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SEMI M13-1103 © SEMI 1988, 2003 12 NOTICE: SEMI makes no warranties or representatio ns as to the suitability of th e standards set forth herein for any particular application. Th e determination of the suitability of th…

SEMI M13-1103 © SEMI 1988, 2003 11

SEMI M13-1103 © SEMI 1988, 2003 12

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacturer' s instructions, product labels, product data sheets, and other relevant

literature, respecting any materials or equipment mentioned herein. These standards are subject to change without

notice.

By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights are entirely their own responsibility.

SEMI M13-1103 © SEMI 1988, 2003 13

RELATED INFORMATION 1

NOTICE: This related information is not an official part of SEMI M13 and is not intended to modify or supercede the official

standard. The standard should be referred to in all cases. SEMI makes no warranties or representations as to the suitability of the

material set forth herein for any particular application. The determination of the suitability of the material is solely the

responsibility of the user.

R1-1 Consideration for Reliable Automatic

Reading of the Marking

R1-1.1 The following suggestions are offered to assist

in assuring the most reliable automatic reading of the

alphanumeric marking.

R1-1.2 Character Stroke Thickness — If a 5 × 9 dot

matrix is chosen for marking, it is recommended that

the minimum dot size be 0.100 mm. With a higher

density dot matrix format, smaller dot diameters may be

employed. Stroke thickness should be constant within

20% over the entire character set so that the reader

settings may be optimized from the specific wafer run.

R1-1.3 Contrast — The character should have

sufficient contrast to be legible. Contrast may be

affected by depth and other conditions.

R1-1.4 Clear Zone — It is recommended that the area

immediately beneath, and a minimum of 0.500 mm

around, the marking characters be of uniform

reflectivity and free of any lithography and process

overlay edges.

NOTICE: SEMI makes no warranties or

representations as to the suitability of the standards set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer’s instructions, product labels,

product data sheets, and other relevant literature

respecting any materials mentioned herein. These

standards are subject to change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.