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SEMI M18-0704 © SEMI 1990, 2004 24 Epitaxial Wafer ITEM VALUE STANDARD REFERENCE A STANDARD TEST METHODS IS IN M2 IS IN M11 IS REQ’D B SEMI M2 SEMI M11 JEIDA ASTM SEMI JIS JEIDA DIN 11. GENERAL EPITAXIAL LAYER CHARACTERI…

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SEMI M18-0704 © SEMI 1990, 2004 23
ITEM VALUE STANDARD
REFERENCE
A
STANDARD TEST METHODS
IS IN
SEMI
IS
REQ'D
B
SEMI JEIDA ASTM SEMI JIS JEIDA DIN
Chromium NO NO M33 MF1526
Iron NO NO M33 MF1526
Nickel NO NO M33 MF1526
Copper NO NO M33 MF1526
Zinc NO NO M33 MF1526
7.2 Surface Organics MF1982
8. FRONT SURFACE VISUAL INSPECTION CHARACTERISTICS
D
8.1 Scratches YES NO M1 Table 1 26 MF523 H 614
8.2 Pits YES NO M1 Table 1 26 MF523 H 614 24
8.3 Haze YES NO M1 Table 1 26 MF523 H 614 24
8.4 Light Scattering Defects(Particulate
Contamination)
YES NO M1 Table 1 26 MF1620
MF523
H 614 24
8.5 Contamination/Area YES NO M1 Table 1 26 MF523 H 614 24
8.6 Edge Chips YES NO M1 Table 1 26 MF523 H 614 24
8.7 Edge Cracks YES NO M1 Table 1 26 MF523 H 614 24
8.8 Cracks, Crow's Feet YES NO M1 Table 1 26 MF523 H 614 24
8.9 Craters YES NO M1 Table 1 26 MF523 H 614 24
8.10 Dimples YES NO M1 Table 1 26 MF523 H 614 24
8.11 Grooves YES NO M1 Table 1 26 MF523 H 614 24
8.12 Mounds YES NO M1 Table 1 26 MF523 H 614 24
8.13 Orange Peel YES NO M1 Table 1 26 MF523 H 614 24
8.14 Saw Marks YES NO M1 Table 1 26 MF523 H 614 24
8.15 Dopant Striation Rings NO NO 26 MF523 H 614 24
8.16 Stains NO NO 26 MF523 H 614 24
9. BACK SURFACE VISUAL INSPECTION CHARACTERISTICS
9.1 Edge Chips YES NO M1 Table 1 MF523
9.2 Cracks, Crow's Feet YES NO M1 Table 1 MF523
9.3 Contamination/Area YES NO M1 Table 1 MF523
9.4 Saw Marks YES NO M1 Table 1 MF523
9.5 Stains NO NO
9.6 Roughness NO NO
9.7 Brightness NO NO
10. OTHER CHARACTERISTICS
10.1 Bulk defects by X-ray topography 50443/1
SEMI M18-0704 © SEMI 1990, 2004 24
Epitaxial Wafer
ITEM VALUE STANDARD REFERENCE
A
STANDARD TEST METHODS
IS IN
M2
IS IN
M11
IS
REQ’D
B
SEMI M2SEMI M11 JEIDA ASTM SEMI JIS JEIDA DIN
11. GENERAL EPITAXIAL LAYER CHARACTERISTICS
11.1 Conductivity Type/Structure NO NO YES Sec 3 Sec 3
11.2 Dopant NO NO YES Sec 3 Sec 3
11.3 Silicon Source Gas NO NO NO Sec 3 Sec 3
11.4 Growth Method NO NO NO Sec 3 Sec 3
11.5 Net Carrier Density
(Resistivity)
NO NO YES Sec 3 Sec 3 F 419 MF1392,
MF1393
(MF374,
MF398,
MF525,
MF723)
50439
(50444,
50447)
11.6 Net Carrier Density Variation
(Resistivity Variation)
YES NO YES Sec 3, 5 Sec 3, 5 50439
11.7 Thickness NO NO YES Sec 3 Sec 3 MF95,
MF110,
MF672
50436,
50437
11.8 Thickness Variation YES NO YES Sec 3, 5 Sec 3, 5
11.9 Transition Width NO NO NO
11.10 Flat Zone NO NO NO
11.11 Phantom Layer NO NO NO
12. MECHANICAL CHARACTERISTICS
D
12.1 Bow NO NO NO M1 Sec
9
M1 Sec 9 MF534 H 611
12.2 Warp NO NO NO M1 Sec
9
M1 Sec 9 MF657,
MF1390
12.3 Sori NO NO NO M1 Sec
9
M1 Sec 9
12.4 Flatness/Global NO NO NO M1 Sec
9
M1 Sec 9 DEF
43
MF1530 50441/3
12.5 Flatness/Site NO NO NO M1 Sec
9
M1 Sec 9 MF1530
12.6 Fixed Quality Area NO NO NO M1 Sec
9
M1 Sec 9 MF1530
13. EPITAXIAL LAYER VISUAL INSPECTION CHARACTERISTICS
D
13.1 Stacking Faults YES YES NO Table 1 Table 1 F 522 50446
13.2 Slip YES YES NO Table 1 Table 1 F 47,
F 80
MF523 50446
13.3 Large Point Defects YES YES NO Table 1 Table 1 F 815 MF523 50446
13.4 Total Point Defects YES YES NO Table 1 Table 1 F 815 MF523 50446
13.5 Scratches YES YES NO Table 1 Table 1 MF523
13.6 Dimples YES YES NO Table 1 Table 1 MF523
13.7 Orange Peel YES YES NO Table 1 Table 1 MF523
13.8 Cracks/Fractures YES YES NO Table 1 Table 1 MF523
13.9 Crow's Feet YES YES NO Table 1 Table 1 MF523
13.10 Edge Chips YES YES NO Table 1 Table 1 MF523
13.11 Edge Crown YES YES NO Table 1 Table 1 50446
13.12 Haze YES YES NO Table 1 Table 1 MF523 50446
SEMI M18-0704 © SEMI 1990, 2004 25
ITEM VALUE STANDARD REFERENCE
A
STANDARD TEST METHODS
IS IN
M2
IS IN
M11
IS
REQ’D
B
SEMI M2SEMI M11 JEIDA ASTM SEMI JIS JEIDA DIN
13.13 Foreign Matter YES YES NO Table 1 Table 1 MF523
14. BACK SURFACE VISUAL INSPECTION CHARACTERISTICS
14.1 Contamination YES YES NO Table 1 Table 1 MF523
15. OTHER CHARACTERISTICS
Annealed Wafer
ITEM VALUE STANDARD
REFERENCE
A
STANDARD TEST METHODS
IS IN
SEMI
IS
REQ'D
B
SEMI JEIDA ASTM SEMI
J
IS JEIDA DIN
20. GENERAL ANNEALED WAFER CHARACTERISTICS
20.1 Annealing Atmosphere NO YES
20.2 Co-Dopant in Crystal NO YES
21. MECHANICAL CHARACTERISTICS
D
21.1 Bow YES NO M1 Sec 9 MF534 H 611
21.2 Warp YES NO M1 Sec 9 MF657,
MF1390
21.3 Sori NO NO M1 Sec 9 MF1451 43
21.4 Flatness/Global NO NO M1 Sec 9 MF1530 50441/3
21.5 Flatness/Site NO NO M1 Sec 9 MF1530
21.6 Fixed Quality Area NO NO M1 Sec 9 MF1530
22. FRONT SURFACE VISUAL INSPECTION CHARACTERISTICS
D
22.1 Stacking Faults YES NO M2 Table 1 MF1810 50446
22.2 Slip YES NO M2 Table 1 MF523,
MF1726
50446
22.3 Other Defect YES NO M2 Table 1 MF523,
MF1726
50446
23. BACK SURFACE VISUAL INSPECTION CHARACTERISTICS
23.1 Contamination YES NO M1 Table 1 MF523
23.2 Other
24. OTHER CHARACTERISTICS
24.1 Depth of BMD Denuded Zone NO NO
24.2 BMD Density NO NO MF1239
24.3 Other