semi合集-English.pdf - 第3287页

SEMI E130-1104 © SEMI 2003, 2004 1 SEMI E130-1104 SPECIFICATION FO R PROBER SP ECIFIC EQUIPMENT MODEL FOR 300 mm ENVIRONMENT (PSEM300) This specification was technically approved by the Globa l Information & Control …

SEMI E128-0304 © SEMI 2003, 2004 20

R2-3.2 The JMS header properties illustrated below show how the XML messaging elements are mapped to JMS.

Figure R2-4 shows the headers for the request and the reply message as they map to the JMS header properties.

============================================

Sending JMS Message:

JMS Header Property: To=myServer

JMS Header Property: Action=getCounter

JMS Header Property: From=myClient

JMS Header Property: RequestId=1

JMS Header Property: MessageType=REQUEST

JMS Message Body: <Body />

COMMAND:

============================================

Receiving JMS Message:

JMS Header Property: To=myClient

JMS Header Property: CorrelationId=1

JMS Header Property: Action=getCounter

JMS Header Property: From=myServer

JMS Header Property: MessageType=REPLY

JMS Message Body: <Body>

</Body>

===============================================

Message received:

<To>myClient</To>

<Action>getCounter</Action>

<From>myServer</From>

<MessageType>REPLY</MessageType>

</MessageHeader>

</Header>

<Body>

</Body>

</Envelope>

Figure R2-4

Example JMS Message

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant

literature, respecting any materials or equipment mentioned herein. These standards are subject to change without

notice.

By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI E130-1104 © SEMI 2003, 2004 1

SEMI E130-1104

SPECIFICATION FOR PROBER SPECIFIC EQUIPMENT MODEL FOR

300 mm ENVIRONMENT (PSEM300)

This specification was technically approved by the Global Information & Control Committee and is the direct

responsibility of the North American Information & Control Committee. Current edition approved by the

North American Regional Standards Committee on September 3, 2003. Initially available at www.semi.org

October 2003; to be published November 2003.

NOTICE: The designation of SEMI E130 was updated during the 1104 publishing cycle to reflect the

creation of SEMI E130.1.

1 Purpose

1.1 This document establishes a Prober Specific

Equipment Model for prober equipment deployed in a

factory adhering to the Global Joint Guidance for 300

mm standards (PSEM300). The PSEM300 consists of

equipment characteristics and behaviors that apply to

this class of equipment and are required to be

implemented. The intent of this document is to

facilitate the integration of prober equipment into an

automated semiconductor factory. This document

accomplishes this by defining an operational model for

prober equipment as viewed by a host. This definition

provides a standard host interface and equipment

operational behavior.

2 Scope

2.1 The PSEM300 extends the generic Process State

Model of SEMI E30 (GEM) with a Specific Process

State model for prober equipment. This standard

attempts to be protocol independent. There is no

attempt to replace the protocol dependent aspects of

SEMI E30 (GEM). Instead, this document assumes that

certain equipment features not covered within the

concepts and behaviors of the related 300 mm standards

will be supported using the concepts and behaviors

defined within SEMI E30. See Section 9 for a

description of the SEMI E30 provisions.

2.2 This document does not attempt to define the full

set of equipment capabilities. It is understood that

additional value-added features will be provided in

addition to the requirements set forth in this document.

2.3 This document intends host-instructed indexing of

sites within a substrate and the loading/unloading of the

substrates. Automated self-indexing with such

communications as GPIB or RS-232C between tester

and prober equipment is outside the scope of this

specification but is not precluded. See the Related

Information section for reference.

2.4 This document does not describe much about

recovery of exception or manual operation to recover

from alarm / potential-alarm (warning) situations. Such

conditions are usually configuration specific.

2.5 This standard presents a solution from the concepts

and behavior down to the messaging services. It does

not define the messaging protocol.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Limitations

3.1 This document does not define the format of each

data item specified in the equipment recipe.

3.2 This document does not define a communications

protocol. In order to implement this specification, it

requires a standard communications protocol and data

format specification.

4 Referenced Standards

4.1 SEMI Standards

SEMI E5 — SEMI Equipment Communication

Standard II Message Content (SECS II)

SEMI E30 — Generic Model for Communications and

Control of Manufacturing Equipment (GEM)

SEMI E40 — Standard for Processing Management

SEMI E42 — Recipe Management Standard: Concepts,

Behavior, and Message Services

SEMI E87 — Specification for Carrier Management

(CMS)

SEMI E90 — Specification for Substrate Tracking

SEMI E94 — Provisional Specification for Control Job

Management

SEMI G81 ― Specification for Map Data Items

SEMI G85 ― Specification for Map Data Format

SEMI M20 ― Specification for Establishing a Wafer

Coordinate System

SEMI E130-1104 © SEMI 2003, 2004 2

SEMI M21 ― Specification for Assigning Addresses to

Rectangular Elements in a Cartesian Array

4.2 IEEE Standards

IEEE 754-1985 – IEEE Standard for Binary Floating-

Point Arithmetic

4.3 Other Documents

Harel, D., “Statechart: A Visual Formalism for

Complex Systems”, Science of Computer Programming

8 (1987) 231-274.

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

5 Terminology

5.1 Definitions

5.1.1 alignment — a procedure in which a coordinate

system is established on a substrate.

5.1.2 cassette — a physical object containing one or

more substrate locations. See SEMI E87.

5.1.3 chuck — the primary stage for processing a

substrate.

5.1.4 column — synonymous with the term “X-

coordinate”. Columns increase along the X axis.

5.1.5 die — 1. A field sub-unit. 2. An area of substrate

that contains the device being manufactured.

5.1.6 fiducial – flat or notch in the physical substrate

used to identify the substrate orientation.

5.1.7 inker — a resource of the prober. The

electromechanical units to put ink mark on die.

5.1.8 load — 1. Move a substrate onto a substrate

location. 2. Move a carrier onto the equipment.

5.1.9 marking — the process of the prober that

deposits an ink mark on a die using the inker.

5.1.10 pre-align – set up a substrate to be processed on

the chuck. The equipment may have a separate stage

for performing the pre-align function.

5.1.11 probe card — the electromechanical interface

necessary to enable temporary electrical contact

between the substrate to be tested and the tester

resource. May consist of multiple components.

5.1.12 pipeline – an equipment configuration

consisting of multiple stages through which the

equipment sequences material in succession.

1 Institute of Electrical and Electronics Engineers, IEEE Operations

Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, New Jersey

08855-1331, USA. Telephone: 732.981.0060; Fax: 732.981.1721,

Website: www.ieee.org

5.1.13 row — synonymous with the term “Y-

coordinate”. Rows increase along the Y axis.

5.1.14 stage – a general term for a substrate location

that serves a specific function such as pre-align or

chuck.

5.1.15 state — 1. A static set of conditions. If the

conditions are met, the state is current (SEMI E30). 2.

A state reacts predictably to specific stimuli.

5.1.16 substrate — 1. The basic unit of material,

processed by PSEM300 equipment such as wafers.

5.1.17 unload — 1. Remove a substrate from a

substrate location. 2. Remove a carrier from the

equipment.

5.1.18 X axis — the X axis is the horizontal axis from

left to right when the substrate is rotated according to

Orientation.

5.1.19 Y axis — the Y axis is the vertical axis from

bottom to top when the substrate is rotated according to

Orientation.