semi合集-English.pdf - 第6208页
SEMI G42-0996 © SEMI 1986, 2004 11 Figure 8 Thermal Test Board — Ball Grid Array Package Unit: mm 1. Material: Epoxy Glass 1.5 mm thickn ess, FR-4 (Green). 2. Gold Plated Fingers: 0.8 µm M in. 18 pad on Each side 3. Fabr…
SEMI G42-0996 © SEMI 1986, 2004 10
Figure 7
Thermal Test Board — Pin Grid Array Package
Unit: mm
1. Material: Epoxy Glass 1.5 mm thickness, FR-4 (Green).
2. Gold Plated Fingers: 0.8 µm Min, 18 pad on Each side
3. Fabricate: IPC-D-320 Glass III
4. Tolerance: + 0.1 mm (Unless noted)
SEMI G42-0996 © SEMI 1986, 2004 11
Figure 8
Thermal Test Board — Ball Grid Array Package
Unit: mm
1. Material: Epoxy Glass 1.5 mm thickness, FR-4 (Green).
2. Gold Plated Fingers: 0.8 µm Min. 18 pad on Each side
3. Fabricate: IPC-D-320 Class III
4. Tolerance: ± 0.1 mm (Unless noted)
SEMI G42-0996 © SEMI 1986, 2004 12
Figure 9
Multi-Layer Board Construction
Figure 10
Inner Layer Pattern and Clearance for Multi-Layer Thermal Test Board
1. Material: Epoxy Glass 1.0 mm Isolation thickness, FR-4 (Green)
2. Inner Copper Clad thickness: 0.035 µm
3. Tolerance: ± 0.1 mm (Unless noted)
Table 3 Clearance Diameter
Pitch (mm) Hole Diameter Ø 2 (mm) Clearance Diameter Ø 3 (mm)
1.5 0.4 1.2
1.27 0.35 1.1
BGA
1.0 0.3 0.9
PGA
2.54 0.95 1.7