufacturing system consisting of process,

transport, and cassette modules mechanically linked

together. The modules may or may not come from the

same supplier.

5.1.3 environmental isolation — separated from the

ambient atmospheric environment.

5.1.4 interface plane — the vertical surface defined by

the mating surfaces of two joined modules.

5.1.5 interface seal zone — an absolute surface or face

reserved for establishing an environmental seal between

modules.

5.1.6 intertool transport — wafer or cassette

movement between independent tools.

5.1.7 intratool transport — wafer movement inside a

cluster tool.

5.1.8 module — an independently-operable unit that is

part of a tool or system.

1 International Organization for Standardization, ISO Central

Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,

Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30

Website: www.iso.ch

SEMI E21-94 © SEMI 1991, 2002 2

5.1.9 process module — a module that accepts or

presents a single wafer inside the module for intratool

transport.

5.1.10 reach — the distance measured from the

interface plane to the wafer centroid within a process or

cassette module.

5.1.11 transport module — a module that accepts or

presents a single wafer outside the module across the

interface plane for intratool transport.

5.1.12 wafer transport plane — the horizontal surface

a wafer traverses between modules.

5.1.13 wafer transport zone — the area of the interface

plane free of physical obstructions, reserved for wafer

movement between modules.

6 Requirements

6.1 Wafer Transport and Placement

6.1.1 Horizontal Transport Plane — The dimensions

for wafer placement during wafer transport are

referenced from the interface plane in the plan view

shown in Figure 1. The transport module is required to

present or accept a horizontal wafer outside the module

anywhere along an axis perpendicular to the center of

the interface plane to a maximum 305 mm (12 in.) from

the interface plane. Thus, a transport module is required

to have the capability to reach 305 mm (12 in.) beyond

its interface plane to a wafer centroid (see Section R1-

1). However, location of the wafer at a distance less

than 305 mm (12 in.) from the interface plane requires

that the transport module be capable of addressing the

intermediate location. Similarly, a cassette module or

process module accepts a horizontal wafer inside the

module anywhere along an axis perpendicular to the

center of its interface plane up to a maximum 305 mm

(12 in.) from the interface plane as required by the

application.

6.1.1.1 Placement Accuracy — The requirements for

placement accuracy of a wafer in the horizontal plane

within a module are 1.0 mm (0.04 in.) true position, ±

0.5 mm (± 0.020 in.) radially, with less than one degree

angular rotation for every module-to-transport-to-

module wafer transport (B

:A:B

+ 1as shown in Figure

1). If the wafer is displaced in the process module, it

must be returned to the original position within the non-

culmulative placement accuracy of 1.0 mm (0.04 in.)

true position, ± 0.5 mm (± 0.020 in.) radially.

6.1.2 Vertical Position of Transport Plane — The

elevation of the wafer transport plane is measured from

the facility floor as shown in Figure 2. The transport

module is required to present or accept a horizontal

wafer outside the module at a nominal wafer transport

height of 1100 mm (43.307 in.) from the facility floor

(see Section R1-2).

6.1.2.1 Vertical Motion — The transport module is

required to move the wafer to within ± 0.5 mm (0.020

in.) in the wafer transport plane. The transport module

is also required to posess a vertical motion capability to

a second plane 6.0 mm ± 0.5 mm (0.236 in. ± 0.020 in.)

below the wafer transport plane in order to allow wafer

handoff to or from passive cassette or process modules

(see Figure 2 and Section R1-3).

6.1.2.2 Reference Plane — The interface plane

alignment pins define a reference plane 9.5 mm (0.374

in.) below the wafer transport plane (see Figure 2).

6.2 Interface Plane — The interface plane contains the

interface seal zone and the wafer transport zone, which

do not overlap, and the location of the interface plane

alignment pins (see Figures 3 and 4).

6.2.1 Interface Seal Zone — The interface seal zone is

rectangular and symmetrically referenced to the

interface plane alignment pins. The inside boundary

dimension of the interface seal zone is 46 mm (1.811

in.) by 236 mm (9.291 in.). The outside boundary is 76

mm (2.992 in.) by 266 mm (10.472 in.). A seal zone is

either a seal surface or an O-ring face. All interface seal

zones facing toward a transport module are seal

surfaces polished to a surface finish less than or equal to

0.8 micrometer (32 microinches) parallel to the

circumference (see Section R1-4). All interface seal

zones facing toward a cassette or process module are O-

ring faces equipped with the appropriate capture groove

for the sealing method employed (see Figure 3 and

Section R1-4.1).

6.2.2 Wafer Transport Zone — The wafer transport

zone is the area within the interface seal zone reserved

for moving the wafer between modules. The wafer

transport zone which cannot be compromised by any

module is defined as the area at least 16 mm (0.630 in.)

above and below the alignment pin centerlines, and 111

mm (4.370 in.) to the left and right of the centerline

between the two alignment pins (see Figure 3 and

Section R1-5).

6.2.3 Interface Plane Alignment Pins — Provisions are

made for two 10 mm (0.394 in.) diameter locating pins

(see Figure 4) to be used as alignment aids between

modules. Under no circumstances should the flanges at

the interface plane and the alignment pins be subject to

a total load exceeding 500N (112 lbf) in shear. The

alignment pins have an absolute centerline separation of

300.0 mm (11.811 in.) in the horizontal plane. The pins

reside in the seal surface side of the flange pair,

opposite the O-ring, facing toward the transport

module. Mild press fit holes are provided in the seal

surface flange face. A clearance hole and a slot are