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SEMI E1-0697 © SEMI 1979, 2003 1 SEMI E1-0697 (Reapproved 1102) E SPECIFICATION FOR 3 inch, 100 mm, 125 mm, AND 150 mm PLASTIC AND METAL WAFER CARRIERS This specification was technically approved b y the Global Physical …

SEMI INTERNATIONAL STANDARDS

EQUIPMENT AUTOMATION HARDWARE

Semiconductor Equipment and Materials International

SEMI E1-0697 © SEMI 1979, 2003 1

SEMI E1-0697 (Reapproved 1102)

SPECIFICATION FOR 3 inch, 100 mm, 125 mm, AND 150 mm PLASTIC

AND METAL WAFER CARRIERS

This specification was technically approved by the Global Physical Interfaces and Carriers Committee and is

the direct responsibility of the North American Physical Interfaces and Carriers Committee. Current edition

approved by the North American Physical Interfaces and Carriers Committee on July 21, 2002. Initially

available at www.semi.org October 2002; to be published November 2002. Orignally published in 1979;

previously published June 1997.

E The designation of SEMI E1 was updated during the 0303 publishing cycle to reflect the editorial

modification of SEMI E1.5 via PIP form.

1 Scope

1.1 This specification covers the dimensional

requirements for plastic and metal wafer carriers used

for the processing and handling of 3 inch, 100 mm, 125

mm, and 150 mm diameter wafers. The specification

has two classifications: General Usage and Auto

Transport Usage. General Usage is a basic guideline

that covers 3 inch, 100 mm, 125 mm, and 150 mm

wafer sizes. Auto Transport Usage is intended to meet

the in-use requirements for the interface of wafer

carriers with automated wafer processing equipment.

Auto Transport Usage covers the 125 mm and 150 mm

sizes.

1.2 To meet these specifications, carriers must be

manufactured within the dimensional limits and be

dimensionally stable within the specification when used

in accordance with manufacturers’ recommendations.

1.3 This standard does not purport to address safety

issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety health practices and determine the

applicability or regulatory limitations prior to use.

NOTE 1: Recommended usage should be agreed to between

user and supplier, since wafer carriers are manufactured from

a number of different materials by several manufacturing

methods.

2 Terminology

2.1 For a pictorial explanation of most of the selected

definitions, see Figure 1. Figure 1 symbols are defined

in Table 1.

2.2 Definitions

2.2.1 bar — (See “crossbar.”)

2.2.2 bar end — The end surface of the carrier that has

only one crossbar.

2.2.3 bar radius — The radius nearest the bar end of

the carrier on the crossbar. (See Figure 1, D5b, Type

II.)

2.2.4 bar web — The mass of material for structural

support which may or may not be present on the

crossbar. (See Figure 1, D5a, Type II.)

2.2.5 bar width — The distance or thickness of the bar

when measured perpendicular to the top face. (See

Figure 1, D5b.)

2.2.6 cassette — (See “wafer carrier.”)

2.2.7 crossbar — The mass of material connecting the

two sides of the carrier at the bar end of the carrier.

2.2.8 edge perimeter distance — The distance from the

edge of the wafer to the top face of the carrier. (See

Figure 1, D7.)

2.2.9 end wall — The wall of the carrier opposite the

bar end of the carrier.

2.2.10 flange — Mass of material on the exterior and

perpendicular to the side walls.

2.2.11 hole — The area for the pin on another carrier to

enter for transferring wafers. (See Figure 1, C8.)

2.2.12 lot — (See “hole.”)

2.2.13 parallelism tolerance — The minimum and

maximum dimension allowance for the opposite

pockets to vary in relation to their distance from the

crossbar end of the carrier. (See Figure 1, D1.)

2.2.14 pin — The mass of material which enters the

hole or slot of another carrier for transferring wafer.

(See Figure 1, C7.)

2.2.15 pin and hole center distance from pocket

centerline —The distance from centerline of either the

pin or hole to the closest pocket centerline. (See Figure

1, C9.)

2.2.16 pocket — The area in which the wafer is located

in the carrier.

2.2.17 pocket centerline — The imaginary line which

bisects each pocket.

SEMI E1-0697 © SEMI 1979, 2003 2

2.2.18 pocket depth — The distance from the pocket

flat to its own pocket nose, not to the opposite pocket.

(See Figure 1, C2.)

2.2.19 pocket flat — The width of the pocket along the

vertical walls at its narrowest distance. (See Figure 1,

C3.)

2.2.20 pocket nose — The top of the mass of material

between adjacent pockets.

2.2.21 pocket nose radius — The radius on the pocket

nose.

2.2.22 pocket size — The distance between opposite

pocket flats. (See Figure 1, C4.)

2.2.23 pocket spacing — The distance between pocket

centerlines. (See Figure 1, B2.)

2.2.24 pocket width — The width of the pocket at its

widest distance. (See Figure 1, C1.)

2.2.25 top face — The plane or surface of the carrier

from which side wafers enter into or out of the carrier.

2.2.26 track clearance — The unobstructed area

between the two carrier sides on the bar end. (See

Figure 1, D6; Figure 1a, D6a, D6b, D6c.)

2.2.27 wafer carrier — A device for the holding of

wafers for various processing steps in semiconductor

manufacturing.

2.2.28 wafer tilt — The possible unparallel position of

the wafer in relation to the bar end of the carrier when

the carrier is resting on the bar end. (Not shown in

Figure 1.)

2.2.29 wafer transfer — The act of relocating wafers

from one carrier into another. This can be accomplished

by several methods.

Table 1 Symbols Outline General Usage

Figure 1

Reference

Description

Overall Dimensions

A1 Length

A2 Width (with/without flange)

A3 Height (excluding pin)

Capacity

B1 Pockets per carrier

B2 Pocket spacing

B3 Center distance from the 1st to last pocket

Detail Dimensions

C1 Pocket width

C2 Pocket depth

C3 Pocket flat

C4 Pocket size

C5 Pin and hole location (width)

C6 Pin and hole location (length)

C7 Pin diameter and height

C8 Hole or slot

C9 Pin and hole center distance from pocket

center line

Machine Fit Specifications

D1 From the outside of the bar end to the

center line of the 1st pocket

D2 From the center line of the 1st pocket to the

closest point on the crossbar or web

D3 From the bar end of the carrier to the start

of the crossbar

D4 Center of the crossbar to the top face of the

carrier

D5 Crossbar specifications

D5a Bar web width on type II crossbar, or width

of the type III crossbar

D5b Bar width

D6 Track clearance

D7 Edge perimeter distance

Not shown — Wafer Tilt